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BUMPINGINTRODUCTIONBUMPINGINTRODUCTIONBUMPINGINTRODUCTIONBUMPINGINTRODUCTIONBumpingprocessintroductionBumpingprocessintroductionBumpingprocessintroductionBumpingprocessintroductionDomesticBumpingindustryDomesticBumpingindustryDomesticBumpingindustryDomesticBumpingindustryReflowmachineReflowmachineReflowmachineReflowmachineBUMPINGINTRODUCTIONBUMPINGINTRODUCTIONBUMPINGINTRODUCTIONBUMPINGINTRODUCTIONWaferbumping:plantingballonwaferpadApplication:advancedpackage(BGA&WLP&CSP…..)Waferbumps-goldbums-solderbumps-platingbumps-stencilprintingbumps-solderballattachBumpingprocessintroductionMethodsofwaferbumpingforflipchipGoldbumping(plated)Solderbumping(plated)Goldball(stud)bumps(goldwiremicroweld)SolderballbumpsplacementStencilPrintedsolderbumpingBumpingprocessintroductionSolderBumpingprocessflowSolderbumpingprocessisaccomplishedinafoundry-likeprocessingsetting.Thebumpsaregenerallymadeoflead,tin,oracombinationofboth.Bumpingprocessintroduction•goldballbumpingistrulyanextensionofthewirebondingprocess.Wirebonding.Gold(stud)bumpsBumpingprocessintroductionStencilprintedsolderbumpingBumpingprocessintroductionSolderballbumpsplacementandreflowBumpingprocessintroductionCostsofgoldballbumpingvs.platingCostsofgoldballbumpingvs.platingCostsofgoldballbumpingvs.platingCostsofgoldballbumpingvs.platingBumpingprocessintroduction苏州颀中Chipmore上海宏茂Chipmos上海安靠Amkor星科金朋SCC江阴长电JCAP苏州晶方WLCSP中芯国际SMICDomesticBumpingindustry上海宏茂Chipmos&苏州欣中Chipmore-TCP&COG&COFforLCDDriverIC-Goldbumps上海安靠Amkor-putintoproduction-gold&solderbumping星科金朋SCC-BumpingservicefromTSMC-Gold+Nibumping&solderbumpingDomesticBumpingindustry•JCAPBumpingServicesDomesticBumpingindustry苏州Shellcase-ShellcaseWLCSPprocess&Waferbumpingprocess&TSVWLCSPprocessDomesticBumpingindustry氮气回流焊炉氮气回流焊炉氮气回流焊炉氮气回流焊炉(forWAFERBUMPFORMING)(forWAFERBUMPFORMING)(forWAFERBUMPFORMING)(forWAFERBUMPFORMING)----YAMATOWORKS(120000USD)YAMATOWORKS(120000USD)YAMATOWORKS(120000USD)YAMATOWORKS(120000USD)ReflowmachineHELLER1800EXLHELLER1800EXLHELLER1800EXLHELLER1800EXL系列回流焊系列回流焊系列回流焊系列回流焊炉炉炉炉((((深圳敏科深圳敏科深圳敏科深圳敏科))))Reflowmachine大型全热风无铅回流焊炉大型全热风无铅回流焊炉大型全热风无铅回流焊炉大型全热风无铅回流焊炉大型全热风无铅回流焊炉----SNRSNRSNRSNR----845P845P845P845P((((苏苏苏苏州圣州圣州圣州圣岗岗岗岗))))ReflowmachineSEMIgearGENVEASTP200/300SEMIgearGENVEASTP200/300SEMIgearGENVEASTP200/300SEMIgearGENVEASTP200/300ReflowmachineReflowmachine
本文标题:倒装焊工艺(bumping)
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