AEC-Q100最新版原文

AEC-Q100-Rev-HSeptember11,2014FAILUREMECHANISMBASEDSTRESSTESTQUALIFICATIONFORINTEGRATEDCIRCUITSComponentTechnicalCommitteeAutomotiveElectronicsCouncilAEC-Q100-REV-HSeptember11,2014ComponentTechnicalCommitteeAutomotiveElectronicsCouncilTABLEOFCONTENTSAEC-Q100FailureMechanismBasedStressTestQualificationforIntegratedCircuitsAppendix1:DefinitionofaQualificationFamilyAppendix2:Q100CertificationofDesign,ConstructionandQualificationAppendix3:PlasticPackageOpeningforWireBondTestingAppendix4:MinimumRequirementsforQualificationPlansandResultsAppendix5:PartDesignCriteriatoDetermineNeedforEMCTestingAppendix6:PartDesignCriteriatoDetermineNeedforSERTestingAppendix7AEC-Q100andtheUseofMissionProfilesAttachmentsAEC-Q100-001:WIREBONDSHEARTESTAEC-Q100-002:HUMANBODYMODEL(HBM)ELECTROSTATICDISCHARGE(ESD)TESTAEC-Q100-003:MACHINEMODEL(MM)ELECTROSTATICDISCHARGE(ESD)TEST(DECOMMISSIONED)AEC-Q100-004:ICLATCH-UPTESTAEC-Q100-005:NONVOLATILEMEMORYWRITE/ERASEENDURANCE,DATARETENTION,ANDOPERATIONALLIFETESTAEC-Q100-006:ELECTRO-THERMALLYINDUCEDPARASITICGATELEAKAGE(GL)TEST(DECOMMISSIONED)AEC-Q100-007:FAULTSIMULATIONANDTESTGRADINGAEC-Q100-008:EARLYLIFEFAILURERATE(ELFR)AEC-Q100-009:ELECTRICALDISTRIBUTIONASSESSMENTAEC-Q100-010:SOLDERBALLSHEARTESTAEC-Q100-011:CHARGEDDEVICEMODEL(CDM)ELECTROSTATICDISCHARGE(ESD)TESTAEC-Q100-012:SHORTCIRCUITRELIABILITYCHARACTERIZATIONOFSMARTPOWERDEVICESFOR12VSYSTEMSAEC-Q100-REV-HSeptember11,2014ComponentTechnicalCommitteeAutomotiveElectronicsCouncilRevisionSummaryThisinformativesectionbrieflydescribesthechangesmadeintheAEC-Q100Rev-Hdocument,comparedtopreviousdocumentversion,AEC-Q100Rev-G(May14,2007).Punctuationandtextimprovementsarenotincludedinthissummary.•Section1.2.1–AutomotiveReferenceDocuments:AddedreferencetoAEC-Q005Pb-FreeRequirements•NEWSection1.2.4–DecommissionedReferenceDocuments:AddednewsectionprovidingguidanceoneliminationofAEC-Q100-003MachineModelESD(removedduetoindustrytestobsolescence)andQ100-006ElectrothermallyInducedGateLeakage(removedduetolackofindustryneedasaqualificationtest)•Section1.3.1–AECQ100Qualification:AddedrecommendationthatpassingESDvoltagelevelbespecifiedinsupplierdatasheetwithfootnoteonanypinexceptions•NEWSection1.3.2–AECCertification:AddednewdefinitionclarifyingthatAEC-Q100“certification”doesnotexist,suppliersperformqualificationtestingaccordingtoAECstandards•Section1.3.4–DefinitionofPartOperatingTemperatureGrade:AddednewTable1definingpartoperatingtemperaturegradesandguidanceonuseoftemperature(e.g.,endpoint,junction)duringtests;eliminatedGrade4(0°Cto+70°C)entry•NEWSection1.3.5–CapabilityMeasure,Cpk:AddednewdefinitionandreferencetoAEC-Q003Characterizationdocument•Section2.2–PrecedenceofRequirements:AddedclarificationtoPurchaseOrderandDeviceSpecificationentries•Section2.3.1–DefinitionofGenericData:MovedexistingTable1,PartQualification/RequalificationLotRequirements,andportionofsectiontexttoAppendix1–DefinitionofaProductQualificationFamily•Section2.3.2–TimeLimitforAcceptanceofGenericData:AddedtextonuseofdiagraminFigure1•Section2.4.1–LotRequirements:AddedstatementthatdeviationfromTable2requirestechnicalexplanation•Section2.5–DefinitionofTestFailureAfterStressing:AddedstatementonEOS•Section3.1.1–QualificationofANewDeviceManufacturedinACurrentlyQualifiedFamily:Deletedthisentiresection,subjectiscoveredinAppendix1.•Section3.2.3–CriteriaforPassingRequalification:ModifiedtexttoprovidebetterguidanceonAEC-Q100requalification•NEWSection3.3–QualificationofAPb-FreeDevice:AddednewsectionwithrequirementsforPb-FreedevicesandreferencestoAEC-Q005Pb-FreeRequirementsdocument•Figure2–QualificationTestFlow:oTestGroupA:RemovedstatementofPCbeforePTCoTestGroupB:Correctedtesttemperatureorderforpost-HTOLtestingtoRoom,Cold,&HotoTestGroupE:RemovedreferencetoMMESDandGLtests•Table2–QualificationTestMethods:oTestA3–AutoclaveorUnbiasedHASTorTemperatureHumidity(withoutBias):AddedTHreferencetoAdditionalRequirementscolumnoTestA4–TemperatureCycling:Revisedlow-endtemperatureandminimumduration;addedlegacytesttemperaturenote;eliminatedGrade4entryoTestA6–HighTemperatureStorageLife:AddedreferencetoTa(ambienttemperature)oTestA7–HighTemperatureOperatingLife:Removed408hourtestdurationoption;addednotesregardinguseofTa(ambienttemperature)andTj(junctiontemperature)oTestC1–WireBondShear:RemovedPpkrequirement;modifiedCpkacceptcriteriatoCpk1.67;addedreferencetoAEC-Q003oTestC2–WireBondPull:RemovedPpkrequirement;modifiedCpkacceptcriteriatoCpk1.67;addedreferencetoAEC-Q003oTestC3–Solderability:AddedreferencetoJ-STD-002DandstatementonuseofdrybakeAEC-Q100-REV-HSeptember11,2014ComponentTechnicalCommitteeAutomotiveElectronicsCouncilRevisionSummary(continued)•Table2–QualificationTestMethods(continued):oTestC4–PhysicalDimension:RemovedPpkrequirement;modifiedCpkacceptcriteriatoCpk1.67;addedreferencetoAEC-Q003oTestC5–SolderBallShear:RemovedPpkrequirement;modifiedCpkacceptcriteriatoCpk1.67;addedreferencetoAEC-Q003oTestE2–ElectrostaticDischargeHumanBodyModel/MachineModel:EliminatedMachineModel(MM)ESDentry;addedreferencetoSection1.3.1oTestE3–Electro