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IC封裝簡介內容•現有的IC封裝型式(PackageType)介紹•製造流程(ProcessFlow)介紹•材料組成(BOM)介紹封裝形式的定義•DIP:DualIn-linePackage•SOP:SmallOutlinePackage•SOJ:SmallOutlineJ-leadPackage•SSOP:ShrinkSOP•TSOP:ThinSOP(inc.typeI&II)•QFP:QuadFlatPackage•LQFP:LowprofileQFP•BGA:BallGridArrayDIP:DualIn-linePackage腳數:28現有的IC封裝型式(PackageType)現有的IC封裝型式(PackageType)SOP:SmallOutlinePackage腳數:8/18/32/44現有的IC封裝型式(PackageType)SOJ:SmallJ-leadPackage腳數:24/42現有的IC封裝型式(PackageType)SSOP:ShrinkSmallOutlinePackage腳數:48現有的IC封裝型式(PackageType)TSOP-I:ThinSOPtype-I腳數:28/32/48現有的IC封裝型式(PackageType)TSOP-II:ThinSOPtype-II腳數:40/44/50/54/66/86現有的IC封裝型式(PackageType)QFP:QuadFlatPackage腳數:100/128/160/208現有的IC封裝型式(PackageType)LQFP:LowprofileQFP腳數:48/64/100/128/176/208/216現有的IC封裝型式(PackageType)BGA:BallGridArray尺寸:27x27/35x35製造流程(ProcessFlow)介紹-前段製造流程材料設備名稱製造商processflowmaterialequipmentvendor晶片進料檢驗晶片waferIQCwafer↓研磨晶片晶片研磨機Okamoto(日本)grindingwaferwafergrinder↓晶片粘片膠膜粘片機ESECwafermountbluetapewafermount(瑞士)↓晶片切割切割機DISCOwafersawdicingsaw(日本)↓粘晶粒銀膠、花架粘晶機ESECdiebondsilverepoxydiebonder(瑞士)↓leadframe↓烘烤烤箱志勝epoxycureoven(台灣)↓銲線金線銲線機K&S(美國)wirebondgoldwirewirebonderShinkawa(日本)↓點膠黃膠點膠機Allteqcoatingpolyimidediecoating(美國)↓烘烤烤箱志勝cureoven(台灣)↓(選項)(option)(選項)(option)(選項)(option)製造流程材料設備名稱製造商processflowmaterialequipmentvendor壓模環氧樹脂壓模機TOWA(日本)moldingcompoundautomoldFICO(日本)↓烘烤烤箱志勝postmoldcureoven(台灣)↓雷射蓋印雷射蓋印機均豪lasermarkingmarkingm/c(台灣)↓切腳去膠緯機Yamada(日本)de-junk/trimD/Tm/c均豪(台灣)↓APM↓電鍍錫鉛球電鍍機MECOplatingsolderanodeplatingm/c(荷蘭)↓油墨蓋印油墨油墨蓋印機鈦昇inkmarkinginkmarkingm/c(台灣)↓烘烤烤箱志勝inkcureoven(台灣)↓成型管子/塑膠盤成型機Yamada(日本)form/singulationtube/trayF/Sm/c均豪(台灣)↓Han-Mi↓包裝包裝箱packingbox/carton(選項)(option)(選項)(option)製造流程(ProcessFlow)介紹-後段進料檢驗IQC(IncomingQualityControl)晶片黏片WaferMount(WM)晶粒切割WaferSaw(WS)導線架(花架)晶粒銀膠黏粒DieBond(DB)頭髮金線銲線WireBond(WB)壓模Molding(M/D)切腳前切腳De-junk&Trim(DT)電鍍Plating(PL)油墨(ink)雷射(laser)蓋印Marking成型及切單Forming&Singulation(F/S)1.花架(Leadframe)2.銀膠(Epoxy)3.金線(Goldwire)4.膠餅(Compound)*5.黃膠(Polyimide)*6.散熱片(HeatSink)*前四項為四大主料.材料組成(BOM)BillOfMaterial花架(導線架)Leadframe(L/F)常用種類(type):1.銅材(Cu):C7025,A-194,E-64T2.鐵材(Fe):A-42銀膠Epoxy常用種類(type):1.Ablebond8360forQFP/SOIC2.Ablebond8355FforTSOP&LQFP3.Ablebond8340forTSOP&LQFP4.HitachiEN4065DforTSOP&LQFP5.Ablebond8515forinsulator(絕緣)成份:99.99%Au常用線徑:1.1.3milforbondpitch90um以上.2.1.2milforbondpitch80um以上.3.1.0milforbondpitch70~79um.4.0.9milforbondpitch69um以下.金線GoldWire主要成份:1.填充料Filler(SiO2):約70%2.合成樹脂Resin:25~29%常用型號:1.EME6300/6600forQFP&SOIC2.EME7351LS/KMC260forTSOP3.EME7320ARforLQFP膠餅Compound[後段]•(8)壓模•Mold•(9)烘烤•PMC•(10)去緯•DT•(11)電鍍•Plating•(12)油墨蓋印•InkMarking•(13)烘烤•InkCure•(14)切腳成型•TrimForm•(15)包裝•PACKLeadFrameAssemblyProcess[前段]•(1)晶片檢驗•WaferIncoming•(2)晶片粘片•UVTapeMount•(3)晶片切割•Saw•(4)UV照射•UVirradiation•(5)粘晶粒•DieBond•(6)烘烤•EpoxyCure•(7)銲線•WireBondWaferIncomingUVirradiationWaferMountSawPMCDTMoldDieBondPlatingWireBondEpoxyCureTrimFormInkCureInkMarkingPACKLeadFrameAssemblyProcessFlowChart晶片粘片(UV)WaferMount晶片切割SawUV照射UVirradiation粘晶粒DieBond烘烤EpoxyCure銲線WireBond壓模Mold烘烤PMC去緯DT電鍍Plating油墨蓋印InkMarking烘烤InkCure切腳成型TrimForm包裝PACKTapingEpoxyCureUVIrradiationSawDetapingWaferCleanUVTapeMountGrindingSubstratePre-BakeCleanWireBondDieBondMoldSBBPMarkingPMCBGAAssemblyProcessFlowChartReFlowPack&TestSawSingulationFluxCleanWaferIncomingTaping上膠帶Grinding晶圓研磨Detaping去膠帶晶圓電漿清潔WaferCleanUVTapeMount晶片黏貼(UV膠帶)Saw晶片切割UVIrradiation紫外線照射SubstratePre-bake底座預烘烤DieBond晶片上片EpoxyCure銀膠烘烤Clean電漿清洗WireBond焊線Mold壓模PMC成型烘烤MarkingLaser蓋印SBBP植球ReFlow迴焊FluxClean清洗SawSingulation切割成顆粒狀Pack,ASECLTest包裝與測試Shipment送交客戶測試製程介紹測試定義:測試製程是對於IC封裝完成的產品,以保証出廠IC功能的完整性,並對已測試的產品依其功能作分類(即分Bin),作為IC不同等級產品的評價依據;最後並對產品作外觀檢驗及包裝作業(Packing),及出貨的運送作業(Shipping)。功能測試及分類1.上線備料2.功能測試---溫度循環測試(–40℃~+125℃)測試系統(Tester)數位影像產品繪圖晶片組產品記憶體產品PC晶片組產品汽車電子元件資訊家電產品分類機(Handler)BGAQFP功能測試及分類包裝類別QFNPLCCSOP3.外觀檢驗及包裝(Packing)印碼掃描(MarkScan)捲帶包裝(Tape/Reel)外觀檢驗及包裝4.出貨的運送作業(Shipping)
本文标题:IC封装流程介绍
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