手机基本结构介绍

手機的基本結構介紹內容提要一.手機基本結構介紹;二.手機零件介紹;三.手機設計開發流程簡介;四.手機測試驗證簡介手機基本結構介紹手機結構魚骨圖介紹;手機結構爆炸圖分析;.翻蓋型手機(ClamPhone).直板型手機(Candybar)天線模組連接器模組(I)電路板模組IML機殼多媒體卡連接器ShieldingCan電路板(PCB)SIM卡連接器天線組件振動器按鍵模組顯示模組塑膠機殼模組遮蔽模組手機機構組件EMI墊片開關/接鍵IMD機殼EMI處理多色異材設出鏡片防塵墊單色烤漆雙色烤漆電鍍處理IMLkeyPadPlastic+RubberMulti-pointmoldingLaser刻字LCD連接器RubberSD卡連接器電池連接器電源插口語音插口腔輸入輸出端口多色射出(異材)主動元件被動元件Camera其子電子元件LCDTouchScreen陣列天線EMIFormINPlace麥克風Speaker面型天線線型天線ShieldingStripEMISputteringEMIhousingEMIGasket反射薄膜光源LightguideMetaldome振動器連接器連接器模組(I)麥克風連接器觸摸開關Volume連接器Speaker連接器7手機機構組件魚骨圖手機結構爆炸圖分析---翻蓋型專案名稱:ZUMA市場定位:Hightier自動翻蓋手機(2.0MCamera﹑MP3﹑AGPS﹑BLUTOOTH)產品客戶:SpringNextel/BoostMobileAnt_launch__holderAnt_launchBaker_Side_button_(withadhesive)SideButtonTopButtonSpeak_grill_leftvibratorMain_PCBSD_connectorAGPS_carrierAGPSelementHousing_frontSpeakerFeltRightSpeakerFeltLeftMain_keypadSpeakerGrill_rightSwitch_PTTButtonMylar-Antenna_Blue_toothAntenna_Blue_tooth_carrierLatch_SIMDoorDoor_SIMConnectorBaseScrewPlugLeftAntennaBacker_TOPButton(withadhesive)HingeHingePushButton(withadhesive)HingePushButtonCapSwitch_ButtonsTOPMylarSD_Baker(withADH)Backer_SIM(withadhesive)Base_flexSpeaker-HSGSeal_BackAcousticBatteryFloorPin_SIMConnectorADH_speaker_HSGBaseScrewPlugRightBaseScrew(4)Antenna_screwSpring_BatteryDoorLatchBattery_cover_HSGAudiojacksealSeal_AccessoryConnectorLatch_BatteryCoverBatteryHousing_backSpeaker(withadhesive)Housing_AudiojackconnectorBatterybumper-Main_keypad_MylarZUMA_bottom_viewZUMA_top_viewLens_InnerADH_Lens_InnerScrew_flip(4)Transducer_feltmagnetFlip_inner_HSGCamera_shieldTransducercameralensFlip_outerFlip_outer_HSGMp3_Button_downBoostlogolightguideFelt_Flipouter(with_adhesive)Grill_flip_outerLens_flashOuter_Lens_ADHCamera_PORON_pad(withadhesive)(2)Camera_lens_adhesiveLCD_bezelSuper_flex_bareTransducer_GrillCamera_lensPORON_CID(withadhesive)Bushing_screw_insert(4)_HOS_pad(withadhesive)Mp3_Button_down_MylarMp3_Button_up_MylarMp3_Button_upCID-LCD_ASSLCD_bezel_poron(withADH)手機結構爆炸圖分析---直板機專案名稱:KingfisherII市場定位:LowTier(帶AGPS功能)產品客戶:BoostMobilelensFronthousingSidekeyMic_asmKeypadTransducerasmLcdgasketMainPCBJacksealAcousticsealspeakerVibratorasmAntennacapGPSantennaBackhousingBatterydoorSim_trayBumpGPSstopperAntennaCoilAntennacushionFeltspeakerLCDmoduleLCDframeKingfisher2masterassembly手機零件介紹Uniqueparts---Plasticparts;---Metalparts;---Diecutparts;---Rubberparts;Commonparts---ElectricModulePlasticparts---uniques常用材料:一般採用PC,PC+ABS,IXEF,Thermotuf,PMMA,ABS等等;主要應用零件:殼體類零件,支架類零件,導光件,鏡片等等;製造工藝:主要是模具射出成型;表面處理一般用烤漆,電鍍,電鑄,IML/IMD,燙印,水轉印,移印等等;尺寸型狀要求:形狀較複雜,尺寸精度較高.Metalparts---uniques常用材料:不鏽鋼板材,鎂合金,鋁合金,線材,鍍鋅板等等;主要應用零件:殼體類零件,支架類零件,屏蔽罩,彈簧,軸類以及螺絲等等;製造工藝:沖壓成型,壓鑄成型,機加工等等;表面處理一般用電度,陽極,拋光,拉絲,蝕刻,移印,鑽雕等等;尺寸形狀要求:形狀可以較複雜,尺寸精度較高.Rubberparts---uniques常用材料:Siliconrubber,TPU等等;主要應用零件:按鍵,密封件,緩衝件,以及用於雙色成型等等;製造工藝:注射成型,模壓成型等等;表面處理一般用烤漆,鐳雕等等;尺寸形狀要求:形狀可以較複雜,但尺寸精度一般.Diecutparts---uniques常用材料:泡棉,背膠,貼紙,薄塑膠板材,保護膜,Film等等;主要應用零件:密封件,緩衝件,外觀貼紙標簽,表面保護膜等等;製造工藝:模具沖切,鐳射切割;尺寸形狀要求:形狀簡單;模具沖切的尺寸精度較低,鐳射切割的精度高,但成本也高,不具備量產性能.Electricalmodule---commonpartsEM零件---電子機構件,電子和結構同時管控的零件.具體如下:AudioJack---音頻接口Batteryconnector---連結電池和主板,電池給主板供電Batterychargeconnector---充電器和數據線接口.Electricalmodule---commonpartsKeypadMylarDome---Keypadswitch,按鍵開關Mylar+Adhesive+DomeMic---麥克風,Electricalmodule---commonpartsFlex---軟板,起柔性連結作用.SDconnector---SD卡基座Electricalmodule---commonpartsSIMconnector---SIM卡連接器.Vibrator---震動馬達,手機震動時動力來源.Speaker---喇叭Electricalmodule---commonpartsCameraFlash---攝相頭閃光燈Camerasocket---攝相頭基座HingeFlex---軟板,起柔性連結作用.Electricalmodule---commonpartsCID---(CallIndicatorDisplay)外部顯示屏Camera---攝相頭Transducer---(Receiver)音蘋轉換器.Electricalmodule---commonpartsLCD---(Liquidcrystaldisplay)主顯示屏手機設計開發流程簡介Pre_MasterfilereceivedfromMotorolaFeasibilitystudy/ConceptdesignRefine/CompleteIDmasterfileAAR(ArchitectureAcceptanceReview)ConceptdesignreviewIDmasterlockdownIDRenderingIDRenderinglockdownCMFCMFSignoffDetaildesignAnalysis(Interferencecheck,TA,simulation,etc)CDR(Criticaldesignreview)FinaldesignreviewToolingreleaseProcesscheck(SOP/fixturecheckMockupsamplesIDmasterlockdownFOTAssemble(LV/LX)ABC/ALTTESTPilotbuildRampupSAdatabasechangesECNDMAIC/ANALYSISProcesscheck(SOP/fixturecheck手機可靠性驗證可靠性驗證是手機設計開發過程中必不可少的環節,它是通過在惡劣環境下加速老化來檢測手機和零件的性能.手機可靠性驗証簡介溫濕度,鹽霧,滴水,輻射,砂塵按鍵,轉軸耐久性測試跌落,彎曲,振動通訊信號參數檢驗手機開發驗證測試手機驗証項目(環境應力驗證)高溫試驗低溫試驗高溫高濕試驗溫濕度循環試驗冷熱沖擊試驗陽光老化試驗冷凝試驗鹽霧試驗雨淋試驗砂塵試驗紫外光試驗抗化學試驗手機驗証項目(機械應力驗證)振動沖擊試驗自由跌落試驗按鍵耐久性試驗翻蓋耐久性試驗表面耐磨試驗扭力彎曲試驗拉拔力試驗天線抗彎試驗測試卡壽命試驗電池觸點壽命測試充電器壽命測試表面划傷試驗RF(RadioFrequency)參數測試(GSM)--相位差,頻譜,峰值功率,接受品質.機械&電性能檢查--開關機,LCD&LED顯示狀況,按鍵及菜單正常,麥克風,蜂鳴器,振動器,充電功能等.目視檢查--機構外觀件不允許有任何划痕﹑破裂或者變形.手機驗証項目(功能驗證)