Basic-Die-Bond-Process

BasicDieBondProcessTableofContentIntroductionTypicalDieBondingSequenceDispensingDiePickingDieBondingIntroductionBasicDieBondProcess:ToattachthediestothepadsonthesubstratesIntroductionCommonDieBondProcessesEpoxydiebondingEutecticdiebondingSoftsolderdiebondingTypicalDieBondSequenceStep1:DispensingStep2:DiePickingStep3:DieBondingStep1:StackLoaderSubstrateCommonlyusedsubstratesPCBLeadframeBGACeramicWaferDifferenttypeofwaferring/frame/wafercassetteWafercassetteDiscoK&SWaferringDiscoK&STeflonDcompanyKcompanyDifferenttypeofwafertapematerialMylartapeUVtapeWafflepackBlueMylarTapeColorlessUVTapeWaferFactorsdeterminethedegreeofuniformityofwafertapeDiesizeLargediesizehaveabettertackinessSurfacefinishofthewaferbackSmoothsurfaceofwaferbackhavehighertackinessDurationofdieadhesiontowafertapeThelongerthedieareonthetape,themoretheyadhereWaferFactorsdeterminethedegreeofuniformityofwafertapeExposuretoUVlightThelongertheexposuretoUVlight,thelesstheyadhereStorageconditionItshouldbestoredinamoderateconditiontemp:10-25Chumidity:60-70%TapemountingprocessamountoftensionshouldbeeveninbothX&YdirectionWaferDispensingTime-Pressure-VacuumVolumetricStamping(RotatingDisc)Tool:-Epoxywriting-ShowerHeadTool:-StampingPinDispensingPropertyAblestikAblebond841-LMISR4QMIQMI509HitachiHitachi4730SumitomoSumitomoCRM-1575CFillerSilverSilverSilverSilicaViscosity8000cps@25C9000cps@25C89Pa.s@25C22Pa.s@25CThixotropicIndex5.63.55.12.8WorkLife18hours@25C48hours@25CN/A48hours@25CConductivityConductiveConductiveConductiveNon-conductiveRecommendedCureCycle1hour@175C15mins@150C60sec@200C3mins@150CDieShearStrength3500psi@25C(for80sq.mils)36kgf@25C(for300sq.mils)11.39Mpa@200C(for80sq.mils)15.7RT@200CEpoxyTypeDispensingBackgroundInformation-EpoxyFunctionofepoxyAdheresthedieonsubstrateCommonly-usedepoxyTypicalPropertyTime-Pressure-VacuumSystemAprocessoftheapplicationofcompressedairinapresetperiodforthefluiddispensingApplyVacuumforremovingthecompressedairMaintainthepressurePreventdripping&suckbackDispensingMethod–Time-Pressure-VacuumSyringewithepoxyVacuumPressureDrawBacksDispensingvolumeepoxyviscositySyringeInternalpressureepoxylevelAirvolumeinsidethesyringechangesfordifferentepoxylevelResponsetimefor“vacuum-suction”and“air-compression”isthuschangingwithepoxylevelIfthevacuumlevelisnotadjustedproperly,“epoxydripping”&“sucking-inofairbubbles”mayoccureasily.DispensingMethod–Time-Pressure-VacuumTime-Pressure-dispenser(fromMusashi)Musashidispensingsystemcancompensateepoxylevelchangeinsyringebyreal-timemonitoringontheactualpressureresponseNeedtopreparea“full”syringeandan‘empty”syringeinordertoteachthedispenserhowtocompensateTheTP-dispenserwillthenadjustthe“dispensingtime”&“vacuumlevel”accordinglytocompensateforanychangeinsyringeepoxylevelUsercanset“epoxylevelalarm”toavoidrunningoutofepoxyduringproductionrunDispensingMethod–Time-Pressure-VacuumDispensingMethod–Time-Pressure-VacuumMusashiConnecttosyringeVolumetricDispensingProcessPrinciplePositiveDisplacementSystem(PistonPump)ApplycompressedairPullupthepistontofeedepoxyintothechamberSwitchthevalveportPistonispushedtodispenseepoxyDispensingMethod-VolumetricValveChamberPistonSyringe2-positive-displacementpumpsdispensingCycleDispensingfinishesatleftchamberandrightchamberisfilledLeftchamberisfilledupandrightchamberfinishesdispensingValveswitchesDispensingMethod-VolumetricValveswitchesSwitchingvalvePumpbodyPartstobewashedDispensingMethod-VolumetricDispensingMethodologyVolumetricDispensingAdvantagesTruepositivedisplacementdispensingNodrippingInconsistencycomesfrompistonpositionerrorandepoxycompressibilityonlyHighaccuracyDrawBacksSlowepoxyfeed-inrateComplicateddesignandlongertime&costlymaintenanceDispensingTool-WritingL/FPadDispenserL/FAnvilBlockEpoxyDispensingTool-WritingAprocesstodispensetheepoxyontotheleadframewithprogrammabletrajectorytodrawadispensingpatternaccordingtothegivendiesizeAdoptedtowiderangeofdiesize:60x60~1000x1000milsDispenserX,Y,ZMotionDispensingTool-WritingAdvantagesFlexiblefordifferencediesizeEasytocontrolepoxycoverageEasytocontroldietiltandBLTToolsDrawbacksSlowwriting,maydecreaseUPHDispensingTool-Writing03/19/2003DBD-AR-2003-002A400.511.522.50510152025ChipSize[mm]DispenseTime[sec]200milDispensingtimeagainstChip-package/Diesize800milDispensingTool-WritingDispensingTool-WritingL/FPadDispensingTool–ShowerHeadShowerHeadDispensingAprocessfordispensingtheepoxyontotheleadframewithafixeddispensingpatternofepoxydotsspeciallydesignedforaparticularrangeofdiesizePractical/applicablerangeofdiesizeforshowerheaddispensing:30x30~150x150milsDispenserYandZMotionDispensingTool–ShowerHeadAdvantage:IncreasingUPHforsmalltomedium-sizediebondingprocessDrawback:Difficulttoset-uptogetaconsistentresultsforallpadsNozzleholesblockageDispensedSamplesDispensingTool–ShowerHeadDispensingMethod-StampingAprocessfordispensingtheepoxyontotheleadframewithadispensedepoxydotaccordingtothestampingpinsizeTypicalrangeofdiesizefortheusageofepoxystampi