您好,欢迎访问三七文档
当前位置:首页 > 商业/管理/HR > 信息化管理 > 新产品开发整体流程介绍(PPT 33页)
C-SystemIntroductionwillcover•Role&Responsibility(R&R)•Process–CxStage:•C0:Proposalphase構想階段•C1:Planningphase規劃階段•C2:R&DDesignphase設計階段•C3:LabPilotRunphase樣品試作階段•C4:EngPilotRunphase工程試作階段•C5:PDPilotRunphase試產階段•C6:MassProductionphase量產階段Role&ResponsibilityFunctionResponsibilityPM產品經理-ProductManager(或計畫專案經理-ProjectManager)為所負責計畫或產品線成敗之總負責人,將依產品線之性質指定專人負責某類產品,必須對所負責產品線專業領域之發展及行銷雙方面皆有相當程度的了解.並依照產品之條件及市場狀況,做適當的運用,訂定技術或產品市場競爭策略,並在適當的時機推出適當之技術或產品.TMTMisresponsibletocoordinatetechnicalissuesconflictamongHW,SW,IDandMEanddecision-making.TMhastohandleallprojecttechnicalissues.PCC為規劃推廣、連絡及控制專案進行的負責人,掌握專案進行之情況以協助處理異常狀況,使新產品能順暢切入工廠且如期推出,以提高產品競爭力.協助R&DRELEASE開發階段BOMCHANGENOTICE.R&DR&D包括電子部門及工業設計部門,若只寫HW(HardwareDesign)則指電子部門,若只寫ID(INDUSTRIALDESIGN)則指工業設計部門;包括ME,Thermal,Packingdesign.若只寫SW(Softwaredesign)則指軟體設計部門有負責BIOS,Driver及Pre-load不同工作性質之軟體開發功能.R&D人員負責產品之開發、設計、測試規劃,包括H/W、S/W及ID的開發、設計、提出新發明及著作權揭露書.-WistronCaseRole&ResponsibilityFunctionResponsibilityHW(HardwareDesign)*HardwareisresponsibleforElectronicEngineeringDesign*Co-workswithS/WandQTtomakesurethattheeveryfunctionworkswellaccordingtospec.*H/WshouldconducttechnicaltransfertoPE.*H/Wshouldinput,update,andmaintainthebugs/issuesinformationinthebugtrackingsystem.SW(SoftwareDesign)*SoftwareisresponsibleforthedesignofBIOS,Driver,Utilities,andS/WPreload.*S/Wco-workswithH/WandQTtomakesurethateveryfunctionworkswellaccordingtothespecification.*S/WhastoreleasetheSCDandtheCert.TeamDocument.*S/WshouldconducttechnicaltransfertoTE.*S/Whastoinput/update/maintainthebugs/issuesinformationinthebugtrackingsystem.ID/ME(IndustrialDesign/MechanicalEngineering)*ID/MEisresponsibleforMechanicalEngineering,ThermalandPackingdesigns.*ID/MEshouldconducttechnicaltransfertoPME.*ID/MEshouldinput,update,andmaintainthebugs/issuesinformationinthebugtrackingsystemused.-WistronCaseRole&ResponsibilityFunctionResponsibilityPA(EMI/Safety,QT,CE/Reliability,PCB,OSCertification)為產品保證暨開發支援Function之總稱,主要負責根據MRS/PES執行各項產品之測試,諸如EMC/Safety:REGULATORYTEST,CE:RELIABILITYTEST及KEYCOMPONENTAPPROVAL,PCB:PCBLAYOUT,DC:BOM,OS:OS認證etc;…EMC/SafetyAllproductstomeetEMC/Safetyrequirementsandguaranteethelegalityintheinternationalmarketing.申請產品之安規、測試、Debug..QT為R&D轄下所屬之測試單位人員,主要負責各項產品之測試,諸如COMPATIBILITYTEST,SOFTWARETEST,S/WPRELOADTEST,DIAGNOSTICPROGRAMTEST,ETC.,CE/Reliability組件承認測試、不良品故障分析及其他附件等材料品質之管制及保證產品相關之可靠度與環境實驗,以及可靠度工程之研究與制定.PCBPCBLayout之申請、PCB之設計、Orcadlibrary&Mentorlibrary的建立與管理.信號品質CAE分析,PCBlayout外包廠商之管理,PCB製造廠商之管理.OSCertification執行公司各產品之OS相容性認證測試及LOGO申請.O.S.BetaSite測試PDM料號編碼及控管,BOM製作-WistronCaseRole&ResponsibilityFunctionResponsibilityAM(AccountManager)1.爭取訂單與客戶合約協商.2.協調產品SPEC.工程變更SAMPLEAPPROVAL.3.適時反應市場需求與趨勢.MM(MaterialManagement)1.MMisresponsiblefornewsupplierdevelopment,partspurchasing2.Controllingmechanicaltoolingstatusincludingtheschedule,capacity,partsreadiness,concerns3.Managethedependencies,longlead-timeitems.4.MMalsoco-workswithSQMandCEforcomponentqualityimprovementandthekeycomponentQVLfinalversionSQM(SupplierQualityManagement)*零件品質管理及參與分包商之評鑑/管理(SQRCPlan/Status)*負責異常材料分析、追蹤與改善.*負責進行產品QVLCANDIDATEAPPROVAL作業系統ATmfg.GCSD1.開發及推動全球客戶服務及支援計劃.2.各項售後服務及支援作業.3.參與Field品質改善作業(EWG)FI負責評估ProjectCost,決定Project是否可行以及Project所花費之Cost.Legal合約及專利審核-WistronCaseRole&ResponsibilityFunctionResponsibilityCFECFEactsonbehalfofWistronglobalmanufacturingoperationtodealwiththecustomer,andalsoactsasarepresentativeofthecustomerwhendealingwithinternalWistronteams.BasedontheC4/C5checklist,relatedreportsandprojectstatus,CFEisresponsibletoconcludetheexitjudgment(ReadyorNotready)duringC4/C5ExitmeetingstodeterminewhetheraproductcanmoveontoPDpilotrun/MPornotNPI1.負責規劃、協調、整合與提供各Site製造所需相關資訊與技術資料2.協調安排新產品轉移至海外生產工廠3.協調處理海外生產工廠發生之生產相關問題PE/PME1.產品設計審查,產品問題之發覺及產品移交.2.協助生產良率提昇,克服生產瓶頸,提高生產力.3.協助訂定製造規格及引進新的製作技術,進行改善以確保產品品質.IE1.設計及管理一個高效率的整合製造系統.2.消除浪費、杜絕不合理,提高生產力3.生產流程規劃、製程改善、標準工時製定QA1.執行製程及產品之檢驗並反應品質報告請相關單位改善品質2.收集及處理市場及客戶品質回饋資料反應相關單位改善品質3.協助工程單位必要之驗證測試.4.建立PCBA,FinalAssembly之檢驗標準QE1.執行DQA.FDI,MTBF,ORTTest2.執行產品開發過程之可靠度及環境測試(C4)3.協助工程測試驗證4.品質工程問題分析與解決-WistronCaseRole&ResponsibilityFunctionResponsibilityPD(Production)PDhastoworkwithPE,PMEandIErespectivelytogettestingequipment&tools,assemblytools,andSOPreadybeforeC5Exit.PDisresponsibletoproducetheproduct.PDisnotjustforefficiencyonlybutalsoquality.PSE(ProcessEngineer)PSEisresponsibleforSMTprocessandforreleasingtheSMTpilotrunreport.PSEisalsoresponsiblefortheprocesscontinuousimprovement(CIP).FAE(FailureAnalysisEngineer)orREFAEisresponsibleforissuingthefailureanalysisreportandforwardingthistorelateddepartmentsforproductqualityimprovement.FAEisalsoresponsibleforpreparingrepairSOPifapplicable.TETEisresponsibleforprovidingandmaintainingTestPlanandTestProgram.TEalsoimplementallthepreloadtoproductionlineandreporttheproblemsrelatedtopreloadtopreloadteam.PMC/GPMC(PlanMaterialControl/GlobalPlanMaterialControl)GPMC/PMCisresponsibleforproductfulfillment,finalshippingmodel,supplysiteandcapacityplan,andrampupplanforallsites.-WistronCaseWistronC-SystemQualityControlProposalPhasePlanningPhaseR&DDesignPhaseLabPilot-runPhaseEngi
本文标题:新产品开发整体流程介绍(PPT 33页)
链接地址:https://www.777doc.com/doc-490774 .html