PCB 流程基础介绍

WorldClassQualityCONFIDENTIALUnimicron0NATIONALQUALITYAWARDPCB流程基礎介紹：KevinHsiehDate：2010/07/24WorldClassQualityCONFIDENTIALUnimicron1NATIONALQUALITYAWARD結構名詞定義ThroughHoleMicroViaSkipViaBuriedVia1stLam3rdLamCoreP/PP/PTrace2ndLamWorldClassQualityCONFIDENTIALUnimicron2NATIONALQUALITYAWARD產品型態1.PCB2.HDI3.VIP4.BackdrillWorldClassQualityCONFIDENTIALUnimicron3NATIONALQUALITYAWARD產品型態(PCB)WorldClassQualityCONFIDENTIALUnimicron4NATIONALQUALITYAWARD38LayerBackpanel12A6APanelThickness:0.375”SmallestHoleSize:0.016”AspectRatio:23.4:1SurfaceFinish:IMMERSIONTINWorldClassQualityCONFIDENTIALUnimicron5NATIONALQUALITYAWARD產品型態(HDI)WorldClassQualityCONFIDENTIALUnimicron6NATIONALQUALITYAWARD12LayerHDIPanelThickness:0.071”SmallestHoleSize:0.006”AspectRatio:11.8:1SurfaceFinish:IMMERSIONTINWorldClassQualityCONFIDENTIALUnimicron7NATIONALQUALITYAWARD18Layer–HDI47001PanelThickness:0.100”SmallestHoleSize:0.006”AspectRatio:16.7:1SurfaceFinish:IMMERSIONSILVERWorldClassQualityCONFIDENTIALUnimicron8NATIONALQUALITYAWARD16LayerSequentialLamPanelThickness:0.065”SmallestHoleSize:0.0098”AspectRatio:6.6:1Impedance:+/-10%SurfaceFinish:IMMERSIONSILVERWorldClassQualityCONFIDENTIALUnimicron9NATIONALQUALITYAWARD12LayerHDIDIMMPanelThickness:0.050”SmallestHoleSize:PTH0.010”/Blind0.006”/Buried0.010”AspectRatio:PTH5:1/Blind0.8:1/Buried2.1:1LineWidth/Spacing:3.0mils/3.1milsImpedance:±10%SurfaceFinish:ImmersionGoldHDILevel:BlindL1/L2BuriedL1/L6&L7/L12SequentialLam:TwiceLaminationWorldClassQualityCONFIDENTIALUnimicron10NATIONALQUALITYAWARD18LayerBackpanel+HDIPanelThickness:0.197”SmallestHoleSize:PTH0.018”/Blind0.006”AspectRatio:PTH10.9:1/Blind0.7:1LineWidth/Spacing:4.8mil/3.9milImpedance:+/-10%SurfaceFinish:ENIGHDILevel:BlindL1/L2&L17/L18BuriedL2/L9&L10/L17&L2/L17WorldClassQualityCONFIDENTIALUnimicron11NATIONALQUALITYAWARD產品型態(VIP)WorldClassQualityCONFIDENTIALUnimicron12NATIONALQUALITYAWARDViaInPad(VIP)!VIPinSMTPad!VIPw/DogBone!Type1!Type2WorldClassQualityCONFIDENTIALUnimicron13NATIONALQUALITYAWARDWorldClassQualityCONFIDENTIALUnimicron14NATIONALQUALITYAWARD24LayerBackpanel+VIPS0382PanelThickness:0.094”SmallestHoleSize:0.010”AspectRatio:9.4:1Impedance:+/-10%SurfaceFinish:IMMERSIONSILVERWorldClassQualityCONFIDENTIALUnimicron15NATIONALQUALITYAWARD產品型態(Backdrill)WorldClassQualityCONFIDENTIALUnimicron16NATIONALQUALITYAWARDBACKDRILLINGWorldClassQualityCONFIDENTIALUnimicron17NATIONALQUALITYAWARDAMPHENOLCONNECTORDrilltypedescription–BackdrillingafterplatingDrilltypedescription--ControlleddepthdrillingbeforeplatingWorldClassQualityCONFIDENTIALUnimicron18NATIONALQUALITYAWARDL13L20L19Signal-Pin-Bottom-withBackdrillDepth2:L1-L18Signal-Pin-TopwithBackdrillDepth3:L38-L13L9L11L11Signal-Pin-BottomwithBackdrillDepth1:L1-L9AMPHENOLCONNECTORWorldClassQualityCONFIDENTIALUnimicron19NATIONALQUALITYAWARD28LayerBackpanel-BackDrillPanelThickness:0.280”SmallestHoleSize:0.01772”AspectRatio:16:1LineWidth/Spacing:5.35mils/3.95milsImpedance:±10%SurfaceFinish:ImmersionTinBackDrillLevel:15LevelsWorldClassQualityCONFIDENTIALUnimicron20NATIONALQUALITYAWARD32LayerBackpanel+BackDrill58007PanelThickness:0.260”SmallestHoleSize:0.028”AspectRatio:9:1LineWidth/Spacing:6.4mils/4.8milsImpedance:±10%SurfaceFinish:ImmersionTinBackDrillLevel:L1-L7L32-L13L32-L19L32-L25WorldClassQualityCONFIDENTIALUnimicron21NATIONALQUALITYAWARD線路製作流程銅箔基板鑽孔化銅+鍍銅影像轉移蝕刻防焊銅箔基板鑽孔化銅+鍍銅影像轉移蝕刻鍍銅,錫鉛防焊減除法半加成法WorldClassQualityCONFIDENTIALUnimicron22NATIONALQUALITYAWARDPCB製作流程發料內層壓合鑽孔化學銅外層電鍍SES防焊表面處裡電測目檢WorldClassQualityCONFIDENTIALUnimicron23NATIONALQUALITYAWARD1.下料裁板(PanelSize)COPPERFOILEpoxyGlassPhotoResist2.內層板壓乾膜(光阻劑)WorldClassQualityCONFIDENTIALUnimicron24NATIONALQUALITYAWARD3.曝光4.曝光後Artwork(底片)Artwork(底片)PhotoResist光源WorldClassQualityCONFIDENTIALUnimicron25NATIONALQUALITYAWARD5.內層板顯影PhotoResist6.酸性蝕刻(Power/Ground或Signal)PhotoResistWorldClassQualityCONFIDENTIALUnimicron26NATIONALQUALITYAWARD8.黑化(OxideCoating)7.去乾膜(StripResist)WorldClassQualityCONFIDENTIALUnimicron27NATIONALQUALITYAWARD9.疊板Layer1Layer2Layer3Layer4CopperFoilCopperFoilInnerLayerPrepreg(膠片)Prepreg(膠片)LAYER2LAYER3LAYER4LAYER5LAYER1LAYER6WorldClassQualityCONFIDENTIALUnimicron28NATIONALQUALITYAWARD...COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板疊合壓合機之熱板壓合機之熱板COPPERFOIL0.5OZThinCore,FR-4prepregCOMPS0LD.prepregThinCore,FR-4prepregCOPPERFOIL0.5OZ疊合用之鋼板疊合用之鋼板WorldClassQualityCONFIDENTIALUnimicron29NATIONALQUALITYAWARD10.壓合(Lamination)11.鑽孔(Drill)墊木板鋁板WorldClassQualityCONFIDENTIALUnimicron30NATIONALQUALITYAWARD12.化學銅(PTH)13.外層壓膜(乾膜Tenting)PhotoResistWorldClassQualityCONFIDENTIALUnimicron31NATIONALQUALITYAWARD14.外層曝光(patternplating)15.曝光後(patternplating)WorldClassQualityCONFIDENTIALUnimicron32NATIONALQUALITYAWARD16.外層顯影17.線路鍍銅及錫鉛WorldClassQualityCONFIDENTIALUnimicron33NATIONALQUALITYAWARD18.去膜19.蝕銅WorldClassQualityCONFIDENTIALUnimicron34NATIONALQUALITYAWARD20.剝錫鉛21.防焊WorldClassQualityCONFIDENTIALUnimicron35NATIONALQUALITYAWARD22.防焊曝光23.綠漆顯影光源S/MA/WWorldClassQualityCONFIDENTIAL