半导体微电子专业词汇中英文对照

1半导体微电子专业词汇中英文对照Acceleratedtesting加速实验Acceptor受主Acceptoratom受主原子Accumulation积累、堆积Accumulatingcontact积累接触Accumulationregion积累区Accumulationlayer积累层AcousticSurfaceWave声表面波Activeregion有源区Activecomponent有源元Activedevice有源器件Activation激活Activationenergy激活能Activeregion有源（放大）区A/Dconversion模拟-数字转换Adhesives粘接剂Admittance导纳Aging老化Airborne空载Allowedband允带allowance容限，公差2Alloy-junctiondevice合金结器件Aluminum(Aluminum)铝Aluminum–oxide铝氧化物AluminumNitride氮化铝Aluminumpassivation铝钝化Ambipolar双极的Ambienttemperature环境温度AMlight振幅调制光，调幅光amplitudelimiter限幅器Amorphous无定形的，非晶体的Amplifier功放放大器Analogue(Analog)comparator模拟比较器Angstrom埃Anneal退火Anisotropic各向异性的Anode阳极Antenna天线Aperture孔径Arsenide(As)砷Array阵列Atomic原子的AtomClock原子钟3Attenuation衰减Audio声频Auger俄歇Automatic自动的Automotive汽车的Availability实用性Avalanche雪崩Avalanchebreakdown雪崩击穿Avalancheexcitation雪崩激发Backgroundcarrier本底载流子Backgrounddoping本底掺杂Backward反向Backwardbias反向偏置Ballbond球形键合Band能带Bandgap能带间隙Bandwidth带宽Bar巴条发光条Barrier势垒Barrierlayer势垒层Barrierwidth势垒宽度4Base基极Basecontact基区接触Basestretching基区扩展效应Basetransittime基区渡越时间Basetransportefficiency基区输运系数Base-widthmodulation基区宽度调制Batch批次Battery电池Beam束光束电子束Bench工作台Bias偏置Bilateralswitch双向开关Binarycode二进制代码Binarycompoundsemiconductor二元化合物半导体Bipolar双极性的BipolarJunctionTransistor(BJT)双极晶体管Bit位比特Blockingband阻带Body-centered体心立方Body-centredcubicstructure体立心结构5Boltzmann波尔兹曼Bond键、键合Bondingelectron价电子Bondingpad键合点Boron硼Borosilicateglass硼硅玻璃Bottom-up由下而上的Boundarycondition边界条件Boundelectron束缚电子Braggeffect布拉格效应Breadboard模拟板、实验板Breakdown击穿Breakover转折Brillouin布里渊FBrillouinzone布里渊区Buffer缓冲器Built-in内建的Build-inelectricfield内建电场Bulk体/体内Bulkabsorption体吸收Bulkgeneration体产生Bulkrecombination体复合6Burn-in老化Burnout烧毁Buriedchannel埋沟Burieddiffusionregion隐埋扩散区Bus总线Calibration校准，检定，定标、刻度，分度Capacitance电容Capturecrosssection俘获截面Capturecarrier俘获载流子Carbondioxide(CO2)二氧化碳Carrier载流子、载波Carrybit进位位Cascade级联Case管壳Cathode阴极Cavity腔体Center中心Ceramic陶瓷（的）Channel沟道Channelbreakdown沟道击穿Channelcurrent沟道电流Channeldoping沟道掺杂7Channelshortening沟道缩短Channelwidth沟道宽度Characteristicimpedance特征阻抗Charge电荷、充电Charge-compensationeffects电荷补偿效应Chargeconservation电荷守恒Chargedrive/exchange/sharing/transfer/storage电荷驱动/交换/共享/转移/存储Chemicaletching化学腐蚀法Chemically-Polish化学抛光Chemically-MechanicallyPolish(CMP)化学机械抛光Chemicalvapordeposition(cvd)化学汽相淀积Chip芯片Chipyield芯片成品率Circuit电路Clamped箝位Clampingdiode箝位二极管Cleavageplane解理面Clean清洗Clockrate时钟频率Clockgenerator时钟发生器Clockflip-flop时钟触发器8Close-loopgain闭环增益Coating涂覆涂层Coefficientofthermalexpansion热膨胀系数Coherency相干性Collector集电极Collision碰撞CompensatedOP-AMP补偿运放Common-base/collector/emitterconnection共基极/集电极/发射极连接Common-gate/drain/sourceconnection共栅/漏/源连接Common-modegain共模增益Common-modeinput共模输入Common-moderejectionratio(CMRR)共模抑制比Communication通信Compact致密的Compatibility兼容性Compensation补偿Compensatedimpurities补偿杂质Compensatedsemiconductor补偿半导体ComplementaryDarlingtoncircuit互补达林顿电路9ComplementaryMetal-Oxide-SemiconductorField-Effect-Transistor(CMOS)互补金属氧化物半导体场效应晶体管Computer-aideddesign(CAD)/test(CAT)/manufacture(CAM)计算机辅助设计/测试/制造Component元件CompoundSemiconductor化合物半导体Conductance电导Conductionband(edge)导带(底)Conductionlevel/state导带态Conductor导体Conductivity电导率Configuration结构Conlomb库仑Constants物理常数Constantenergysurface等能面Constant-sourcediffusion恒定源扩散Contact接触Continuouswave连续波Continuityequation连续性方程Contacthole接触孔Contactpotential接触电势10Controlled受控的Converter转换器Conveyer传输器Cooling冷却Copperinterconnectionsystem铜互连系统Corrosion腐蚀Coupling耦合Covalent共阶的Crossover交叉Critical临界的Cross-section横断面Crucible坩埚Cryogeniccoolingsystem冷却系统Crystaldefect/face/orientation/lattice晶体缺陷/晶面/晶向/晶格Cubiccrystalsystem立方晶系Currentdensity电流密度Curvature曲率Currentdrift/drive/sharing电流漂移/驱动/共享CurrentSense电流取样Curve曲线Customintegratedcircuit定制集成电路11Cutoff截止Cylindrical柱面的Czochralshicrystal直立单晶Czochralskitechnique切克劳斯基技术（Cz法直拉晶体J）)Danglingbonds悬挂键Darkcurrent暗电流Deadtime空载时间Decade十进制Decibel(dB)分贝Decode解码Deepacceptorlevel深受主能级Deepdonorlevel深施主能级Deepenergylevel深能级Deepimpuritylevel深度杂质能级Deeptrap深陷阱Defeat缺陷Degeneratesemiconductor简并半导体Degeneracy简并度Degradation退化DegreeCelsius(centigrade)/Kelvin摄氏/开氏温度Delay延迟Density密度12Densityofstates态密度Depletion耗尽Depletionapproximation耗尽近似Depletioncontact耗尽接触Depletiondepth耗尽深度Depletioneffect耗尽效应Depletionlayer耗尽层DepletionMOS耗尽MOSDepletionregion耗尽区Depositedfilm淀积薄膜Depositionprocess淀积工艺Designrules设计规则Detector探测器Developer显影剂Diamond金刚石Die芯片（复数dice）Diode二极管DielectricConstant介电常数Dielectricisolation介质隔离Difference-modeinput差模输入Differentialamplifier差分放大器Differentialcapacitance微分电容13Diffraction衍射Diffusion扩散Diffusioncoefficient扩散系数Diffusionconstant扩散常数Diffusivity扩散率Diffusioncapacitance/barrier/current/furnace扩散电容/势垒/电流/炉Digitalcircuit数字电路Dimension(1)尺寸(2)量钢(3)维，度Diode二极管Dipoledomain偶极畴Dipolelayer偶极层Direct-coupling直接耦合Direct-gapsemiconductor直接带隙半导体Directtransition直接跃迁Directionalantenna定向天线Discharge放电Discretecomponent分立元件Disorder无序的Display显示器Dissipation耗散Dissolution溶解14Distribution分布Distributedcapacitance分布电容Distributedmodel分布模型Displacement位移Dislocation位错Domain畴Donor施主Donorexhaustion施主耗尽Dopant掺杂剂Dopedsemiconductor掺杂半导体Dopingconcentration掺杂浓度Dose剂量Double-diffusiveMOS(DMOS)双扩散M