电子CAD课程设计03

目录第1章电路图绘制........................................................................1第2章元器件参数对应封装选择及说明....................................2第3章ERC与网络表.....................................................................4第4章PCB制板与工艺设计.........................................................6第5章各种报表的生成................................................................8第6章PCB各层面输出与打印...................................................10第7章总结...................................................................................15参考文献...........................................................................................161第1章电路图绘制C8104C9104C11104C7104AVCCAVDDC10104VDDVCCA111A92A83A134A145NC6WE#7VDD8FALE10FCLE11A1212A713A614A515A416A317A218A119A020DQ021DQ122DQ223VSS24DQ325DQ426DQ527DQ628DQ729CE#30A1031OE#32NC9U1SST39LF/VF010C1104VCCA11A9A8A13A14MWRFALEFCLEA12A7A5A6A4MRDA10CED7D6D5D3D2D1D0A0A1A2A3MWR-MRD-A0A1A2A3A4A5A6A7A8A9A10A11A12A13A14FCLEFALECECE0D0D1D2D3D4D5D6D7VDDAVDDAVCCVCCC2147uC6104KO02KO13KI05KI16KI27KH93KM94MLED12ULED13VMIC74MICIN73MICOUT72AGCI71VRAD70VRDA69PAOL63PAIL66AOUTL68AOUTR67PAIR65PAOR62BTSEL77IBIAS78VREF79LBREF80LBRST81LBMON82DCF283DCF184DCOP286DCOP187NC97NC99NC100HXI90HXO91MWR14MRD15A016A117A218A319A420A521A622A723A828A929A1038A1130A1224A1327A1426FCLE55FALE56CCE48DCE050DCE139D040D141D242D343D444D545D646D747WP96NC4NC10NC11NC31NC32NC33NC35NC36NC49UD-58UD+59UVBUS60UCTRL98LXI52LXO53GND8GND25GND34GND54PGND64AGND75AGND89VDD9VDD51VDD85AVDD88PVDD61AVCC76VCC95VCC57VCC37VCC1GND34U3ATJ2071D7D6D5D4D3D2D1D0VCCNC1NC2NC3NC4NC5NC6R/B#7RE#8CE#9NC10NC11VCC12VSS13NC14NC15CLE16ALE17WE#18WP#19NC20NC21NC22NC23NC24NC25NC26NC27NC28I/O029I/O130I/O231I/O332NC33NC34NC35VSS36VCC37PRE38NC39NC40I/O441I/O542I/O643I/O744NC45NC46NC47NC48U4K9K1G08U0MMRD-CE0C14104FCLEFALEMWR-123J5ProtectSelvccR26100KWPR110MC2215pY232.768KC2315pR6150KR41.5KR324R224R5100kGND4D+3D-2VBus1Shield5J1USBAPLUGD11N4148Q32SB1188R195ohmR2922ohmVIN2VOUT3G1U5XXX1502P+C18100uBAT11.5VRegulator,Poweris500mWThecircuitischarger,Pleaseusechargeablebattery.VBATJ4R21100DCOP2Q2MMTB2222L4100uHVBATD3RB491D+C3147uL2330uHVCC+C3333uAVCC+C3233u+C3047uR20100Q1MMBT2222L1330uHL3100uhD2RB491DDCOP1VDDAVDDVBATY124.576MC2515pC2415pDCOP2DCOP1R221.2MR231.2MVCCC28100PR25470KR241.2MC29100PVDDVBAT1.50V1.00VR7101C171.5MR114K7R133K+C3533uC38225C37225R104K7R123K+c3433uR1410R1510C19103C20103J2PHONEJACKSTEREOSWC5104C4104C27100PR17560KR183.3KC26224MIC12.2KR16C12224D5UD_LEDD4MP3_LEDR28330R27330VCCVCCK1VOL-/PREVK2VOL+/NextK3A/BK4Play/PauseKO0KO1KI1KI2HoldMode123s2ModeSwitchKey123S1HOLDkeyVCCVCC=3.0VVDD=2.1VDVRMP3TP6TP4TP54321TP2TP3D4GVOUTVINU2XXX1502PAVDDR8750KR91.5M+C364.7uC2104TP11.50V1.00V2第2章元器件参数对应封装选择及说明序号型号编号封装1PartTypeDesignatorFootprint2PartTypeMIC1AXIAL0.33PartTypeJ4AXIAL0.34PartTypeTP4HOLE5PartTypeTP6HOLE6PartTypeTP3HOLE7PartTypeTP1HOLE8PartTypeTP5HOLE9PartTypeTP2HOLE10PartTypeBAT1RAD0.411PartTypeR22AXIAL0.312PartTypeR24AXIAL0.313PartTypeR23AXIAL0.314PartTypeR4AXIAL0.315PartTypeR9AXIAL0.316PartTypeC17RAD0.217PartTypeD1DIODE18PartTypeQ3TO-46193.3KR18AXIAL0.3203KR12AXIAL0.3213KR13AXIAL0.3224.7uC36RB.2/.4234K7R11AXIAL0.3244K7R10AXIAL0.3255ohmR19AXIAL0.32610R14AXIAL0.32710R15AXIAL0.32810MR1AXIAL0.32915pC25RAD0.23015pC22RAD0.23115pC23RAD0.23215pC24RAD0.23322ohmR29AXIAL0.333424R2AXIAL0.33524R3AXIAL0.33624.576MY1XTAL13732.768KY2XTAL13833uC33RB.2/.43933uC32RB.2/.44033uC35RB.2/.44133uc34RB.2/.44247uC21RB.2/.44347uC31RB.2/.44447uC30RB.2/.445100R21AXIAL0.346100R20AXIAL0.347100KR26AXIAL0.348100PC28RAD0.249100PC29RAD0.250100PC27RAD0.251100kR5AXIAL0.352100uC18RB.2/.453100uHL4AXIAL0.354100uhL3AXIAL0.355101R7AXIAL0.356103C20RAD0.257103C19RAD0.258104C4RAD0.259104C1RAD0.260104C14RAD0.261104C5RAD0.262104C9RAD0.263104C2RAD0.264104C8RAD0.265104C10RAD0.266104C7RAD0.267104C11RAD0.268104C6RAD0.24第3章ERC与网络表3.1ERCErrorReportFor:Documents\电信1401沈忱23.Sch15-Apr-201609:52:20EndReport53.2网络表[[[2.2KBAT1C1AXIAL0.3RAD0.4RAD0.2R16104]]][[C2C4C5RAD0.2RAD0.2RAD0.2104104104]]][[[C6C7C8RAD0.2RAD0.2RAD0.2104104104]]][[[C9C10C11RAD0.2RAD0.2RAD0.2104104104]]][[[C12C14C17RAD0.2RAD0.2RAD0.22241041.5M]]][[[C18C19C20RB.2/.4RAD0.2RAD0.2100u103103]]][[[C21C22C23RB.2/.4RAD0.2RAD0.247u15p15p]]][[[C24C25C26RAD0.2RAD0.2RAD0.215p15p224]]][[[C27C28C29RAD0.2RAD0.2RAD0.2100P100P100P]]][[[C30C31C32RB.2/.4RB.2/.4RB.2/.447u47u33u]]][[[C33C35C36RB.2/.4RB.2/.4RB.2/.433u33u4.7u]]][[[C37C38D1RAD0.2RAD0.2DIODE2252251N4148]]][[[D2D3D4DIODEDIODEDIODE0.4RB491DRB491DMP3_LED]]][[[D5J1J26第4章PCB制板与工艺设计4.1PCB制板工艺参数选择4.1.1线路1.最小线宽:6mil(0.153mm)。也就是说如果小于6mil线宽将不能生产,如果设计条件许可,设计越大越好,线宽越大，工厂越好生产，良率越高。一般设计常规在10mil左右。2.最小线距:6mil(0.153mm)。最小线距，就是线到线，线到焊盘的距离不小于6mil从生产角度出发，是越大越好，一般常规在10mil,当然设计有条件的情况下，越大越好。3.铜到外形线间距0.508mm(20mil)，线路到外形线间距0.15mm(6mil)最小。4.1.2via过孔(就是俗称的导电孔)1.最小过孔(VIA)孔径不小于0.3mm(12mil),焊盘单边不能小于6mil(0.153mm),最好大于8mil(0.2mm)大则不限。2.过孔(VIA)孔到孔间距(孔边到孔边)不能小于:6mil最好大于10mil。3.焊盘到外形线间距0.508mm(20mil)4.1.3PAD焊盘(就是俗称的插件孔(PTH))1.插件孔大小视元器件来定，但一定要大于元器件管脚，建议大于最少0.2mm以上也就是说0.6的元器件管脚，最少得设计成0.8，以防加工公差而导致难于插进,2.插件孔(PTH)焊盘外环单边不能小于0.15mm(6mil)，当然越大越好。3.插件孔(PTH)孔到孔间距(孔边到孔边)不能