世界半导体生产机台安全设计验收标准(doc 106)英文

GlobalSemiconductorSafetyServices,LLCSEMIS2-93AProductSafetyAssessmentFinalReport世界半导体生产机台安全设计验收标准AppliedMaterialsChemicalMechanicalPolishingSystemModel:MirraTrakCMP工艺应用材料Preparedfor:AppliedMaterials3111CoronadoDriveSantaClara,CA95054Preparedby:GlobalSemiconductorSafetyServices,LLC1313GenevaDriveSunnyvale,CA94089GS3JobNo.980029GS3DocumentNo.980029F2Client-Confidential保密合约TheinformationusedtopreparethisreportwasbasedoninterviewswithAppliedMaterials’engineers.TheinformationwasalsobasedoninspectionsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak.ThisinformationwasgatheredovertheperiodbetweenFebruary2,1998andFebruary4,1998,andduringare-inspectionofthesystemonJune3,1998.ApreliminaryassessmentofthesystemwasalsoperformedonSeptember25,1996throughSeptember26,1996andtheresultsofthisevaluationwerealsoused.AllobservationsandrecommendationsarebasedonconditionsanddescriptionsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak,duringthetimeofdatacollectionanduponinformationmadeavailabletoGlobalSemiconductorSafetyServices.Thisreport'ssignificanceissubjecttotheadequacyandrepresentativecharacteristicsoftheChemicalMechanicalPolishingSystem,Model:MirraTrak,andtothecomprehensivenessofthetests,examinationsand/orsurveysmade.ReferencetoGlobalSemiconductorSafetyServices,includingreproductionofGlobalSemiconductorSafetyServices’servicemark,inpromotionalmaterials,ispermittedonlywithGlobalSemiconductorSafetyServices’expresswrittenconsent.Theserviceperformedhasbeenconductedinaccordancewiththestandardscurrentlyacceptedinourprofession,andatthehighlevelofskillandcareexercisedbyGlobalSemiconductorSafetyServices’staff.Lastly,thisreporthasbeenpreparedasaClient-Confidentialdocument,intendedfortheexclusiveuseofAppliedMaterialsandforthepurposeofdocumentationtoSEMIS2-93A.Therefore,nooutsidedistributionwilloccurunlesswrittenauthorizationisprovidedbytheclient.TABLEOFCONTENTS目录SectionPageNo.Section1.0MANAGEMENTSUMMARY(管理摘要)............................................................1Section2.0SCOPE(范围).................................................................................................................2Section3.0SYSTEMDESCRIPTION(系统描述).........................................................................4Section4.0ASSESSMENT&TESTINGMETHODOLOGIES(试验方法)...............................5Section5.0SAFETYASSESSMENT(安全评估)..........................................................................75.1PURPOSE(目的)95.2SCOPE(适用范围)105.3SAFETYPHILOSOPHY(安全体系)115.4GENERALGUIDELINES(指导方针)135.5SAFETY-RELATEDINTERLOCKS(安全互锁)185.6CHEMICALS(化学品)225.7IONIZINGRADIATION255.8NON-IONIZINGRADIATION265.9NOISE(噪音)275.10VENTILATIONANDEXHAUST(通风与排凤)285.11ELECTRICAL335.12EMERGENCYSHUTDOWN(紧急停机)415.13HEATEDCHEMICALBATHS445.14HUMANFACTORSENGINEERING455.15ROBOTICAUTOMATION515.16HAZARDWARNING(危险警告)525.17EARTHQUAKEPROTECTION(地震警告)535.18DOCUMENTATION(文件)565.19FIREPROTECTION(消防保护)595.20ENVIRONMENTALGUIDELINES(环境方针)61Section6.0RECOMMENDATIONS................................................................................72Section7.0-ILLUSTRATIONS..........................................................................................75ILLUSTRATION1-MirraTrakSystemLayout76ATTACHMENTONE-SURFACELEAKAGECURRENTTEST(泄漏测试)........................77ATTACHMENTTWO-GROUNDINGRESISTANCETEST(接地电阻测试)......................79ATTACHMENTTHREE-VERIFICATIONOFEMO(紧急按钮确认).....................................81ATTACHMENTFOUR-SOUNDPRESSURELEVELSURVEY(声压测试).......................83ATTACHMENTFIVE-ERGONOMICCHECKLIST(人体功力检查表)..................................85ATTACHMENTSIX-MANUALHANDLINGLIFTANALYSIS(手动操作分析)....................94ATTACHMENTSEVEN-揥HAT-IF?”HAZARDANALYSIS(危险分析)...........................97ATTACHMENTEIGHT-SEMIS10-1296RISKASSESSMENTGUIDELINEMETHODOLOGY...................................................................................................101CONCLUSION.................................................................................................................106AppliedMaterials,Model:MirraTrakSEMIS2-93AProductSafetyAssessmentSection1.0Section1.0MANAGEMENTSUMMARYAfollow-upsafetyassessmentoftheAppliedMaterials’ChemicalMechanicalPolishingSystem,Model:MirraTrak(hereafterreferredtoastheMirraTrak),wasperformedfromFebruary2,1998throughFebruary4,1998.Afurtherre-inspectionofthesystemwasperformedonJune3,1998.ApreliminaryevaluationofthesystemwasalsoperformedonSeptember25,1996throughSeptember26,1996,andtheresultsofthisevaluationwerealsoutilizedinthisreport.Notethatthisreportcoversonlytheconcernsraisedbyintegratingthreeseparatesystems,theAppliedMaterialsFABSandMirraCMP,andtheOnTrakSynergyIntegra,whichtogetherformtheMirraTraksystem.Forfurtherinformationconcerningtheindividualcomponents,referencetheindividualSEMIS2-93Areportsfortheseunits.(GS3ReportNo.970668TF,datedJanuary30,1998fortheFABSsystem;GS3ReportNo.7-0100,datedSeptember2,1997fortheMirraCMPsystem;andGS3ReportNo.980094F,fortheOnTrakSynergyIntegra.)ThisreviewwasperformedusingthecriteriaestablishedbytheSemiconductorEquipmentandMa