无机粉体化学镀镍的研究进展-赵雯

©1994-2010ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.(,710072)::;:TQ153.1;O646.54:A:1004-227X(2004)03-0033-04ProgressofelectrolessnickelplatingoninorganicpowderZHAOWen,ZHANGQiu2yu,WANGJie2liang,HANLei,ZHANGHe2peng(DepartmentofAppliedChemistry,NorthwesternPolytechnicalUniversity,Xian710072,China)Abstract:Thecharacteristicsofelectrolessnickelplatingwereintroduced,aswellastheinfluencesofmainbathcomponentsonpropertiesofnickeldeposits.Electrolessnickelplatingprocessanditsstudytrendsoninorganicpowdersuchasgraphitepowder,ceramicpowder,aluminumpowder,diamond,hollowglassmicrospherewerereviewed.Keywords:electrolessnickelplating;inorganicpowder1,,[13]:,;;;,;,,;,;80,,,2,:2003-08-12:2004-03-08:(1980-),,,:(Email)[e-mail],(Tel)029-88495304,,,,,,211,,Ni2+,,,,[5],[6]212,,Ni2+,,,,,[56],,[7]213[810]:pH,,,3323320046Electroplating&FinishingVol.23No.3Jun.2004©1994-2010ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.[11],,,()[12],,,,215H+,pH,,,pH,,[5]3,,311[13],,,,,,[14],MH/Ni,;,,,,,1C120[15],312,,,,,,-,,,,,,,,,,[16][17]NiZrO2,,,:Pd2+011mL/L,018mol/L;SEM,ZrO2Ni[18],,(NbTi)C,-X,,2m,Chung[19],SiCpHSiC,SiC313,NiAl,,,,,,,[20],4320046Electroplating&Finishing3©1994-2010ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.[21]NiAl,8689pH121513123545g/L7595mL/L,Hanyaloglu1S.C.[22]2m,(),3.4,[23]:(),(),,,,,,,,,,[24],,,;,,,;[25],,,,;50%,,315,NiCoNi2Fe,[26]Fe2Ni,,,2mm815GHz810dB(8412%);Fe2Ni,01260g/cm3,,[27]:[1].[M].:,1999.6.[2],.[J].,1997,16(4):48-51.[3].[J].,1998,20(2):30-32.[4],.[M].:,2000.13.[5],,,.[J].,1999,18(1):21-65.[6],,,.[J].,2000,19(3):5-8.[7].[J].,2000,22(5):24-26.[8].[J].,1993,22(5):6-8.[9].[J].,1996,29(1):4-7.[10],.[J].,1996,15(1):37-39.[11],.[J].,1999,18(2):43-46.[12],,.[J].,1997,19(6):81-85.[13],,.[J].,1998,13(4):46-49.[14],,.[J].,2000,10(3):433-436.[15],,,.[J].(),2002,(5):37-40.[16].[J].,1998,31(7):16-18.[17],,.NiZrO2[J].,1999,7(4):78-81.53©1994-2010ChinaAcademicJournalElectronicPublishingHouse.Allrightsreserved.[18],,.[J].,1994,14(2):11-12.[19]Chung.W.S.,Chang.S.Y.,Lin.S.J,ElectrolessnickleplatingonSiCpowderwithhypophosphiteasareducingagent[J].PlatingandSur2faceFinishing,1996,83(3):68-71.[20],,,.[J].(),1996,17(5):512-515.[21],,,.[J].,1996,6(4):39-42.[22]Hanyaloglu.S.C.,Aksakal.B.Mccolm.I.J..Reactivesinteringofelectrolessnickel2platedaluminumpowders[J].MaterialsCharacteriza2tion,2001,47(1):9-16.[23],,,.[J].,2000,33(2):19-21.[24],,,.[J].,1997,21(1):27-29.[25],,.[J].,1993,22(1):12-14.[26],.Fe2Ni[J].,1997,(1):37-39.[27],,,.[J].,2001,14(5):597-600.[:](25)512115t()/hNCICF/gMF/gEN/IGF/g011.6089.5469.60239.5137.761-48.8217.046-:,,,1554h,EN/IG512126t()/dNCICF/gMF/gEN/IGF/g011.6089.5469.602410.7428.98610.74289.7347.88710.321,90%408,512137/NCICF/gMF/gEN/IGF/g011.6089.5469.602210.0798.077-38.8759.005-,NCIC3512148H2SNCICM()11.6089.546H2S9.1108.162,H2S,[:],,,,,,,,,()6320046Electroplating&Finishing3