PCBlayout规范

漢華光電Subject：PCBLayout規範Doc.No.：WI-033Initialeddate：2004.5.25Rev.ChangeDescriptionTotalPageReleaseDate1Firstrelease.31Concurredby:Dept.Q’tyReviewedDept.Q’tyReviewedDept.Q’tyReviewedPAD事業處1中心室鄭廠長1品質保證中心1BCD事業處1PDC產品開發中心1PAD機板部1PAGENO.12345678910111213141516171819202122232425Ver.AAAAAAAAAAAAAAAAAAAAAAAAADATE5/255/255/255/255/255/255/255/255/255/255/255/255/255/255/255/255/255/255/255/255/255/255/255/255/25PAGENO.26272829303132333435363738394041424344454647484950Ver.AAAAAADATE5/255/255/255/255/255/25ApprovedBy:PreparedBy:ReviewedBy:Coverpage保存：三年漢華光電Subject：PCBLayout規範DocNo:WI-033page1of31Revision:AContentpage保存：三年文件內容變更記錄Rev.日期變更原因變更內容12004.5.25第一次發行漢華光電Subject：PCBLayout規範DocNo:WI-033page2of31Revision:AContentpage保存：三年1.0目的提供PCBLayout時之依據，確保所Layout之PCB符合實際生產及相關標準，以期降低生產之困擾，使制程生產順暢。2.0適用範圍本公司生產之CD-ROM、MotherBoard、DVD-ROM、Router、LanCard、數位相機介面卡等所有產品皆適用之。3.0組織與權責3.1R/D部門負責PCB設計及規格制訂、並負責与PCB製作廠商之作業要求及技術規範，包括提供所需之文件檔案。3.2製造單位負責規格、資訊之提供及問題回饋。3.3品管單位負責執行檢驗作業。4.0名詞解釋4.1PCB:PrintedCircuitBoard4.2Layout:PCB設計製作4.3Dimension:mm(公制)mil(英制)1mil=0.0254mm5.0作業流程圖無6.0作業內容與程序6.1SMT部分漢華光電Subject：PCBLayout規範DocNo:WI-033page3of31Revision:AContentpage保存：三年6.1.1PCB尺寸規格6.1.2FiducialMark規格設定及位置6.1.2.1規格1----圓形D1：1.0mm(±10%)D2：2.0mm(±10%)6.1.2.2規格2----正方形D1:1.0mm(±10%)D2:2.0mm(±10%)6.1.3Layout時須注意事項6.1.3.1PCB上至少應有三個FiducialMark，若為雙面SMT則每面各要有三個以上(除ICMark外)，且不在同一直線上。6.1.3.2Fiducialmark中心距板邊為X=5mm(198mil)以上。三洋九洲松下YAMAHAEKRAE4EKRAX5MAXMINMAXMINMAXMINMAXMINMAXMINL46050360250450503501046010W360502502.0350503505046050T5.00.52.00.54.00.55.00.55.00.5LTWD1D2D1D2單位：mm漢華光電Subject：PCBLayout規範DocNo:WI-033page4of31Revision:AContentpage保存：三年6.1.3.3Fiducialmark以中心點3mm(120mil)範圍內不得有任何文字，Trace(線路)、PAD、VIA(通孔)，避免產生雜訊。6.1.3.4超過100PIN之ASIC如：QFP、BGA、Chip須於對角線上各加一顆Fiducialmark或在IC中心之位置加一mark點。6.1.3.5原則上mark設在PCB上而非板邊上，且四連板以上之PCB要防呆mark的位置設計，絕不允許Mark在板面上絕對對稱。漢華光電Subject：PCBLayout規範DocNo:WI-033page5of31Revision:AContentpage保存：三年6.1.4SMDLayoutSpec(規格)6.1.4.1SMD瓷片電容、電阻SOLDERLAND/焊墊面積/SOLDERPASTEPATTERN錫膏模型SOLDERRESISTPATTERN防焊區模型OCCUPIEDAREA佔據面TRACKSorDUMMYTRACKS軌跡線下表為在SMT及DIP兩種情況下之不同規格REFLOWSOLDERING/SMT迴流焊SIZEFOOTPRINTDIMENSIONSINMM/引腳尺寸(mm)PROCESSINGREMARKS製作注意事項PLACEM.ACC公差ABCDEFG02010.950.250.350.350.001.40.8+/-0.0504021.50.40.550.550.002.11.3+/-0.0506032.300.500.900.900.002.701.70+/-0.1008052.800.900.951.400.453.202.10+/-0.1012064.002.001.001.801.404.402.50+/-0.1512104.002.001.002.701.404.403.40+/-0.15WAVESOLDERING/DIP波峰焊SIZEFOOTPRINTDIMENSIONSINMM/引腳尺寸(mm)PROCESSINGREMARKS製作注意事項PLACEM.ACC公差ABCDEFG02011.350.50.350.350.002.01.1+/-0.0504022.00.80.550.550.002.51.7+/-0.0506032.700.900.900.800.003.202.101+/-0.1008053.401.301.051.300.204.302.701+/-0.1012064.802.301.251.701.255.903.203+/-0.1512105.302.301.502.601.256.304.203+/-0.15BAFCEDG漢華光電Subject：PCBLayout規範DocNo:WI-033page6of31Revision:AContentpage保存：三年6.1.4.2SMD鉭質電容ESOLDERLAND/焊墊面積/SOLDERPASTEDGPATTERN錫膏模型SOLDERRESISTPATTERN防焊區模型OCCUPIEDAREA佔據面積FTRACKSorDUMMYTRACKS軌跡線下表為在SMT及DIP兩種情況下之不同規格REFLOWSOLDERING/SMT迴流焊SIZEFOOTPRINTDIMENSIONSINMM/引腳尺寸(mm)PROCESSINGREMARKS製作注意事項PLACEM.ACC公差ABCDEFGTAN.A4.001.801.101.200.904.402.30+/-0.15TAN.B4.301.801.252.000.904.703.30+/-0.15TAN.CC6.803.201.802.402.307.204.00+/-0.15TAN.DD8.304.701.803.303.808.705.00+/-0.15TAN.E8.004.002.003.003.208.404.70+/-0.15WAVESOLDERING/DIP波峰焊SIZEFOOTPRINTDIMENSIONSINMM/引腳尺寸(mm)PROCESSINGREMARKS製作注意事項PLACEM.ACC公差ABCDEFGTAN.A5.901.902.002.600.756.404.002+/-0.15TAN.B6.501.902.302.600.757.005.30+/-0.15TAN.C9.903.303.303.202.1010.46.60+/-0.15TAN.D11.84.803.504.303.6012.38.00+/-0.15TAN.E11.54.103.704.003.0012.07.70+/-0.15CBA漢華光電Subject：PCBLayout規範DocNo:WI-033page7of31Revision:AContentpage保存：三年6.1.4.3SMDMELF二極管SOLDERLAND/焊墊面積/SOLDERPASTEPATTERN錫膏模型SOLDERRESISTPATTERN防焊區模型OCCUPIEDAREA佔據面積TRACKSorDUMMYTRACKS軌跡線下表為在SMT及DIP兩種情況下之不同規格REFLOWSOLDERING/SMT迴流焊PACKAGETYPEFOOTPRINTDIMENSIONSINMM/引腳尺寸(mm)PROCESSINGREMARKS製作注意事項PLACEM.ACC公差ABCDEFGSOD804.302.301.001.701.904.702.50+/-0.15SOD874.302.301.002.101.904.702.90+/-0.15SOD87S4.302.301.001.601.904.702.30+/-0.15WAVESOLDERING/DIP波峰焊PACKAGETYPEFOOTPRINTDIMENSIONSINMM/引腳尺寸(mm)PREFEREDSOLDERINGDIRECTIONPLACEM.ACC公差ABCDEFGSOD804.902.701.101.702.106.302.90+/-0.15SOD874.902.701.102.102.106.903.50+/-0.15SOD87S4.902.701.101.502.106.002.60+/-0.15AFBBBCDGE漢華光電Subject：PCBLayout規範DocNo:WI-033page8of31Revision:AContentpage保存：三年6.1.4.4SMDICSmallOutlineSOP8–SOP32SOLDERLAND/SOLDERPASTE焊墊面積/錫膏模型SOLDERRESISTPATTERN防焊區模型OCCUPIEDAREA佔據面積DIP波峰焊SOLDERLAND/SOLDERCPASTE焊墊面積/錫膏模型AABFSOLDERRESISTPATTERN防焊區模型OCCUPIEDAREA佔據面積BOARDDIRECTION(PCB流向)DURINGWAVESOLDERING(雙波峰錫爐)AFBCG0.601.27(N-2)XENLARGEDSOLDERLAND(擴大焊點面積)0.601.27(N-2)XG1.200.30漢華光電Subject：PCBLayout規範DocNo:WI-033page9of31Revision:AContentpage保存：三年REFLOWSOLDERING(SMT迴流焊)PACKAGETYPE(包裝形式)ENVELOPESPEC.(封裝規格)NFOOTPRINTDIMENSIONSINMM(引腳尺寸)PLACEMENTACCURACY(公差)ABCFGSO-8SOT96-186.604.001.307.005.50+/-0.25SO-8LSOT176-1811.008.001.5011.408.40+/-0.25SO-14SOT108-1146.604.001.307.009.30+/-0.25SO-16SOT109-1169.005.501.307.0010.50+/-0.25SO-16LSOT162-11611.008.001.5011.4010.90+/-0.25SO-20LSOT163-