PCIe M.2 接口规范 V1.0 接口定义

PCIExpressM.2SpecificationRevision0.7,Version1.0November27,2012PCI-SIG®disclaimsallwarrantiesandliabilityfortheuseofthisdocumentandtheinformationcontainedhereinandassumesnoresponsibilityforanyerrorsthatmayappearinthisdocument,nordoesPCI-SIGmakeacommitmenttoupdatetheinformationcontainedherein.ContactthePCI-SIGofficetoobtainthelatestrevisionofthisspecification.QuestionsregardingthePCICodeandIDAssignmentSpecificationormembershipinPCI-SIGmaybeforwardedto:[e-mail]:503-619-0569Fax:[e-mail]andIDAssignmentSpecificationisprovided“asis”withnowarrantieswhatsoever,includinganywarrantyofmerchantability,non-infringement,fitnessforanyparticularpurpose,oranywarrantyotherwisearisingoutofanyproposal,specification,orsample.PCI-SIGdisclaimsallliabilityforinfringementofproprietaryrights,relatingtouseofinformationinthisspecification.Nolicense,expressorimplied,byestoppelorotherwise,toanyintellectualpropertyrightsisgrantedherein.RevisionHistoryRevisionVersionHistoryDate0.3InitialDraftMay16,20120.5ThespecisstructurallyandcontentcompletewithalimitednumberofknownTBDparameters/itemsAugust1,20120.71.0ThespecisstructurallyandcontentcompletewithalimitednumberofknownTBDparameters/items.Texteditandnewtemplate.November17,2012PCIExpressM.2SpecificationPCIExpressM.2Specification|3Revision0.7,November27,2012TableofContents1.IntroductiontoM.2Electro-MechanicalSpecifications................................171.1.TargetedApplication......................................................................................................181.2.SpecificationReferences...............................................................................................192.MechanicalSpecification.................................................................................202.1.Overview.......................................................................................................................202.2.CardTypeNamingConvention.....................................................................................222.3.CardSpecifications........................................................................................................252.3.1.CardFormFactorsIntendedforConnectivitySocket1..........................................................262.3.1.1.Type2230Specification....................................................................................................262.3.1.2.Type1630Specification....................................................................................................292.3.1.3.Type3030Specification....................................................................................................312.3.2.CardFormFactorIntendedforWWANSocket2....................................................................322.3.2.1.Type3042Specification....................................................................................................322.3.3.CardFormFactorforSSDSocket2.......................................................................................332.3.3.1.Type2230Specification....................................................................................................332.3.4.CardFormFactorsforSSDSocket2and3............................................................................342.3.4.1.Type2242Specification....................................................................................................342.3.4.2.Type2260Specification....................................................................................................352.3.4.3.Type2280Specification....................................................................................................362.3.4.4.Type22110Specification..................................................................................................372.3.5.CardPCBDetails....................................................................................................................382.3.5.1.MechanicalOutlineofCard-Edge.....................................................................................382.3.5.2.ModuleKeying..................................................................................................................402.3.6.Soldered-downFormFactors..................................................................................................442.3.6.1.Type2226Specification....................................................................................................442.3.6.2.Type1216Specification....................................................................................................462.3.6.3.Type3026Specification....................................................................................................472.3.7.RFConnectors.........................................................................................................................492.3.7.1.Socket1&2RFConnectorPin-Out.................