PCI_Express_CEM_r2.0

PCIExpress®CardElectromechanicalSpecificationRevision2.0April11,2007PCIEXPRESSCARDELECTROMECHANICALSPECIFICATION,REV.2.02RevisionRevisionHistoryDate1.0Initialrelease.7/22/20021.0aIncorporatedWGErrataC1-C7andE1.4/15/20031.1IncorporatedapprovedErrataandECNs.03/28/20052.0Addedsupportfor5GT/sdatarate.4/11/2007PCI-SIG®disclaimsallwarrantiesandliabilityfortheuseofthisdocumentandtheinformationcontainedhereinandassumesnoresponsibilityforanyerrorsthatmayappearinthisdocument,nordoesPCI-SIGmakeacommitmenttoupdatetheinformationcontainedherein.ContactthePCI-SIGofficetoobtainthelatestrevisionofthespecification.QuestionsregardingthisspecificationormembershipinPCI-SIGmaybeforwardedto:[e-mail]:503-619-0569Fax:[e-mail]essCardElectromechanicalSpecificationisprovided“asis”withnowarrantieswhatsoever,includinganywarrantyofmerchantability,noninfringement,fitnessforanyparticularpurpose,oranywarrantyotherwisearisingoutofanyproposal,specification,orsample.PCI-SIGdisclaimsallliabilityforinfringementofproprietaryrights,relatingtouseofinformationinthisspecification.Nolicense,expressorimplied,byestoppelorotherwise,toanyintellectualpropertyrightsisgrantedherein.PCI,PCIExpress,PCIe,andPCI-SIGaretrademarksorregisteredtrademarksofPCI-SIG.Allotherproductnamesaretrademarks,registeredtrademarks,orservicemarksoftheirrespectiveowners.Copyright©2002-2007PCI-SIGPCIEXPRESSCARDELECTROMECHANICALSPECIFICATION,REV.2.03Contents1.INTRODUCTION....................................................................................................................91.1.TERMSANDDEFINITIONS.....................................................................................................91.2.REFERENCEDOCUMENTS...................................................................................................101.3.SPECIFICATIONCONTENTS.................................................................................................111.4.OBJECTIVES.............................................................................................................................111.5.ELECTRICALOVERVIEW.....................................................................................................121.6.MECHANICALOVERVIEW...................................................................................................132.AUXILIARYSIGNALS........................................................................................................152.1.REFERENCECLOCK...............................................................................................................162.1.1.LowVoltageSwing,DifferentialClocks....................................................................162.1.2.SpreadSpectrumClocking(SSC)...............................................................................172.1.3.REFCLKACSpecifications........................................................................................182.1.4.REFCLKPhaseJitterSpecificationFor2.5GT/sSignalingSupport.......................212.1.5.REFCLKPhaseJitterSpecificationFor5GT/sSignalingSupport..........................222.2.PERST#SIGNAL......................................................................................................................222.2.1.InitialPower-Up(G3toS0).......................................................................................222.2.2.PowerManagementStates(S0toS3/S4toS0)..........................................................232.2.3.PowerDown...............................................................................................................242.3.WAKE#SIGNAL......................................................................................................................262.4.SMBUS(OPTIONAL)...............................................................................................................292.4.1.CapacitiveLoadofHigh-powerSMBusLines...........................................................292.4.2.MinimumCurrentSinkingRequirementsforSMBusDevices....................................302.4.3.SMBus“BackPowering”Considerations.................................................................302.4.4.Power-onReset..........................................................................................................302.5.JTAGPINS(OPTIONAL).........................................................................................................312.6.AUXILIARYSIGNALPARAMETRICSPECIFICATIONS...................................................322.6.1.DCSpecifications.......................................................................................................322.6.2.ACSpecifications.......................................................................................................333.HOTINSERTIONANDREMOVAL..................................................................................353.1.SCOPE....................................