电子辅料的选用修改

www.rac.ceprei.com„„www.rac.ceprei.com„„„„www.rac.ceprei.com2.1„www.rac.ceprei.com2.1.1COOHH3CCH3CH(CH3)2(165-170mgKOH/)172-175oC2C19H29COOH+MeO(C19H29COO)2Me+H2Owww.rac.ceprei.com2.2)))www.rac.ceprei.com2.2.1——0.2~0.3nm3~4nm1~10m1~2mwww.rac.ceprei.com2.3„„„„„„„„„SIR„www.rac.ceprei.comwww.rac.ceprei.comwww.rac.ceprei.com2.4„„GB9491-88JISZ319786QQS571MILF14256IPCSF818„„GB31318800JISZ32838699„GB/T15829.2-1995„J-STD-004(RequirementsforSolderingFluxes)www.rac.ceprei.com2.5()FluxMaterialsofComposition()/FluxActivityLevels(%Halide)/FluxType()FluxDesignatorRosin(RO)Low(0.0%)L0ROL0Low(0.5%)L1ROL1Moderate(0.0%)M0ROM0Moderate(0.5~2.0%)M1ROM1High(0.0%)H0ROH0High(2.0)H1ROH1Resin(RE)Low(0.0%)L0REL0Low(0.5%)L1REL1Moderate(0.0%)M0REM0Moderate(0.5~2.0%)M1REM1High(0.0%)H0REH0High(2.0)H1REH1Organic(OR)Low(0.0%)L0ORL0Low(0.5%)L1ORL1Moderate(0.0%)M0ORM0Moderate(0.5~2.0%)M1ORM1High(0.0%)H0ORH0High(2.0)H1ORH1Inorganic(IN)Low(0.0%)L0INL0Low(0.5%)L1INL1Moderate(0.0%)M0INM0Moderate(0.5~2.0%)M1INM1High(0.0%)H0INH0High(2.0)H1INH1www.rac.ceprei.com2.5.1()()SIR100M(Cl,Br)(F)(Cl,Br,F)L00.0%L10.5%M050%0.0%M10.5~2.0%H050%0.0%H12.0%www.rac.ceprei.com2.6.1JSTD004JSTD0041L0R2“”3RMA4L1RMA5RA6M0RA7“”8M1RARSA9H010H1RSA11www.rac.ceprei.com2.6.2„Class1„Class2„Class3„ANSI/JSTD001Cwww.rac.ceprei.comRosin(RO)Resin(RE)Organic(OR)Rosin(RO)Resin(RE)Organic(OR)1L0,L1,M0,M1,H0,H1L0,L1,M0,M1L0,L1,M0,M1L0,M02L0,L1,M0,M1L0,L1,M0,L0,L1,M0,L0,M03L0,L1L0,L1L0,L1L02.6.3www.rac.ceprei.com3.1-••1.•2.•3.•4.www.rac.ceprei.com3.2www.rac.ceprei.com3.2.1Sn60www.rac.ceprei.com3.3„„„„„„„GaP„„„„„www.rac.ceprei.com3.4„„7„„„„www.rac.ceprei.com0.3~0.8,0.8~2.52.5~6.0I:1.0(0.80~1.5)II:2.0(1.5~2.6)II:3.0(2.6~3.9)RAARMAARABAA(S)A(A)B(B)4Snx-Pbywww.rac.ceprei.com4.3www.rac.ceprei.com4.4.110/10.81.221.01.231.22.0www.rac.ceprei.com4.4.2„8„9„10„2%,13„„www.rac.ceprei.com8GB31312001,,S-Sn95Pb183224_,,S-Sn90Pb183215_S-Sn65Pb1831860.122,,,,S-Sn63Pb1831830.141S-Sn60PbS-Sn60PbSb1831900.145S-Sn55Pb1832030.160,(,,),S-Sn50PbS-Sn50Pbsb1832150.181www.rac.ceprei.com9RAARMAARABwww.rac.ceprei.com5.1„„„„,.www.rac.ceprei.com5.2(solderpaste)www.rac.ceprei.com5.2.185-90%50-60%——www.rac.ceprei.com5.2.2)(FromQualitekInc.)www.rac.ceprei.com5.2.3)www.rac.ceprei.com5.3.2-+3.10.63mm0.5mmwww.rac.ceprei.com5.2.4),),)(),),,0∼5°C3∼6),12∼14),)www.rac.ceprei.com5.3ANSI/J-STD-005(Requirementsforsolderingpastes)IPC(TheInstituteofInterconnectingandPackagingElectronicCircuit)IPC-TM-650(TestMethodManual)JIS(JapaneseIndustrialStandard)Z-3197ANSI/J-STD-006ANSI/J-STD-004IPC-SF-818www.rac.ceprei.com5.3.190%-1.0-1.07-1.51%80%10%1160150150-75202807575-45203504545-25201%90%10%4403838-20205302525-15156201515-55()65-96wt.%±1%www.rac.ceprei.com5.3.2(Viscosity)(centipoise)=mPas;kcps=PasPCB±10%50-300300-1600PasIPC-TM-6502.4.34www.rac.ceprei.com5.3.2(slump)IPCThespreadingofapasteafterprinting()www.rac.ceprei.comSlump22()//(1)25±5oC50±10%10-20(2)150±10oC10-15www.rac.ceprei.com(IPC-A-20)0.1mm0.332.03mm0.202.03mmSlump01www.rac.ceprei.com(IPC-A-21)0.2mm0.632.03mm0.332.03mmSlump02www.rac.ceprei.com5.2.3(slump)0.20.63×2.03mm10.56mm0.20.63×2.03mm20.63mm0.20.33×2.03mm10.25mm0.20.33×2.03mm20.30mm0.10.33×2.03mm10.25mm0.10.33×2.03mm20.30mm0.10.20×2.03mm10.175mm0.10.20×2.03mm20.20mmwww.rac.ceprei.com5.3(solderball)IPCAsolderingprocessresidueconsistingofsmallspheresontheprintedcircuitboardsurface()12,375µm3,375µm,4,1242www.rac.ceprei.com5.3(tack/tackiness)IPCTheabilityofsolderpastetoholdcomponentsinplaceafterplacement()6.515MalcomFG-150g0.2mm/10mm/()02468162448(g)125118110104100908580www.rac.ceprei.com5.3„„„„www.rac.ceprei.com5.4„„PCB„SMTSn63Pb37Sn62Pb36Ag2„or„„www.rac.ceprei.com5.4.2(1)(2)(µm)Type350µm350µm=150µm=0.150mm0.63mm(25thou)0.32mm(12.5thou)6thou3