集成电路封装溢料问题探讨

-13-97741000TN305.94A1681-1070200907-0013-04ConcerningonMoldFlashIssuesofICPlasticPackagingMUWei,ZHOUChao-feng,MENGHong-wei,LIXi-zhou,FENGXue-gui,LUMing-zhenTianshuiHuatianTechnologyCo.,Ltd.,Tianshui741000,ChinaAbstract:Mold-flashisakindofqualityissuewhichisusuallyfoundduringtheICplasticmoldingprocess.Howtoavoidthemold-flashandhowtodeflasharethecommonresearchsubjectforalltheassemblymoldingengineers,platingengineers,materialssuppliersandalsotoolingmanufacturers.Thispaperelaboratesonthecommoncausesofmold-flash,discussestheharmfulnessofthemold-flash,pointouthowtoavoidthemold-flashandthemethodsofdeflashing,andalsolooksforwardtothefuturedevelopmentofsuchmethods.Throughathoroughstudyofthemechanismofmold-flashgeneration,anditmakesadetailanalysisaboutmaterials,equipmentsandprocessetc.toputforwardsomeeffectiveimprovementmeasures.Inaddition,thepaperemphasizesontheeffectivenessofallkindsofdeflashingmethodsandtheirinfluenceonproductqualitybyverifiedaneffectiveassessment.Thepaperdiffersfromothersinthatitnotonlyhasamagnificentfoundationintheory,butthemostdetailedanalyticmethodsareusedinthepapertoconductanalysis,inthiscasethediscussioninthispaperismoreinstructive,andlaysatheoreticalfoundationforimprovingtheICmoldingyieldandassemblyyield.Keywords:ICplasticpackage;moldflash;improvement;prevention;deflashingmethods2009-03-0597Vol9No7ELECTRONICS&PACKAGING75200971-14-9722.111232.222.333123-15-974444.14.1.174mSiO240m50904.1.24.212355.11RR25.21P=F/S1PFS123R5.35.3.155WLd55.3.22QWd3P/L2QPWdL5.3.3231-16-9723P5.3.4116/3/1/MediaDeflashTOHSIP24OH4eO22H2O2H2eH2150A8V70Mpa~200Mpa3SolventDeflash712NiPdAu21-21-97EMC20volANSYSEMC1.[J].2001528-31.2LeeGW,ParkM,KimJY,etal..Enhancedthermalcon-ductivityofpolymercompositesfilledwithhybridfiller[J].Composites,PartA,2006,37(5):727-34.3BoltJD,ButtonDP,YostBA.Ceramic-fiber-polymercompositesforelectronicsubstrates[J].MaterialsScienceandEngineeringA,1989,109:207-211.4IshidaH,RimdusitS.Veryhighthermalconductivityob-tainedbyboronnitride-filledpolybenzoxazine[J].ThermochimicaActa,1998,320(1-2):177-186.5.BN/Nylon1010[J].2005375547-550.6.[J].2006251234-37.7LiL,ChungDDL.Thermallyconductingpolymer-matrixcompositescontainingbothAlNparticlesandSiCwhis-kers[J].JournalofElectronicMaterials,1994,23(6):557-564.8ChenYM,TingJM.Ultrahighthermalconductivitypoly-mercomposites[J].Carbon,2002,40(3):359-362.9.ANSYS[M].2003.1-2.10.[J].2008406853-857.11GravesRS,KollieTG,McElroyDL,etal.ThethermalconductivityofAISI304Lstainlesssteel[J].InternationalJournalofThermophysics,1991,12(2):409-415.1984-1[]RaoR.TunundlaEymaszewekiKiang.Kopfenstein.[M]..2001.1945-197016VLSIResearch2009ATEVLSIResearchATE