JEDEC_solderability

EIA/JEDECSTANDARDSolderabilityTestMethodEIA/JESD22-B102-CSEPTEMBER1998ELECTRONICINDUSTRIESALLIANCEJEDECSolidStateTechnologyDivisionNOTICEEIA/JEDECstandardsandpublicationscontainmaterialthathasbeenprepared,reviewed,andapprovedthroughtheJEDECCouncillevelandsubsequentlyreviewedandapprovedbytheEIAGeneralCounsel.EIA/JEDECstandardsandpublicationsaredesignedtoservethepublicinterestthrougheliminatingmisunderstandingsbetweenmanufacturersandpurchasers,facilitatinginterchangeabilityandimprovementofproducts,andassistingthepurchaserinselectingandobtainingwithminimumdelaytheproperproductforusebythoseotherthanJEDECmembers,whetherthestandardistobeusedeitherdomesticallyorinternationally.EIA/JEDECstandardsandpublicationsareadoptedwithoutregardtowhetherornottheiradoptionmayinvolvepatentsorarticles,materials,orprocesses.BysuchactionJEDECdoesnotassumeanyliabilitytoanypatentowner,nordoesitassumeanyobligationwhatevertopartiesadoptingtheEIA/JEDECstandardsorpublications.TheinformationincludedinEIA/JEDECstandardsandpublicationsrepresentsasoundapproachtoproductspecificationandapplication,principallyfromthesolidstatedevicemanufacturerviewpoint.WithintheJEDECorganizationthereareprocedureswherebyaEIA/JEDECstandardorpublicationmaybefurtherprocessedandultimatelybecomeanANSI/EIAstandard.Noclaimstobeinconformancewiththisstandardmaybemadeunlessallrequirementsstatedinthestandardaremet.Inquiries,comments,andsuggestionsrelativetothecontentofthisEIA/JEDECstandardorpublicationshouldbeaddressedtoJEDECSolidStateTechnologyDivision,2500WilsonBoulevard,Arlington,VA22201-3834,[phone]/7559orwww.eia.org\jedec.Publishedby©ELECTRONICINDUSTRIESALLIANCE1998EngineeringDepartment2500WilsonBoulevardArlington,VA22201-3834CopyrightdoesnotapplytoJEDECmembercompaniesastheyarefreetoduplicatethisdocumentinaccordancewiththelatestrevisionofJEDECPublication21ManualofOrganizationandProcedure.PRICE:PleaserefertothecurrentCatalogofJEDECEngineeringStandardsandPublicationsorcallGlobalEngineeringDocuments,USAandCanada(1-800-854-7179),International(303-397-7956)PrintedintheU.S.A.AllrightsreservedPLEASE!DON”TVIOLATETHELAW!ThisdocumentiscopyrightedbytheEIAandmaynotbereproducedwithoutpermission.Organizationsmayobtainpermissiontoreproducealimitednumberofcopiesthroughenteringintoalicenseagreement.Forinformation,contact:GlobalEngineeringDocuments15InvernessWayEastEnglewood,CO80112-5704orcallU.S.A.andCanada1-800-854-7179,International(303)397-7956JEDECStandard22-B102-C-i-TESTMETHODB102-CSOLDERABILITYCONTENTSPage1Purpose12Apparatus12.1Solderpot12.2Dippingdevice12.3Opticalequipment12.4Steamagingequipment12.5Lightingequipment22.6Materials22.7SMDreflowequipment23ProcedureforsimulatedboardmountingreflowsolderabilitytestinSMDs33.1Testequipmentset-up33.2Specimenpreparationandsurfacecondition43.3Visualinspection44Procedurefordipandlooksolderabilitytesting74.1Preconditioning74.2Solderdipconditions74.3Testing75Summary14Figures1Criticalareasinrectangularpassivecomponents(SMDmethod)52CriticalareasinSOICandQFPpackages(SMDmethod)53Criticalareasinplastic-leadedchipcarrier(SMDmethod)64Criticalareasintantalumchipcapacitor65Inspectedareaforgullwingpackages(dipandlookmethod)136InspectedareaforJ-leadpackages(dipandlookmethod)13Tables1Altitudeversussteamtemperature82Maximumlimitsofsolderbathcontaminant11JESD22-B102-C-ii-JEDECStandard22-B102-CPage1TestMethodB102-C(RevisionofTestMethodB102-B)TESTMETHODB102-CSOLDERABILITY(FromJEDECCouncilBallotJCB-97-71,formulatedunderthecognizanceoftheJC-14.1SubcommitteeonReliabilityTestMethodsforPackagedDevices.)1PurposeThepurposeofthistestmethodistoprovideameansofdeterminingthesolderabilityofdevicepackageterminationsthatareintendedtobejoinedtoanothersurfaceusingsolderfortheattachment.Thistestmethodprovidesoptionalconditionsforagingandsolderingforthepurposeofallowingsimulationofthesolderingprocesstobeusedinthedeviceapplication.Itprovidesproceduresfordip&looksolderabilitytestingofthroughhole,axialandsurfacemountdevicesandreflowsimulatedusetestingforsurfacemountpackages.2Apparatus2.1SolderpotAstaticsolderpotofsufficientsizetocontainatleast2pounds(4.4kg)ofsoldershallbeused.Theapparatusshallbecapableofmaintainingthesolderatthespecifiedtemperaturewithin+/-5oC.2.2DippingdeviceAmechanicaldippingdevicecapableofcontrollingtheratesofimmersionandemersionoftheterminationsandprovidingadwelltime(timeoftotalimmersiontotherequireddepth)inthesolderbathasspecifiedshallbeused.2.3OpticalequipmentAnopticalmicroscopecapableofprovidingmagnificationinspectionfrom10xto20xshallbeused.JEDECStandard22-B102-CPage2TestMethodB102-C(RevisionofTestMethodB102-B)2Apparatus(cont’d)2.4SteamagingequipmentAnoncorrodiblecontainerandcoverofsufficientsizetoallowtheplacementofspecimensinsidethevesselshallbeused.Thespecimensshallbeplacedsuchthatthelowestportionofthespecimenisaminimumof1.5inches(38mm)abovethesurfaceofthewater.Asuitablemethodofsupportingthespecimensshallbeimprovisedusingnoncontaminatingmaterial.2.5LightingequipmentAlightingsystemshallbeusedthatwillprovideauniform,nonglare,nondirectionalillumina