QS9000 应用于半导体产业供应商管理架构之研究-以设计公司为例

283284ABSTRACTQS9000isimplementedmainlyinmanufacturingrelatedfactoriesbutfewinICdesigncompanies.Generally,ICdesigncompanieshavelessemploymentandmoresubcontractorsandtheirmanagementandcommunicationwithsubcontractorsisnotoptimum.ThepurposeofthisresearchistobuildbettersupervisionandcommunicationwithsubcontractorsandupgradecompetitionofICdesigncompaniesbyQS9000.ThisresearchfocusesonbuildingsuppliersmanagementinfrastructureinICdesigncompaniesbasedonQS9000byusingadvanceproductqualityplatting(APQP),productpartsapproveprocess(PPAP),statisticsprocesscontrol(SPC)…etc.ExamplesarealsointroducedtobethereferenceforimplementationandapplicationofQS9000andverificationofsuppliermanagementforcompanies.Keyword:QS9000APQP(AdvancedProductQualityPlanning)PPAP(ProductionPartApprovalProcess)SPC(StatisticalProcessControl)285zzzzz286(3)zzzz287/////288289290QS9000291292293Padinformationof_____________________Projectno:Device:PinNo.PadNamePinNo.PadName294CustomerPKG.TypeLeadcountDeviceno.Diesize1.(Bondingdiagramevaluation)Device:L/F:MILAUTOCAD(DevicewithL/F’sbondingdiagramwhichevaluationAutoCADasattachfigure.Pleasecheckandconfirm.)2.(ENGINEERCONFIRM)WAFERMOUNT:WIREBONDING:MOLDING:3.(EVALUATIONRESULT)PCS(TryRun)AvailableNon-availableSuggestTryrun4..:REMARKTHEAPPLYL/FTYPECloseL/F(L/F)OpenL/F(L/F)(ETCHINGSTAMPING)295NoticeNo:IssueDate:ReplyDue:D1.InformationProductionFlow:Feb.Assy.TestedotherProdType:DutyUnit:LotNo:LotSize:AbnormalQ'ty:D2.ProblemDescripition:D3.CARTeamApproachTeamLeader/Dept.:TeamMember/Dept.:D4.ContainmentAction/Item/Action/Resp./DueD5.IdentifyRootCauseInvestigation:A.What:/B.Machine/C.Why:/D.When:/E.Where:/F.Who:Attachment::D6.CorrectiveAction/Item/Action/Resp./DueD7.PreventionAction/Item/Action/Resp./DueApprovalQAManager:DutyManager:Checkby:Issueby:D8.QA/QAAction/EffectiveVerificationAttachment:QAManager:QAEng.:ClosedDate:296(ASS’Y)TELNO.FAXNO.MailaddressX=Y=MEMORYLOGICMIXSIGNAL:kpcs/M:kpcs/M:kpcs/M1.inch,:mil/m2.mappinginkdot,chipontray?:mil/mFollow1.*mm/mil2.LOC1.um/mil2.Xum/milChipInformationFATCpinassignment&1.LOC2.//////1.EIAJ(125)JEDEC(150)B.O.M1.TUBE:::2.TUBE:::kgg,g%%Sn,thicknessuinch1.mil/mm,2mil/mm4mil3mil?SPCQualityrequirement(),,Level1Level2Level3Reliabilityrequirementtray2mappingnotchinkdot’attest’3.ProcessrequirementDiecoating,297,(),:DCVDCV1.,2.mil/mm)?/,pcs/,pcs/:/,pcs/Pin1Pin1;°°°°PIN1EIAJJEDEC,(:;)Packingrequirement,B.O.M.,/,,,,,,(),ConfirmrequirementFMEAFMEAQCL/F()PINONE0°90°180°270°PINONE0°90°180°270°298CpkMONTHLYREPORT(For)MONTH:PACKAGETYPEPRODUCTIONPERIOD:PROCESSCTRLCHARTSPEC.S/SCpk%CpkAVGCpkFLOWITEMTYPELIMITFREQ.1.51.672=2=1.67CpkMAXMIND/SKERFWIDTHX-RmCHARTMAX.80um1READING/CHANGETYPED/BDIESHEARX-CHARTMIN.5KG3EA/MC/DAYBALLSHEARX-CHART25G10BALLS/MC/DAY4G(1.0mil)W/BwirepullX-CHART5G(1.2mil)10WIRES/MC/DAYMOLDMOLDTEMPX-RCHART162~1788POINTS/MC/DAYTHICKNESSX-RCHART300~8005POINTS/MC/DAYS/PCOMPOSITIONX-RCHART70~90%5POINTS/MC/DAYT/FCOPLANARITYX-RmCHARTMAX.3MIL5PCSMC/SHIFTTOTAL*D/S-KerfWidth,S/P-Thickness,Composition,T/F-Coplanarity:NAduetolotless2991.Kralovetz,R.G.,“Aguidetosuccessfuloutsourcing”,ManagementAccounting,1996,pp32~38.2.Kobielus,R.B.,“Evaluationtime”,NetworkWorld,1996,pp.48.3.Lowell,M.,“ManagementServicevendorinthefinancialserviceindustry,JournalofSystemManagement,1992,pp.23~26.4.AIAG”QualitySystemRequirementQS9000”,19985.AIAG”AdvancedProductQualityPlanningandControlPlan(APQP),1994300