sdin7du2(MX3闪存芯片)

Ultrae.MMC4.41I/FReleasedDataSheet80-36-03666V1.2May2012SanDiskCorporationCorporateHeadquarters•601McCarthyBoulevard•Milpitas,CA95035Phone[phone]•Fax[phone]©2012SanDiskCorporation-2-80-36-03666REVISIONHISTORYDoc.NoRevisionDateDescriptionReference80-36-036660.122-Jan-12Preliminary80-36-036660.220-Feb-12UpdateExportedCapacity80-36-036661.029-May-12-UpdateBootandRPMBdefaultsize-AddedPowerOffNotificationfeature80-36-036661.130-May-12-FixTyposonEXT_CSDRegister:PWR_CL_DDR_52_360PWR_CL_26_360PWR_CL_52_360MAX_ENH_SIZE_MULTINI_TIMEOUT_APPOWER_CLASSWR_REL_SET80-36-036661.230-May-12-UpdateSanDiskJapanofficecontactinfoSanDisk®Corporationgeneralpolicydoesnotrecommendtheuseofitsproductsinlifesupportapplicationswhereinafailureormalfunctionoftheproductmaydirectlythreatenlifeorinjury.PerSanDiskTermsandConditionsofSale,theuserofSanDiskproductsinlifesupportapplicationsassumesallriskofsuchuseandindemnifiesSanDiskagainstalldamages.See“DisclaimerofLiability.”Thisdocumentisforinformationuseonlyandissubjecttochangewithoutpriornotice.SanDiskCorporationassumesnoresponsibilityforanyerrorsthatmayappearinthisdocument,norforincidentalorconsequentialdamagesresultingfromthefurnishing,performanceoruseofthismaterial.Nopartofthisdocumentmaybereproduced,transmitted,transcribed,storedinaretrievablemannerortranslatedintoanylanguageorcomputerlanguage,inanyformorbyanymeans,electronic,mechanical,magnetic,optical,chemical,manualorotherwise,withoutthepriorwrittenconsentofanofficerofSanDiskCorporation.AllpartsoftheSanDiskdocumentationareprotectedbycopyrightlawandallrightsarereserved.SanDiskandtheSanDisklogoareregisteredtrademarksofSanDiskCorporation.Productnamesmentionedhereinareforidentificationpurposesonlyandmaybetrademarksand/orregisteredtrademarksoftheirrespectivecompanies.©2012SanDiskCorporation.Allrightsreserved.80-36-03666.May2012PrintedinU.S.A80-36-03666TableofContentsSanDiskiNANDe.MMC4.41I/F-DataSheet©2012SanDiskCorporation80-36-036663TABLEOFCONTENTS1.Introduction....................................................................................................................51.1.GeneralDescription.................................................................................................51.2.Plug-and-PlayIntegration.........................................................................................51.3.FeatureOverview.....................................................................................................61.4.FunctionalDescription..............................................................................................71.5.TechnologyIndependence.......................................................................................71.6.DefectandErrorManagement..................................................................................71.7.MMCbusandPowerLines.......................................................................................81.7.1.Busoperatingconditions.............................................................................................82.e.MMC4.41FeaturesOverview.....................................................................................102.1.ConfigurableBootpartitionsSize............................................................................102.2.AutomaticSleepMode...........................................................................................102.3.Sleep(CMD5)........................................................................................................102.4.EnhancedReliableWrite........................................................................................102.5.SecureErase.........................................................................................................102.6.SecureTrim...........................................................................................................112.7.Trim.......................................................................................................................112.8.Partitionmanagement............................................................................................112.9.EnhancedWriteProtection.....................................................................................122.10.HighPriorityInterrupt(HPI).....................................................................................122.11.PowerOffNotification.............................................................................................122.12.H/WReset.............................................................................................................122.13.DDRI/F.................................................................................................................123.ProductSpecifications.................................................................................................133.1.TypicalPowerRequirements..................................................................................13