FlextronicsDesignGuidelinesPCBA

AllprintedcopiesofthisDocumentareconsideredprinted.GotoFMS–DocumentManagementSystemNAMETITLEDongkaiShangguanVPATGREVISIONDESCRIPTIONOFCHANGEISeeRevIJAddedchargers/adapterstoMiniaturizedSMTModified01005padsduetoeasieruviadrillingAddedshieldkeepoutareaforunderfill.ThisdocumentisproprietaryandconfidentialpropertyofFlextronics.DocumentTitle:FlextronicsDesignGuidelinesPCBARevision:JLastUpdatedon:AllprintedcopiesofthisDocumentareconsidered‘UncontrolledCopies’andareonlyconsideredvalidfortheDocumentManagementSystem–:DavidGeiger&JonasSjobergLastUpdatedon:2/24/2011andareonlyconsideredvalidforthedayitis:ATGEffectiveDate:24/02/11AllprintedcopiesofthisDocumentareconsideredprinted.GotoFMS–DocumentManagementSystemTableofContents1GENERALINFORMATION1.1PRINTEDCIRCUITBOARD(PCB)1.2PRINTEDCIRCUITBOARDASSEMBLY1.2.1Reviewandupdates1.2.2Changerequests1.3DIMENSIONS2STRUCTUREOFDESIGN2.1OVERALLSTRUCTURE2.2INTERNALREFERENCEDOCUMENTS2.3EXTERNALREFERENCEDOCUMENTS3ENVIRONMENTALCOMPLI4GENERALINFORMATION5DESIGNFORMANUFACTU5.1GENERAL5.2DATAINPUTREQUIREMENTSFOR6BASICPCBFABRICATIO6.1GENERAL6.2CONDUCTORWIDTHANDSPACING6.3ROUTINGTOAVOIDACIDTRAPS6.4COPPERDISTRIBUTIONAND6.5TEARDROPSANDNONFUNCTIONALPADS6.6HOLES6.6.1Aspectratio6.6.2Mechanicaldrilledvias6.6.3Microvias-μVia6.7PCBANDPCBAWARPAGE6.8PCBMATERIALS6.8.1Generalinformation6.8.2Halogen-freevs.standardPCBmaterials6.9SURFACEFINISHCONSIDERATIONS6.9.1General6.9.2Surfacefinishsummary6.10SOLDERMASKDESIGNCONSIDERATIONS6.10.1General6.10.2Soldermasktype6.10.3Soldermaskwebs/sliver6.10.4Soldermaskclearanceandcoverage6.10.5Soldermaskthickness6.11SILKSCREENDESIGN6.11.1General6.11.2SilkscreenDesignconsiderations6.12COPPERTOPCBEDGESPACING7PRINTEDCIRCUITBOAR7.1GENERAL7.2SURFACEMOUNTCOMPONE7.2.1Componentrequirements7.3PANELLAYOUT7.3.1General7.3.2Standardpanelsizes7.3.3PaneldesignLastUpdatedon:AllprintedcopiesofthisDocumentareconsidered‘UncontrolledCopies’andareonlyconsideredvalidfortheDocumentManagementSystem–(PCB)ANDFLEXIBLEPRINTEDCIRCUIT(FPC)FABRICATIONGUIDELINESSEMBLY(PCBA)DESIGNGUIDELINESSTRUCTUREOFDESIGNGUIDELINESANDRELATEDDOCUMENTSANDTOOEFERENCEDOCUMENTSEFERENCEDOCUMENTSENVIRONMENTALCOMPLIANCEGENERALINFORMATIONABOUTTECHNOLOGYCLASSESDESIGNFORMANUFACTURING(DFM)TSFORDFMBASICPCBFABRICATIONCONSIDERATIONSPACINGDTRAPSISTRIBUTIONANDNUMBEROFLAYERSNCTIONALPADSMechanicaldrilledviasWARPAGEfreevs.standardPCBmaterialsERATIONSSurfacefinishsummaryONSIDERATIONSSoldermaskwebs/sliverSoldermaskclearanceandcoverageSoldermaskthicknessDesignconsiderationsPACINGPRINTEDCIRCUITBOARDASSEMBLYDESIGNGUIDELINESURFACEMOUNTCOMPONENTREQUIREMENTSComponentrequirementsLastUpdatedon:2/24/2011andareonlyconsideredvalidforthedayitis–DocumentManagementSystem7.3.4Breakouttabsforroutingandpunching7.3.5BreakouttabsforManualbreakout7.3.6Vscoring7.4FIDUCIALGUIDELINES7.4.1Globalfiducials7.4.2Localfiducials7.4.3Fiducialshapeanddimension7.5LANDPATTERNDESIGNCONSIDERATIONS7.5.1General7.5.2Basicrequirements7.5.1Weightlimitsforreflow7.5.2Connectedpadsonthesamecomponents7.5.3Plated-throughholesundercomponents7.5.4Plated-throughholesinsolderedpads7.5.5Cornermarkings7.5.6SMTconnectoralignmentslots7.5.7DiscreteParts7.5.8Gulwingandsimilarleadtypes7.5.9C-leadandsimilarleadtypes7.5.10J-leadandsimilarleadtypes7.5.11BTC-BottomTerminationComponents7.5.12BGA,CSPandPoPbottompart7.5.13Specialcase0,5mmpitchCSP7.5.14Non-CollapsiblePackageRequirements(CCGA&CBGA)7.5.15SMTmountedSprings7.5.16SMTmountedNuts7.5.17Jumperlayout7.5.18Pressfitconnectors7.5.19Wavesoldering7.5.20Solderflipchip7.5.21Wirebond7.6COMPONENTSPACING,REFLOWSOLDERING7.6.1General7.6.2Miniaturized(M)ComponentSpacing7.6.3Standard(S)ComponentSpacing7.6.4LargeFormFactor(LFF)ComponentSpacing7.7PCBTHICKNESS7.8CENTREBOARDSUPPORT7.9COMPONENTPAD/TOEPRINTTOEXPOSED7.10COMPONENTTOPCBEDGECLEARANCE7.11PCBMOUNTINGHOLEA7.12FLEXIBLEPRINTEDCIRCUIT7.12.1General7.12.2Flexiblecircuitattachmentdesign7.13SOLDEREDSHIELDCANS7.13.1General7.13.2Solderedshieldcandesign7.13.3Cuttingareaonfence7.14PININPASTE(PIP)-INTRUSIVESOLDERING7.14.1General7.14.2PininPastede