W公司的物流外包策略研究

上海交通大学硕士学位论文W公司的物流外包策略研究姓名：袁海申请学位级别：硕士专业：工商管理指导教师：徐丽群20070128WWIC3PLICICIC,ICICICICIC:3PLTHERESEARCHONBUSINESSTACTICOFLOGISTICSOUTSOURCINGOFWCOMPANYABSTRACTThisarticle,thefundamentalcontentsofWcompany’slogisticsandstrategymanagementareintroducedthebasicsituationofICmanufacturerlogisticsanalyzedcompletely,thelogisticsoutsourcestrategyofICmanufactureenterprisesisconstructedbasedonthelogisticsoutsourceanalysis.ICmanufacturingindustrynowfacecomplexlogisticenvironmentduetothehigh-speedICproductsup-to-date,highunitpriceforrawmaterial&products,multiplicityafter-salessparepartspreparation.HowtooptimizethesupplychaintomeetthedemandforICmanufacturingandimprovethecorecompetitionability,alreadybecomeadifficultproblemthatICmanufacturermustsolve.ICmanufacturermustfocusoninnovation,developthecorecompetitionabilityforimportantbusiness,outsourcingthelessimportantbusiness.OutsourcingbecomeatrendforICmanufacturer.KEYWORDS:ICindustry,ICmanufactureThird-partylogisticsLogisticsoutsourcing200712820071282007128MBAW11.1LogisticsOutsourcing(3PL)23.33%26.9%34.4%12.77%18%20%(thirdpartylogistics)901.1FIGURE1-1ProfitEnlargePhase?MBAW21990UPS15901993:1.279%27%58%43%82%19.8%64%:62%72%2005201022.5%ICICICMBAW3IC1.2IC20604018300mm20WIC1.3WIC3PLICICICIC:WMBAW4ICICICMBAW5W2.1W2.1.1WW1987WW630002.1.2WWMMW241,20010,000IC2.1.3WW70%/10MBAW6WICW2.2IC2.2.1IC1ICICIC2207040209070018m300mm202012005m4572mm2003200601m2520mm27~8400009~12V2~25GHz1602010007m64GDRAMDRAM305618621164ICICIBMIDMIC(Foundry)ICMBAW75IC2.2.2IC1IC812232.2.3IC(1)JITJIT(Just-In-Time)JITJITJIT4%15%(2)MBAW8(3)(4)2.3WWICTOMTotalOrderManagementSAPINIMPORTNOTIFYSYSTEMREAFWIC2.3.1WWMBAW980Foundry()2.3.2(1)(2)POD6SIGMAMBAW10(3)MBAW113.1Outsourcing,,80,IBMPCPCIBMPC3.1.1(1)23MBAW1243.1.23.1.3:123MBAW13453.2LogisticsOutsourcing21LogisticsOutsourcing(3PL)LogisticsOutsourcing3.2.13PLMBAW14:::1;2;3;4:,:3.2.2;:3.2.3)21:MBAW15INTERINET:;():::;;;;3.33.3.158%29%8%4%1%MBAW163.3.2(1)(2)MBAW17(3)(4)MBAW183.43.4.13.4.2MBAW1940003.4.3MBAW203.5:12MBAW21IC4.1IC(3PL)OEMEMSIC6%20%200650%EDIEMS4.2IC4.2.1IC(Semiconductor)(Transistor)(Diode)(InteratedCircuit;IC)ICICIC(1)ICICIC65%IC90%10%(2)ICICIC25%(3)ICICIC10%4.2.1ICICICICICMBAW22IC4.2.1ICFIGURE4-2-1ICManufactureProcess(1)ICICICICIC(Cell)ICcellICICcellcellIP(IntellectualProperty;)ICMBAW23(2)ICIC(DiffusionFurnace)(Photoresist)IC(Photo)IC(Lithography)IC(WaferStepper)3864MDRAM232364MDRAM46(3)IC4.2.2IC4.2.2FIGURE4-2-2CostofICFoundryIndustryMBAW244.2.210%.CZSiCZSi8200mmSi12300mmIC’s184141827ICSSOISmartcutSIMOX30nmMOSSiO2KSi3N4SiO2KCuAlULSIDNAGaAsInPGeSi5spin-on0.11-0.0654.2.3ICIC2060401890nm10-kkMBAW25k200mm300mm300mm2.25300mm204.2.4ICICIBMICICICICICICICICMBAW26IC,ICCPU4.34.3.1ICICICMBAW274.3.2ICMBAW28W5.1W5.1.1IC.PCLCDIC5.1.2,5-1--------------------------------------1.------~90%----------~50%-----------.2-------------------------------------3.------------------------------4---------------------------------------5------------------------------MBAW295.25.2.1l23455.2.2MBAW305.3W5.3.1~5W5.3.2()FTPserverW5.1FIGURE5-1VMIProcessFlowMBAW32CONSIGNMENTWW5.2FIGURE5-2ConsignmentProcessFlowWVMICONSIGNMENTWWMBAW335.4W5.4.1(1)/HH4H72468(2)90%5%-10%5510%MBAW345.4.2ICIDM20058()(5)90%IC5%15%35.4.3W(1)WWICWWICTimetoMarketTimeToRevenue30120MBAW35IC(2)ICCodeDIEWaferLotBinWaferCycleTimeYieldRateYieldRateDieMBAW366.1:;;MBAW376.2PCMBAW386.33PLIC3PL(1)(2)(3)partnership,truck,profitsharing,informationsharingMBAW39[1]..,2005[2]..1:2002[3]..1:1995[4]...:2001[5]..1:2001[6].l.:2000[7]1:2002[8].1:2003[9]1:2003[10].1.:2002[11].1:2000[12].1:2001[13]1.:2000[14]..:2001[15]...:2004[16]:.:2004[17]..:2000[18]...2003(15)[19]1.:2002[20].1.:2002[21].1:2001[22]..1.:1997[23][10]1:1999[24]D.J.Bowersox,DICloss.:1.:1999[25]RobertA.Novack.CreatingLogisticsValue-ThemesfortheFuture.CouncilofLogisticsManagement,1995[26]JamesF.Robeson,WilliamC.Copacino.TheLogisticsHandbook,theFreePress,1995[27].L.2002[28]...2003(13)[29]..2003(11)[30].2003(16)MBAW40[31].2003(13)[32]MichaelQuirk,JulianSerda.2004[33]!200611MBAW42[1]..200695859W公司的物流外包策略研究作者：袁海学位授予单位：上海交通大学相似文献(2条)1.会议论文宇都宫.久修最新嵌入式印制线路板技术·标准化的动向2008微细化与功能的多样化,对于电子行业来讲是最强有力的开发驱动,印制线路板是电子类组装的共同支撑平台.现在的印制线路板应用刚性或者挠性的高分子基材、以及陶瓷等材料,带有单面或者多层的线路.此外,半导体制造用硅片、液晶使用的玻璃基板,将有希望成为下一代的支撑基板.印制线路板的被动元件嵌入技术种类多,可以从不同类型的印制线路板制造企业那儿得到.在本演讲中我会提及其中的几项技术.本演讲将对由柏林工科大学研发的使用压层芯片的嵌入技术,即欧洲的开发项目SHIFT和HIDINGDIES框架以及日本开发的嵌入主动元件/被动元件的电子电路基板进行说明.由于现在的PCB制造厂商的印制线路板制造工艺几乎都是共通的,因此这两种技术都已经被采用,并且已步入商业化生产.元件嵌入式电子电路基板要求对传统的印制线路板制造进行范示转换,从单一的线路板提升到包括功能块和辅助系统的电路基板.对印制线路板行业来讲能否应对这个崭新的技术时代是一项很大的挑战。换一种讲法,也就是印制线路板行业从传统的供应链中获取附加价值的良好机会.虽然有待解决的课题很多,但为了让印制线路板行业积极投入元件嵌入式电子电路基板的商业化生产,来自材料制造商和设备制造商的合作以及电子仪表厂商和半导体厂商的理解是不可或缺的.此外,来自最终用户的理解与使用也是推动元件嵌入式电子电路基板技术健康发展的重要因素.要增进相关行业对于元件嵌入式电子电路基板技术的商业化生产的理解,并获得他们的支持,标准化是必不可少的.为此,日本电子组装协会(JIEP)和日本电子电路工业会(JPCA)组成了标准化委员会,并展开了一系列活动,终于在2008年6月出台了世界首个关于主动元件嵌入式电子电路基板的标准.本文将说明JPCA和IPC为了提高相对成本效益和向市场推广元件嵌入式电子电路基板技术而实施的规格标准化.2.学位论文李木子DRAM器件制造的新工艺