高频大功率开关电源结构的热设计_何文志

20132Vol.28No.2282TRANSACTIONSOFCHINAELECTROTECHNICALSOCIETYFeb.2013510641FLOTHERM15V/2kATM46,TM403ThermalDesignofHighFrequencyHighPowerSwitched-ModePowerSupplyHeWenzhiQiuDongyuanXiaoWenxunZhangBoSouthChinaUniversityofTechnologyGuangzhou510641ChinaAbstractAsthepowerdensityofhighfrequencyhighpowerswitched-modepowersupplyincreasescontinuously,reasonablethermaldesignbecomesaprerequisitetoensurethereliabilityofpowersupply.Thispaperpresentsageneralthermaldesignmethodanddescribeshowtodesignfansandheatsinksindetail.Inordertooptimizethestructureofthepowersupply,thethermalfieldinthepowersupplyissimulatedbyFLOTHERM.Thepracticalityoftheproposeddesignmethodisverifiedbya15V/2kAhigh-frequencyswitched-modepowersupplyinthepaper.KeywordsThermalanalysis,switched-modepowersupply,fan,heatsink1[1,2][3,4][5,6]ANSYSICEPAKFLOTHERMANSYS[7]ICEPAKFLOTHERM[8-10]ICEPAKPCB[11]FLOTHERM[12]FLOTHERM15V/2kAFLOTHERM(50937001)50877028511070452011-05-052012-01-12186201322123412345315V/2kA3.11380V15V/2kAIGBT21Fig.1Themainstructureofhighfrequencyhighpowerswitched-modepowersupply3.1.1380V540V6RI100G-160PR-PR=250W3.1.21IGBTIGBTPIGBTPionPioffPisIGBTionioffisPPPPonconcesoffsionioff0.5()IUIUfEE1fsonIGBTUonUoffIGBTIcIcesIGBTEionEioffIGBTPFDPdonPdoffFDdondoffond(AV)fdrdrd(0.5)0.5PPPIUIU22821870.5onUfdUrdId(AV)Ird540V15V/2kA22:1IGBT90ABSM150GB120DN2IGBTIGBTIGBTIGBTIMIGBTFD2PPP3fs=17kHzon=0.33Uon=2.5VUoff=Urd=540VUfd=2.3VIc=90AIces=Ird=8mAId(AV)=63.5AEionEioff=7mWs13IGBTPIM=440.5W3.1.3PFePCuBmfsPvVPFe[13]FevPVP422Cu1122PIRIR5I1I2R1R21mt11p1NLRA62mt22p2NLRA7N1N2Lmt1Lmt2Ap1Ap247PT221mt12mt2Tv12p1p2NLNLPVPIIAA81I1=45AI2=1kA154mm×80mm×45mmV=612cm3Pv=80mW/cm3=0.0179mm2/mN1Lmt1=4.5mN2Lmt2=0.24mAp1=12.56mm2Ap2=156.8mm2PT=89W3.1.4PDPdfPdrPdsDdfdrdsdfrrrrsrmr0.5PPPPIUIUtfIU9UfUrIdIrIrmtrr2kA400AMBRP400100CTL1416Uf=0.83VUr=48VId=250AIr=12mAIRM=2Atrr=2s(9)PD=115W11Tab.1Distributionofthelossesonfullloadoperation/W/W6RI100G-1601250250BSM150GB120DN22440.5881H154*80*45289178MBRP400100CTL1611518403.23.2.113149W70[14]188201321121IGBT2CbIGBTIGBT34IGBTIGBT2Fig.2Thestructuremodelofinverterpart3.2.2mpQqtC10qmkg/sQWCpJ/(kg·k)Cp=1005J/(kg·k)t1vm60qq11qvm3/minγkg/m3γ=1.23kg/m3IGBT1131W2550t=2510112.2m3/min3.6m3/min2413m3/min200FZY23Dqvvchvch60qvS12vchm/sSm2200FZY23DD=200mmVch-max=6.9m/s3.2.3IGBT1hhtRP13thPW3870th=32(13)Rh=0.028/WLmLWmWLm=LWmW3a3bn1n2n3282189(a)(b)3Fig.3Structureandequivalentthermalmodelofheatsinkn11qs-a1th-dth-finth-A1()2RRRRn14th-dmbRWLkth-finaRdLkth-A1RhLaWmLabdkh[15]hufNkhs15skfkf=0.027W/m·kNuNusseltesruesres1333*1*3*3.650.66412RPNRPR16PrPr=0.7R*esesches2*RsvsRLvL17Resvchm/svv=1.86×105Pa·sLn2qs-a22222()()()()nnnnR18th-deth-deth-deth-finth-A[2()]2RRRRRth-deth-deth-deth-finth-A[2()]2RRRRRth-desdRbLkth-deth-finth-A1()2RRRn3qs-a3Rn2qs-aqs-a1qs-a2qs-a3////RRRR1970mmIGBTWm=106mmW180mmk=225W/m·kL=420mmb=15mmd=1mms=2mma=90mmIGBTWm=106mmn1=35W180mmn3=25n2n20W=180+3n2(mm)vch-minShshs13()Snnas12vch-min=2.5m/svch-minvch-maxvch=4.9m/s1419n2=10210mm0.028/W4FLOTHERM4.1FLOTHERM19020132IGBT255Fig.5Thethermalsimulationmodelofpowersupply4.24.1210mm180mm10mm180mmFLOTHERM6200mmn2=7200mm×90mm×420mm6Fig.6Heatsinkwidthvstemperature180mm×150mm×420mm4.3IGBT7ABCDIGBT707Fig.7Thesimulationresultsoftemperatureontheswitchingcomponents4.485Cu50IGBT722708Fig.8Thehigh-powerswitched-modepowersupplyprototype282191227Tab.2Temperaturecomparisonbetweenmeasurementandsimulationenvironmenttemperatureis27ABCD/67.558.164.448.9/68596752%11.43.13.85FLOTHERM[1]ErikCWdeJong,FerreiraJA,PavolBauer.Designtechniquesforthermalmanagementinswitchmodeconverters[J].IEEETransactionsonIndustryApplications,2006,42(6):1375-1386.[2],.[J].,2006,21(3):15-23.XuDianguo,LiXiangrong.Powerelectronicsinextremetemperatureapplications[J].TransactionsofChinaElectrotechnicalSociety,2006,21(3):15-23.[3],,,.IGBT[J].,2009,24(3):159-163.HuJianhui,LiJingeng,ZouJibin,etal.LossescalculationofIGBTmoduleandheatdissipationsystemdesignofinverters[J].TransactionsofChinaElectrotechnicalSociety,2009,24(3):159-163.[4],,.[J].,2004,32(6):775-778.ZhangZhouyun,XuGuoqing,ShenXianglin.Analyzinganddesigningofdissipationsystemofinverter[J].JournalofTongjiUniversity(NaturalScience),2004,32(6):775-778.[5]ChenWenhwa,ChengHsienchie,ShenHsinan.Aneffectivemethodologyforthermalcharacterizationofelectronicpackaging[J].IEEETransactionsonComponentsandPackagingTechnologies,2003,26(1):222-232.[6]HannemannR.Electronicsystemthermaldesignforreliability[J].IEEETransactionsonReliability,1977,26(5):306-310.[7],.ANSYS[M].:,2004.[8],,.[J].,2006,32(6):716-720.FuGuicui,WangXiangfen,JiangTongmi.Finitevolumemethodinthermalanalysisofavionics[J].JournalofBeijingUniversityofAeronauticsandAstronautics,2006,32(6):716-720.[9]QingFang,TsuchiyaT.Finitedifference,finiteelementandfinitevolumemethodsappliedtotwo-pointboundaryvalueproblems[J].JournalofComputationalandAppliedMathematics,2002,139:9-19.[10]FeistauerM,FelcmanJ,LukacovaMedvidovaM.Ontheconvergen