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电子元器件封装图示大全LQFP100LMETALQUAD100LPQFP100LQFPQuadFlatPackageQFPQuadFlatPackageTQFP100LRIMMRIMMForDirectRambusSBGASC-705LSDIPSIMM30SIMM30PinoutSIMM30SingleIn-lineMemoryModuleSIMM72SIMM72PinoutSIMM72SingleIn-lineMemoryModuleSIMM72SingleIn-lineMemoryModuleSIPSingleInlinePackageSLOT1ForintelPentiumIIPentiumIII&CeleronCPUSLOTAForAMDAthlonCPUSNAPTKSNAPTKSNAPZPSODIMMSmallOutlineDualIn-lineMemoryModuleSOSmallOutlinePackageSOCKET370Forintel370pinPGAPentiumIII&CeleronCPUSOCKET423Forintel423pinPGAPentium4CPUSOCKET462/SOCKETAForPGAAMDAthlon&DuronCPUSOCKET7ForintelPentium&MMXPentiumCPUSOHSOJ32LSOJSOPEIAJTYPEII14LSOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89SSOP16LSSOPSocket603FosterLAMINATETCSP20LChipScalePackageTO18TO220TO247TO252TO263/TO268TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageLAMINATEUCSP32LChipScalePackageuBGAMicroBallGridArrayuBGAMicroBallGridArrayVLBusVESALocalBusXTBus8bitZIPZig-ZagInlinePackageGullWingLeadsHSOP28ISAIndustryStandardArchitectureITO220ITO3pJ-STDJ-STDJointIPC/JEDECStandardsJEPJEPJEDECPublicationsJESDJESDJEDECStandardsJLCCLCCLDCCLGALLP8LaLQFPPCDIPPCI32bit5VPeripheralComponentInterconnectPCI64bit3.3VPeripheralComponentInterconnectPCMCIAPDIPPGAPlasticPinGridArrayPLCCPQFPPS/2PS/2mouseportpinoutPSDIPDIMM168DIMMDDRDIMM168DualIn-lineMemoryModuleDIMM168DIMM168PinoutDIMM184ForDDRSDRAMDualIn-lineMemoryModuleDIPDualInlinePackageDIP-tabDualInlinePackagewithMetalHeatsinkEIAEIAJEDECformulatedEIAStandardsEISAExtendedISAFBGAFDIPFTO220FlatPackAC'97AC'97v2.2specification详细规格AGP3.3VAcceleratedGraphicsPortSpecification2.0详细规格AGPPROAcceleratedGraphicsPortPROSpecification1.01详细规格AGPAcceleratedGraphicsPortSpecification2.0详细规格AMRAudio/ModemRiserAX078AX14C-BendLeadCERQUADCeramicQuadFlatPackCLCCCNRCommunicationandNetworkingRiserSpecificationRevision1.2CPGACeramicPinGridArrayCeramicCaseLAMINATECSP112LChipScalePackageBGABallGridArrayEBGA680LLBGA160LPBGA217LPlasticBallGridArraySBGA192LTSBGA680LCLCCCNRCommunicationandNetworkingRiserCPGACeramicPinGridArrayDIPDualInlinePackageDIP-tabDualInlinePackagewithMetalHeatsinkFBGAFDIPFTO-220FlatPackHSOP-28ITO-220ITO-3PJLCCLCCLDCCLGALQFPPCDIPPGAPlasticPinGridArrayPLCCPQFPPSDIPLQFP100LMETALQUAD100LPQFP100LQFPQuadFlatPackageSOT143SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89Socket603FosterLAMINATETCSP20LChipScalePackageTO252TO263/TO268QFPQuadFlatPackageTQFP100LSBGASC-705LSDIPSIPSingleInlinePackageSOSmallOutlinePackageSOJ32LSOJSOPEIAJTYPEII14LSOT220SSOP16LTO247SSOPTO18TO220TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageuBGAMicroBallGridArrayuBGAMicroBallGridArrayZIPZig-ZagInlinePackageBQFP132C-BendLeadCERQUADCeramicQuadFlatPackCeramicCaseLAMINATECSP112LChipScalePackageGullWingLeadsPDIPPLCCSNAPTKSNAPTKSNAPZPSOHAGP3.3VAcceleratedGraphicsPortSpecification2.0详细规格AGPPROAcceleratedGraphicsPortPROSpecification1.01详细规格AGPAcceleratedGraphicsPortSpecification2.0详细规格AMRAudio/ModemRiserAX078AX14BGABallGridArrayBQFP132EBGA680L详细规格LBGA160L详细规格PBGA217LPlasticBallGridArray详细规格SBGA192L详细规格TEPBGA288LTEPBGA288L详细规格TSBGA680L详细规格C-BendLeadCERQUADCeramicQuadFlatPackCLCCCNRCommunicationandNetworkingRiserSpecificationRevision1.2详细规格CPGACeramicPinGridArrayCeramicCaseLAMINATECSP112LChipScalePackage详细规格DIMM168详细规格DIMMDDR详细规格DIMM168DualIn-lineMemoryModule详细规格DIMM168DIMM168Pinout详细规格DIMM184ForDDRSDRAMDualIn-lineMemoryModule详细规格DIPDualInlinePackage详细规格DIP-tabDualInlinePackagewithMetalHeatsinkEIAEIAJEDECformulatedEIAStandardsEISAExtendedISA详细规格FBGAFDIPFTO220FlatPackGullWingLeadsHSOP28ISAIndustryStandardArchitectureITO220ITO3pJ-STDJ-STDJointIPC/JEDECStandardsJEPJEPJEDECPublicationsJESDJESDJEDECStandardsJLCCPCDIPPCI32bit5VPeripheralComponentInterconnect详细规格PCI64bit3.3VPeripheralComponentInterconnect详细规格PCMCIAPDIPPGAPlasticPinGridArray详细规格PLCC详细规格PQFPPS/2PS/2mouseportpinoutPSDIPLQFP100L详细规格METALQUAD100L详细规格PQFP100L详细规格QFPQuadFlatPackageQFPQuadFlatPackageTQFP100L详细规格SBGASC-705L详细规格SDIPSIMM30SIMM30Pinout详细规格SIMM30SingleIn-lineMemoryModuleSIMM72SIMM72Pinout详细规格SIMM72SingleIn-lineMemoryModuleSIMM72SingleIn-lineMemoryModuleSIPSingleInlinePackageSLOT1ForintelPentiumIIPentiumIII&CeleronCPUSLOTAForAMDAthlonCPUSNAPTKSNAPTKSNAPZPSODIMMSmallOutlineDualIn-lineMemoryModuleSOSmallOutlinePackageSOCKET370Forintel370pinPGAPentiumIII&CeleronCPUSOCKET423Forintel423pinPGAPentium4CPUSOCKET462/SOCKETAForPGAAMDAthlon&DuronCPUSOCKET7ForintelPentium&MMXPentiumCPUSOHSOJ32L详细规格SOJSOPEIAJTYPEII14L详细规格SOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353SOT26/SOT363SOT343SOT523SOT89SOT89SSOP16L详细规格SSOPSocket603FosterLAMINATETCSP20LChipScalePackage详细规格TO18TO220TO247TO252TO263/TO268TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThinSmallOutlinePackageTSSOPorTSOPIIThinShrinkOutlinePackageLAMINATEUCSP32LChipScalePackage详细规格uBGAMicroBallGridArrayuBGAMicroBallGridArrayVLBusVESALocalBusXTBus8bitZIPZig-ZagInlinePackage
本文标题:电子元器件封装图示大全
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