usb_20_30__webinar_china_draft_0-9

1USBIP:Today’sChallenges,Tomorrow’sOpportunitiesTomLiu,ManagerCorporateApplicationsEngineer,Synopsys1•Introduction•USB2.0–WhatIsNew?–LinkPowerManagement–High-SpeedInter-Chip–BatteryCharging–OTG2.0•USB3.0Agenda2USBIs(EvenMore)Ubiquitous•2007-2.9billionunits•2008-3.1billionunits•AllmarketsegmentshaveUSB–DVDplayers,stereos,carstereos,DTVs•BackwardscompatibilityenablesforwardmomentumPortableDevices–LowerPower00.511.522.533.544.52007200820092010201120122013BillionsInstat2009SSUSBHSUSBLS/FSUSB3USBinBatteryPoweredApplicationsDrivingForcesforNewStandards•CellularPhone•MID&UMPC•DigitalStillCamera•Camcorder•MP3&PMP•PortableGameSystemsMP3DigitalCamerasPortableGameSystemsCellPhonesPMPCamcordersUMPC4•Introduction•USB2.0–WhatIsNew?–LinkPowerManagement–HighSpeedInter-Chip–BatteryCharging–OTG2.0•USB3.0Agenda5LinkPowerManagement•DefinesanewpowerSleepState,L1•Conservesmorepowerthancurrentsuspend/resume•ReducesTransitionalPowerStatesby3ordersofmagnitude•Suspend/Resumein10sofmillivs.10sofmicro-secondsWhatisit?Why?•ReducepowerconsumptionforUSBDevicesandHosts•ExtendBatterylifeby15%ormore(withsoftwareandsystemenhancements)When?•ECNaddedtoUSB2.0SpecificationJuly2007•Producttapingoutnow•FeatureintegratedintoUSB3.0Specificationalready6LinkPowerManagementSavesPowerL1(Sleep)fromLPMECNL2(Suspend)fromUSB2.0EntryExplicitlyenteredviaLPMextendedtransactionImplicitlyenteredvia3msoflinkinactivityExitDeviceorhost-initiatedviaresumesignaling;Remote-wakecanbe(optionally)enabled/disabledviatheLPMtransaction.Device-orhost-initiatedviaresumesignaling;Device-initiatedresumescanbe(optionally)enabled/disabledbysoftwareLatenciesEntry:~10usExit:~70usto1ms(host-specific)Entry:~3msExit:30ms(OS-dependent)Buffering1ms100to1000msDevicePowerConsumptionDevicepowerconsumptionlevelisapplicationandimplementationspecificDevicepowerconsumptionislimitedto:500uAor2.5mA7•Introduction•USB2.0–WhatIsNew?–LinkPowerManagement–High-SpeedInter-Chip–BatteryCharging–OTG2.0•USB3.0Agenda8High-SpeedInter-Chip(HSIC)USB•Lowpower,smallformfactorapplicationsrequiringhi-speeddatatransfers•SupportsHi-Speedmodeonly–480Mbpsdatarate•Usessource-synchronousclockedserialinterface•Signallevels-1.2VLVCMOS–Lowerpower,no3.3Vsignaling•Noconnectors–chiptochipinterfaceonly•Noexternalpullup/pulldownresistors,NoHi-SpeedchirpprotocolrequiredWhatisit?Why?•Nopowerconsumedunlessthereisadatatransfer•HSICisneededtosupportembeddeddesignsandportabledevices•Currentlyatversion1.0•FirstdesignsarealreadyinsiliconWhen?9ApplicationScenarioMultiportHostwithHSICApplicationsProcessorHSICHSICUSBMobileTVChipHSICBluetoothChipHSICWiMaxChipHSICHSICHSIC10•Introduction•USB2.0–WhatIsNew?–LinkPowerManagement–High-SpeedInter-Chip–BatteryCharging–OTG2.0•USB3.0Agenda11BatteryChargingApplications12•TherearethreeconnectionpossibilitiesforadevicesupportingBatteryCharging1.Dedicatedchargingport2.Standarddownstream-facing(host)port3.Chargingdownstream-facing(host)portBatteryChargerConnectionTypes13SpecificationHighlightsBatteryCharger1.3•Batterychargingspecificationaddsdetectionofadedicatedcharger,hostcharger,orhubcharger–Highercurrent(upto1.8A)isallowedtobedrawnfromVBUSforthesedevices•Regular(non-charger)hostandhubs,anddevicesthatdon’tuseBCarenotaffectedOTG2.0•RemovesVbuspulsingpreviouslyusedinOTGv1.3•ReplacedbynewSessionRequestProtocol(SRP)andAttachDetectionProtocol(ADP)14•Introduction•USB2.0–WhatIsNew?–LinkPowerManagement–High-SpeedInter-Chip–BatteryCharging–OTG2.0•USB3.0Agenda15USB3.0Agenda•NeedforSuperSpeedUSB•USB3.0CablesandConnectors•ComparisonBetweenUSB2.0andUSB3.0•USB3.0Layers–FunctionalLayer–ProtocolLayer–PhysicalLayer•Summary•Q&A16Agenda•NeedforSuperSpeedUSB•USB3.0CablesandConnectors•ComparisonBetweenUSB2.0andUSB3.0•USB3.0Layers–FunctionalLayer–ProtocolLayer–PhysicalLayer•Summary•Q&A17TheNeedforSuperSpeedUSBTargetApplicationsMediaStorageMediaCreatorsMediaPlayersSet-TopBoxesMobileInternetDevicesCreate,StoreandCarryMore!FasterSync-and-GoforWorkandPlay18SuperSpeed10xFasterThanUSB2.027GBHDVideoTransferUSB2.0~14min19SuperSpeed10xFasterThanUSB2.027GBHDVideoTransferUSB3.0~70secMorePowerEfficientBackwardsCompatiblePreservesExistingDeviceModel2020082009201020112012InitialChipsEarlyProductsEarlyMainstreamFinalizeSpecsConsumerDeploymentComputerDeploymentSuperSpeedUSB3.0MarketAdoption*DrivenbyComputerCompaniesDrivenbyConsumerProductsProvidersCrossoverSuppliersASICMarketChipSetMarket*Estimated21Agenda•NeedforSuperSpeedUSB•USB3.0CablesandConnectors•ComparisonBetweenUSB2.0andUSB3.0•USB3.0Layers–FunctionalLayer–ProtocolLayer–PhysicalLayer•Summary•Q&A22Cable&Connectors•Additional2pairsofshieldedtwistedpairsignalsforduplexoperation•Additional5pins(2pair+GND)addedtotheexistingUSBconnector23Agenda•NeedforSuperSpeedUSB•USB3.0CablesandConnectors•ComparisonBetweenUSB2.0andUSB3.0•USB3.0Layers–FunctionalLayer–ProtocolLayer–PhysicalLayer•Summary•Q&A24USB2.0/USB3.0ComparisonFeatureUSB2.0USB3.0Transmit/ReceiveHalf-DuplexDuplexDataRate1.5Mbs/12Mbs/480MbsUSB2.0DataRates+5GbsUsefulDataRate480Mbs(IncludingNRZOverhead)4Gbs*2(Excluding8b10boverhead)Err