pCB制造工艺

(Circuit)PCB1.22.1936DrPaulEisnerPCBprint-etch(photoimagetransfer)1.3PCBPCB1.3.1PCBA.a./PolyamideBT/Epoxyb.CopperInver-copperceramicB.a.RigidPCBb.FlexiblePCB1.3c.Rigid-FlexPCB1.4C.a.1.5b.1.6c.1.7D./////,1.8BGA.PCB1.3.2A.1.91(Assembly)Turn-KeyDrawing,Artwork,SpecificationPCB:1234(5)6Micro-ModifierCAM(ComputerAidedManufacturing)DFM(DesignForManufacturing)output2.2.AGerberfilePCBCAD1960GerberScientificGerberSystemCADOutputDataDrawingFilmGerberFormatB.RS-274DGerberFormatEIASTANDARDRS-274D(ElectronicIndustriesAssociation)1.FunctionCodeGcodes,Dcodes,Mcodes2.CoordinatedataimagingC.RS-274XRS-274DRS-274DCodeRS-274XParameters2://(EngineeringChangeOrder)..D..30~60%LayoutPCBLayoutPANELa.b.PANELc.pieced..e.,2.3.3A.(FlowChart):..2.32.4B.CAD/CAM4~60%LayoutPCBLayoutPANEL1.2.PANEL3.piece4..55://:,,,,.3.1.ResinGlassfiber(Copperfoil)Compositematerial.3.13.1.1Resin3.1.1.1,PhoneticEpoxyPolyamidePolytetrafluorethylenePTFETEFLONBBismaleimideTriazineBTThermosettedPlasticResin3.1.1.2PhenolicResinphenolFormaldehydeFormalinCrosslinkage3.11910Bakelite7(NEMA-NationlElectricalManufacturersAssociation),NEMAXXXPPunchableCcoldpunchableFR(FlameRetardent)(Flameresistance)XXXPCFR-225,.062in:Aa.XPCGradeUL94XPCGradeHBb.FR-1GradeXPCGradeXPCGradeVTRUL94FR-1V-0V-1V-2V-0c.FR-2GradeFR-1FR-1FR-1FR-2,FR-2FR-1B.a.FR-4PCB.b.FR-4(SilverPaste)FR-4b-11)XY()Z()2)FR-4FR-1XPCFR-1XPC.8)2)3)(SilverMigration)c.(CarbonThroughHole).PCB.CarbonPasteKeyPadXPC0.81.01.2mmd.40Pitch1.78mmICe.(Anti-Track)2.1.2EpoxyResinVarnish)A-stageB-stageprepreg,C-stage2.1.2.1BisphenolAEpichlorohydrindicy(Flammabilitytest),Tetrabromo-BisphenolAFR-4:--BisphenolA,Epichlorohydrin9()-DicyandiamideDicy(Accelerator)--Benzyl-Dimethylamine(BDMA)2-Methylimidazole(2-MI)--Ethyleneglycolmonomethyether(EGMME)Dimethyformamide(DMF)Acetone,MEK(Additive)--Tg.A.(DifunctionalEpoxyResin),3.2.3.3.NEMAFR-4(NEMAG-10)B.()Dicey,(latent),160B-stageDicey(Hygroscopicity)dicey,,.C.epoxydiceyBDMA2-MID.Tg,FR4Tg115-120,,,,Tg,TgTg,a.XYb.Zc.Tg.,Tg10(MultifunctionalEpoxy)FR4A.NovolacNovolac,NovolacEpoxyNovolacs3.4.FR4,Tg,(Smear)PTHB.TetrafunctionalEpoxyFR4(TetrafunctionalEpoxyResin).,3.5TgNovolacPolycladNovolac1602-4,,,.,FR4.3.1.2.3Polyimide(PI)A.BismaleimideMethyleneDianiline,3.6.B.FR4Tg120FR4180-190260.PI,FR411:a.UL94V-0b.c.(Hygroscopic),d.(Varnish,,),e.FR42-3Rigid-FlexMIL-P-13949H,GI.3.1.2.4(PTFE)Polyterafluoroethylene,3.7.PTFETeflon,(Impedance)(microwave)GTGXGY,type3M:A.PTFEMILP-55110E4.8.4.4(Wicking)B..C.Tg19c,.3.1.2.5BT/EPOXYBT(MitsubishiGasChemicalCo.)1980BismaleimideTrigzineResinmonomer3.8BTA.a.Tg180BT(peelStrength)12(Smear)b.UL94V-0c.d.e.B.a.COBwirebondingBT/EPOXYb.BGA,PGA,MCM-LsCAF(ConductiveAnodicFilament),()BT/EPOXY3.1.2.6CyanateEsterResin1970PCBChibaGeigy3.9A.a.Tg250b.(2.5~3.1)B.a..b..3.1.23.1.2.1(Fiberglass)PCBKelvar(Polyamide)(Quartz)(Glass)17Owen-IllinoisCorningGlassWorksOwens-CorningFiberglasCorporation19393.1.2.2(Continuous)13(discontinuous)(Fabric)(Mat)FR4CEM3A.()ACESEa./b.c.d.e.f.PCBE3.2(copperfoil),,3,4mil,(1mil),.,Profile..3.2.13.2.1.1(Rolled-orWroughtMethod)(3*4),,(HeattreatmentorAnnealing),14(ElectrodepositedMethod)ED.,600ASF(Columnar)(passivated)(Drum),(Drumside),(Matteside).:A.a..b..B..a.,b..3.2.1.3,1.0Ounce(oz)1oz(28.35g).35(micron)1.35mil.1oz1/2oz1/4oz,.3.2.23.2.2.10.5oz(17.5micron)3/8oz(Carrier)(copperfoil),ED,2.1mil.,3mil..(Porosity),15(Stress)ED.,Grade2,E-Typehigh-ductilityGrade2,E-TypeHTE.ED.3.2.2.3AEDDruma.BondingStage(MatteSide)Nodulization2000~4000Ab.Thermalbarriertreatments-(BrassGouldJTC)(ZincYatesTW)Dicy500~1000Ac.Stabilization(Chromation)(passivation)(antioxidant)Ba.(Doubletreatment)20COST/PolycladDSTb.(Lowprofile)ToothProfile