绿色电子产品和无铅制造绪论(1)(1)

1&2z“”23zzz…41zzzz¾“”3562zz“”“”501001400z...47¾¾¾¾¾¾¾¾¾¾¾¾¾¾8¾¾¾¾–¾¾¾¾59:01102003127RoHSWEEERoHS:RestrictionofHazardousSubstancesWEEE:WasteElectricandElectronicEquipment2004727RoHSWEEE2005813WEEE200671RoHS20061231WEEE611RoHSHOMOGENEOUSMATERIALS‹Lead(Pb)0.1%byweight‹HexavalentChromium(Cr6+)0.1%byweight‹Mercury(Hg)0.1%byweight‹PBB,PBDE0.1%byweight‹Cadmium(Cd)0.01%byweight…12WEEE123IT342006RecoveryRate)75%(RecycleRate)65%456713123IT45678910RoHSWEEE14WEEE120058132200612313“”200581342005813“”52005813“”815Rohsz20042242004305200671116RoHSzRoHSzRoHS917RohszEURoHS20031272006715zHomeElectronicsRecycleLaw20014zEPAToxicsReleaseInventory200111000.10.12.518z0.1%(1000ppm)zPbRoHSzForthepurposesoftheEURoHS,aMCVofuptothefollowingvaluesin‘HOMOGENEOUSMATERIALS’forPb,……willbepermittedinthemanufactureofnewEEE(electricalandelectronicequipment)zLead(Pb)0.1%byweight1019Pb0.1a.b.c.d.PbPb/1000.1%20zLeadinsoldersforservers,storageandstoragearraysystems(exemptiongranteduntil2010).zLeadinsoldersfornetworkinfrastructureequipmentforswitching,signaling,transmissionaswellasnetworkmanagementfortelecommunication.zLeadinelectronicceramicparts(e.g.,piezoelectronicdevices).zLeadinhighmeltingtemperaturetypesolders(i.e.,SnPbsolderalloyscontaining85wt%Pb).zLeadinglassofcathoderaytubes,electroniccomponentsandfluorescenttubes.zLeadasanalloyingelementinsteelcontainingupto0.35wt%Pb,aluminumcontainingupto0.4wt%Pbandascopperalloycontainingupto4wtPb.RoHS2003.2.13Pb(TechnicalAdaptationCommittee)TACTACEUCommissioner.TACTAC15theTAC.TACTACvotingpower.GermanyandUnitedKingdomEU22ConsumerProductsMonitoring,Control,MedicalProducts1223(1)(2)(3)•••••¾¾¾24(%)z80.81z4.78()z4.69z1.79z1.40z1.13z0.72z0.72z()0.70z0.49z2.77z:AdvancingMicroelectronics,September/0ctober1999.(Totalexempted93%)5001325RohsWEEERohs“”¾*ImpactsofLead-FreeSolderingonDesigns¾*ImpactsofLead-FreeSolderingonMaterials¾*ImpactsofLead-FreeSolderingonProcess¾*ImpactsofLead-FreeSolderingonReliability¾*ImpactsofLead-FreeSolderingonPCBs¾*ImpactsofLead-FreeSolderingonComponents¾*ImpactsofLead-FreeSolderingonSolderJoints“”26¾¾¾¾¾¾¾¾¾¾DesignforEnvironment1427:„„„¾¾28z¾¾PCB¾1529zPCBz(wetting)zz(dentritic)zz30zFluxFluxzzzSMTzz……zzPCBENIGAgzOSP1631zzzz32PCBzTgGlassTransitionTemperaturezTdDecompositionTemperaturePCB10PCB173334PCBSn63Pb37Sn3.0Ag0.5Cu24552605PCBENIGAgOSP1835zzz36BGAzz1937BGASMTz38zXrayBGAThicknessBGABGA2039zAOIAOISOPChipSMT40z21412030PCBSMTPb42255020100515SMT010BGA515PCB60701100130501(SnAgCu)Sn37Pb)22430.5zzzPCBA2432521.04763200.510013400SnAgCu44¾¾¾¾¾¾¾¾CABCBA23451.02.15.05100ºC3.38.613.01320ºCN/mm20.1mm/min14162117100ºC2323202720ºC,N/mm20.1mm/min36.529.863.8(20ºC)(0.1mm/min)404848(20ºC),N/mm2:0.004s–11715,HBSn-37Pb(eutectic)Sn-0.7Cu(“Alloy99C”*)Sn-3.8Ag-0.7Cu@Sn-3.5Ag-0.7Cu46tinwhisker10mm2447zRoHS-EURestrictiononHazardousSubstancesz://www.nemi.orgzHDPUG-HighDensityPackageUsersGroupz://www.jedec.orgzIPC-AssociationConnectingElectronicsIndustriesz://www.jeita.org48AcceptabilityofElectronicAssembliesIPC-A-610Marking,SymbolsandLabelsforIdentificationofLead(Pb)FreeAssemblies,ComponentsandDevicesJEDECNewStandardSymbolAndLabelsForMoisture-SensitiveDevicesJEDECJEP113PreconditioningOfPlasticSurfaceMountDevicesPriorToReliabilityTesting:JEDECJESD22-A113StandardforHandling,Packing,ShippingandUseofMoisture/ReflowSensitiveSurfaceMountDevicesJ-STD-033PerformanceStandardforFlipChip/ChipScaleBumpsJ-STD-028Moisture/ReflowSensitivityClassificationforNon-HermeticSolidStateSurfaceMountDevicesJ-STD-020RequirementsforElectronicGradeSolderAlloys&Fluxed&Non-FluxedSolidSoldersforElectronicSolderingApplicationsJ-STD-006RequirementsforSolderingPastesJ-STD-005SolderabilityTestsforComponentLeads,Terminations,Lugs,TerminalsandWiresJ-STD-002RequirementsforSolderedElectricalandElectronicAssembliesJ-STD-001152549…