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基于单片机的乳化物干燥过程控制系统设计摘要对乳化物进行干燥是为了使物料便于加工、运输、驻藏和使用。本设计是以AT89S51单片机为核心的温度控制系统。温度信号由温度芯片DS18B20采集数字信号的方式传送给单片机,该控制系统的硬件部分度控制电路、PC机与单片机串口通讯电路和一些接口电路。单片机通过对信号进行相应处理化结构程序、超温报警程序、加热程序。经过调试干燥过程达到较好的效果。关键词本页完第2页共53页MICROCONTROLLER-BASEDEMULSIONDRYINGPROCESSCONTROLSYSTEMDESIGNABSTRACTDryingoftheemulsionistomakethematerialeasytoprocess,transport,anduseofTibet.ThisdesignisbasedonAT89C51microcomputerasthecoreofthetemperaturecontrolsystem.ThetemperaturesignalbythetemperaturechipDS18B20gathering,andtransmitsbydigitalsignal'swayforthemonolithicintegratedcircuit.Inthearticleintroducedthiscontrolsystem'shardwarepart,including:Temperatureexaminationelectriccircuit,temperature-controlcircuit,PCmachineandmonolithicintegratedcircuitserialportcommunicationchannelandsomeinterfacecircuit.Themonolithicintegratedcircuitthroughcarriesoncorrespondingprocessingtothesignal,thusrealizesthetemperaturecontrolgoal.hesoftwaredesignisespeciallyimportant,usesthemodularstructureinhere,themainmoduleincludes:Nixietubedisplaysequence,keyboardscanningandpressedkeydisposalprocedure,temperaturesignalprocessingprocedure,black-whitecontrolprocedure,excesstemperaturewarningprocedureheatingprocedure.Aftercommissioning,realizedtheintelligentcontrolsyatem,makeemulsifydryingprocesstoachievebettereffect.Keywords:SCMControlTemperature,Drying本页完第3页共53页目录1绪论.................................................错误书签。11.1本课题研究的对象、背景、现状及意义......错误11.1.1背景及意义........................................错误11.1.2现状..............................................错误11.1.3最新研究动态......................................错误11.1.4发展趋势............................................................21.1.5被控对象的介绍......................................................31.1.6单片机的发展及温度控制系统..........................................32系统的总体方案设计......................................................62.1系统的总体设计........................................................62.2乳化物的干燥过程及温度的设定..........................................72.2.1原料................................................................72.2.2预热杀菌............................................................82.2.3真空浓缩............................................................82.2.4冷却................................................................83硬件设计................................................................93.1单片机选型原则........................................................93.2单片机的选择.........................................................103.374HC245芯片的选定...................................................163.4温度采集硬件的选择.................................................173.4.1技术性能描述.......................................................183.4.2应用范围.........................................................193.4.3接线说明...........................................................193.5显示硬件的选择.......................................................223.6按键的选择...........................................................223.7通信部分.............................................................223.8报警加热部分.........................................................23本页完第4页共53页3.9Proteus软件的介绍....................................................243.10总体电路原理图......................................................254软件设计...............................................................264.1KeilC51软件的介绍...................................................264.2设计思路、流程图.....................................................264.2.1温度采集模块.......................................................274.2.2数据处理模块.......................................................284.2.3键盘模块...........................................................294.2.4加热报警模块.......................................................304.2.5编写程序所需要的总流程图...........................................314.2.6本设计的源程序代码.................................................325单片机控制温度的说明及PID控制.........................................335.1温控制的说明.........................................................335.2PID控制原理及算法....................................................335.2.1控制原理...........................................................335.2.2控制规律及对系统稳定性的影响.......................................346仿真...................................................................356.1下面是仿真的结果和分析...............................................357总结...................................................................36附录Ⅰ..................................................................37附录Ⅱ..................................................................38参考文献................................................................47致谢....................................................................49本页完第5页共53页1绪论1.1本课题研究的对象、背景、现状及意义1.1.1背景及意义干燥在化工生产中应用非常广泛量要求。例如0.3%抗菌素含水量太高会影响其使用期限会沉降分层以1.1.2现状几乎所有工业领域都有热力干燥这一环节6万种。物料干燥属于高能耗行业1025我国干燥所用能源占国民经济总能耗的12下1)很多干燥的实际过程过于复杂2)不少干燥的理论研究与工业应用脱节艚发表论文”的怪圈昂终失去应用价值3)一砦新的干燥理念在小试或巾试后制4)多数干燥设备的使用寿命过长巾{5)大多数工业干燥生产习惯于采用简单的、无正规设计的土法干燥设施[1]。1.1.3最新研究动态1干燥创新技术举例1)干燥模型近年来络等温干燥楼型以及计算流体动力学模型(配有CFD商用计算软件)L7一等。2)过热蒸汽干燥用过热蒸汽作干燥介质系数。3)联合干燥是符合国际干燥技术
本文标题:基于单片机的乳化物干燥过程控制系统设计(毕业设计)
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