无铅产品之HALT可靠性技术

年度綠力料料不HALT度[e-mail]03-5913243p.1力料料不HALT度ƒ綠}度ƒ良率}}SMT度IMC}SMT度ƒ度}度量}ƒ論p.2力料料不度綠ƒ度ReliabilityEngineering}理}度Design-inReliabilityReliabilityTest&DataAnalysisFailureAnalysisReliabilityEngineering料參數度度參數理料論不p.3力料料不良率ƒƒPCBAssemblyInspection}量}X-ray}BGA}度(拉力)}(TinWhiskerinspection)}切ƒSMT度p.4力料料不度良率ƒStandardReliabilityTestsTestitemConditionsHeatResistanceMIL-STD202G#210Fwith90-120secabovePb-freesolderliquiduswith≥10sec.atabovepeak(+10C)MoistureSensitivityJ-STD-020BforPbfreeorJEITAED4701(Method301A)TinWhiskerEvaluation1)Storingat60C/95%RHfor500hours2)Thermalcycling500timesfrom-55C~85C3)Storeatroomatmosphereconditionsfor500hours(followedbySEManalysis)p.5力料料不度良率ƒStandardReliabilityTestsTestitemConditionsStandardtimeHightemperaturebias(HTB)A1505B12551000hrsLowtemperaturebias(LTB)–6551000hrsTemperaturehumiditybias(THB)Temperature853Humidity855%RH1000hrsPressureCookerTest(PCT)Temperature1213Humidity100+0,-3%RHVaporpressure2.0310510%Pa96hrsp.6力料料不度良率ƒStandardReliabilityTestsTestitemConditionsStandardtimeHighlyacceleratedtemperatureandhumiditystresstest(HAST)Temperature1305Humidity855%RHVaporpressure2.0310510%PaThermalshock(TS)–6555min15055minThetemperaturetransitiontimeshallbe10sorless.100cyclesp.7力料料不度良率ƒTemperaturecycle(TC)forPlasticmoldedpackages100cyclesstep1234temperature-655251515052515time(min)3053051010time(min)12515–255temperature21stepTemperaturecycle(TC)forFlipchipsandchipsizepackages1515time(min)1251503temperature21stepTemperaturecycle(TC)forBallgridarray(BGA)p.8力料料不拉力PCBAssemblyInspectionƒ拉力(度)}EIAJED-4701}WeightMeasurepullingforceuntilthesamplefails}Speedrate5mm/minutepulleduppushedPulltestset-upp.9力料料不拉力拉力(度)„PullTestTrendofbeforeandafterThermalShock„ImmersionAuImmersionAu,Unit(gf)PullForce157813151196TypeandThermalShockCycles0cycle500cycles1000cycles050010000.60.70.80.91.01.11.2NormalizedpullforceThermalshockcyclesImmersionAup.10力料料不拉力拉力(度)„PullTestTrendofbeforeandafterThermalShock„OSPTypeandThermalShockCyclesOSP,Unit(gf)0cycle500cycles1000cyclesPullForce154513381342050010000.60.70.80.91.01.11.2NormalizedpullforceThermalshockcyclesOSPp.11力料料不拉力拉力(度)„PushTest„p.12力料料不拉力(度)拉力„PushTest„LocationNO:LForPb;UnweightedMeansCurrenteffect:F(7,32)=2.3116,p=.05010EffectivehypothesisdecompositionVerticalbarsdenote0.95confidenceintervals1LF2LF3LF4LF1Pb2Pb3Pb4PbLocationNO:LForPb1.01.21.41.61.82.02.22.4Forcep.13力料料不拉力拉力(度)„PushTest„LFcomparewithPb;Currenteffect:F(1,38)=11.699,p=.00151EffectivehypothesisdecompositionVerticalbarsdenote0.95confidenceintervalsLFPbLFcomparewithPb1.31.41.51.61.71.81.92.0Forcep.14力料料不„PushTest„度數異數異數數度臨臨拉力(度)拉力p.15力料料不切切ƒTrendofIMCofthePb-(QFP)p.16力料料不切切ƒTrendofEDSofthePbfree-(QFP)p.17力料料不切切ƒTrendofIMCofthePb-(BGA)0cycle1000cyclesIMCp.18力料料不切切ƒTrendofIMCofthePbfree-(BGA)0cycle1000cyclesIMCp.19力料料不力SMT度ƒ度}Differentialthermalexpansion.}Thermalshock.(fromsolderingoperationorfromsevereuseenvironments)}Mechanicalbendduringprobetestofassembly.}Vibration.(transport)}Mechanicalshock.(fromsevereuseconditionsoraccidentalmisuse)p.20力料料不力度ƒ力力ScreenPrintingPCBPickandPlaceReflowScreenPrintingReflowPickandPlaceInversep.21力料料不力度PCBƒICT}p.22力料料不SMT度度_IPCƒIPC-9701}PerformanceTestMethodsandQualificationRequirementsforSurfaceMountSolderAttachmentsƒIPC-9702}MonotonicBendofBoard-LevelInterconnectƒIPC-9703}MechanicalShockTestMethodsandQualificationRequirementsforSurfaceMountSolderAttachmentsƒIPC-9704}PrintedWiringBoardStrainGageTest1957InstituteforPrintedCircuits1999InstituteofInterconnectingandPackagingElectronicCircuitsIPCisaccompaniedbyanidentitystatement,AssociationConnectingElectronicsIndustries.SMT度p.23力料料不SMT度度_IPCƒTemperaturecyclingcondition}參IPC-9701p.24力料料不SMT度度_IPCƒTemperaturecyclingcondition}參IPC-9701p.25力料料不SMT度度_IPCƒTemperaturecyclingcondition}參IPC-9701p.26力料料不SMT度度_IPCƒMonotonicBendofBoard-LevelInterconnectsIPC/JEDEC-9702p.27力料料不MonotonicBendStrainGageMeasurement度ƒMonotonicBendofBoard-LevelInterconnectsIPC/JEDEC-9702}ApparatusƒUniversaltesterƒStrainmeasurementequipmentƒContinuitymonitoringequipmentp.28力料料不ƒPCBThicknessvs.StrainandStrainRateMonotonicBendStrainGageMeasurement度p.29力料料不度度_IPCƒMechanicalShockTestMethods(IPC-9703)p.30力料料不度量ƒPrintedWiringBoardStrainGageTestIPC-9704}Boardflexurecontrolusingstraingagemeasurementidentifydamagingmanufacturingprocesses.p.31力料料不SMT量ƒPrintedWiringBoardStrainGageTestIPC-9704}Boardflexurecontrolusingstraingagemeasurement.度p.32力料料不度度量ƒ度量_HALT}量:更零異異}:度(On-goingReliabilityTest)}:(HALT,HighlyAcceleratedLifeTest)ƒPurpose}行力,度}力:度powercyclingandvoltageƒTestProfile}ThermalStepStress}VibrationStepStress}CombinedEnvironmentp.33力料料不度量_HALT度量ƒHALTProcessandTestRoutine/set-up}ThermalStepStressTemperatureUpperOperatingLimit(UOL)TemperatureLowerOperatingLimit(LOL)RapidThermalTransitionStressTest}VibrationStepStressVibrationUpperOperatingLimit}CombinedEnvironmentCombinedEnvironmentStressTestp.34力料料不度量_HALT度量ƒSysteminHALTchamber}TestBoard}Systemp.35力料料不度量HALT_BoardƒTemperatureUpperOperatingLimit(UOL)}Beganat50}Increase:10/step}Dwell:10Minute}OperatingmonitorNo.12345TypeSn