PCB专业术语

1、In-housingTraining,Spring2005Page1Of15PCBJargon(PCB专业术语)AAbsorption吸收、吸入AcceleratedTest（Aging）加速试验、加速老化Accelerator加速剂、速化剂Accept/Acceptance允收AcceptableQualityLevel（AQL）允收品质水准Accuracy准确度ACF：Adhesivecopperfoil有胶铜箔Activator活化剂、添加剂比称为ActivatorActiveparts（Devices）主动零件，指积体电路或电晶体AdditionAgent添加剂AdditiveProcess加成法、分全加成、半加成及部份加成Adhesion附著力Adhesive胶类或接著剂Aging老化AirKnife风刀AmbientTemperature环境温度Ampere安培Amp-Hour安培小时AnnularRing孔环Anode阳极AnodeBag阳极带ANSI:AmericanNationalStandardInstitute美国标准协会Anti-FormingAgent消泡剂。

2、AOI:AutomaticOpticalInspection自动光学检验Aperture开口APQP:AdvancedProductQualityPlanArray排列、阵列Artwork底片ASIC:ApplicationSpecificIntegratedCircuit特定用途的积体电路器AspectRatio纵横比、板厚与孔径之比值Assembly装配、组装ATE:AutomaticTestingEquipment自动电测设备AVL:ApprovedVenderList合格供应商BBackLight（BackLighting）背光法Back-UP垫板Backpanels/Backplanes背板、支持板，厚度较厚，BallGridArray（BGA）球脚车列（封装）Barrel孔壁BaseMaterial基材In-housingTraining,Spring2005Page2Of15Batch批（同时间发料某一数量的板子）Bevelling切斜边Binder黏结剂Blackoxide黑氧化层，另有棕氧化（BrownOxide）BlindViaHole盲导孔Blister局部性分层。

3、或起泡Blockout封网，网板之空网处以水溶胶涂满BlowHole吹孔，PTH孔壁有破洞（void）所造成Boiler(WaterTubeBoiler/FireTubeBoiler)BOM:BillofMaterial用料表BondStrength结合强度BondingSheet(Layer)接合片、接著层，指PPBondingWire结合线，IC之晶片与PCB之引线Bow板弯Break-awayPanel可断开板或者说BreakAwayTabBreakPoint出像点、影像点Break-Out破出（钻孔破出开成断环情形）Bridging搭桥、桥接Brightener光泽剂BrushPlating刷镀BTU/BritishThermalUnit英制热量单位Bump突块BuriedViaHole埋导孔Burn-in高温加速老化试验Burning烧焦Burr毛头Buy-off认可CCAD:ComputerAidedDesign电脑辅助设计CAM:ComputerAidedManufacturing电脑辅助制造CAT:ComputerAidedTesting电脑辅助测试Capacitanc。

4、e电容Carbide碳化物、碳化钨钻头CAR:CorrectiveActionReport改善报告CarbonTreatment活性碳处理Card卡板Carrier载体Cartridge滤芯Cathode阴极CCL:CopperCladLaminates铜箔基板Ceramics陶瓷Certificate证明书CFC氟氯碳化物Chloro-Fluoro-CarbonChamfer倒角、去掉直角In-housingTraining,Spring2005Page3Of15CharacteristicImpedance特性阻抗Cheeklist检察清单Chip晶粒、晶片ChipOnBoard晶片黏著板CleanRoom无尘室(Class100)Cleanliness清洁度Clearance余隙、余环COB（ChiponBoard）晶片在板上直接组装COC（CertificateofCompliance）出货合格书COF（ChiponFlexiblePCB）COG（Chipglass）CoefficientofThermalExpansion热膨胀系数（CTE）ColdSolderJoint冷焊。

5、点ComponentHole零件孔ComponentSide组件面、零件面Conditioning整孔Conductivity导电度Connector连接器ContinuityTest连通性试验CopperFoil铜箔、铜皮CopperBall铜球CornerCrack镀通孔转角断角Cp:CapabilityofProcess制程能力指数Crack裂痕Crazing白斑（基板外观上的缺点）Crosstalk杂讯、串讯Cure/Curing硬化、热化CurrentDensity（C.D.）电流密度（1ASD=9.1ASF）CurtainCoating液涂法DDatum基准点Deburring去毛头Defect不良缺点Degreasing脱脂Delamination分层、爆板Dent凹陷、缓和均匀的下陷Desmearing除胶渣Developer显像液Deviation偏差Device电子元件Dewetting缩锡DFM:DesignforManufacturing/DirtyforeignMaterials异物、杂质Die冲模Dielectric介质In-housingTraining,。

6、Spring2005Page4Of15DielectricConstant介质常数DimensionalStability尺度安定性DIP（DualInlinePackage）双排脚封装体DirectPlating直接电镀DIWater纯水(De-IonizeWater)DOE/DesignofExperiment实验计划法DPPM（DefectPartsPerMillion）Drilling钻孔DrillBit钻针DryFilm干膜Dummy假镀EECN:EngineeringChangeNotice工程变更通知Elongation延伸性EMI电磁干扰ElectromagneticInterferenceENIG:ElectrolessNickelImmersionGold化镍浸金Entek有机护铜处理EntryMaterial盖板E.T/ElectricTest电测、电气测试EpoxyResin环氧树脂ESD:Electro-StaticDischarge静电流量Etching蚀刻Etchback加蚀EtchFactor蚀刻函数EtchingResist抗蚀阻剂ExposeCopp。

7、er漏铜Exposure曝光Eyelet铆钉RivetFFAAR（FirstArticleApprovalReport）Failure故障、损坏Fault缺陷、瑕疵FCC/FederalCommunicationCommission美国联邦通讯委员会FiberExposure玻织显露FiducialMark基准记号、光学点Film底片Filter过滤器FineLine细线Finger手指Finishing制成品在外观上的最后处理FirstArticle试产的首件或首批小量产品FirstPass-Yield初检良品率Fixture夹具、治具(RigandFixture)In-housingTraining,Spring2005Page5Of15FlameResistant耐燃性（分HB、VO、V1及V2等四级）Flux助焊剂FoilBurr铜箔毛边FootPint（LandPattern）脚垫ForeignMaterial外来物、异物FR4/FlameResistantLaminates耐燃性积层板材Frequency频率GGauge量规GelTime胶化时间GerberData/Ger。

8、berFile格搏档案GlassFiber玻璃纤维GlassFiberProtrusion玻纤突出GlassTransitionTemperature/Tg玻璃态转化温度GoldenBoard测试用标准板Grid标准格GroundPlane接地层GuidePin导针HHaloing白圈、白边（在钻孔、开槽等机械动作一旦过猛时将造成内部树脂之破碎或微小分层裂开的现象）Hardener硬化剂Hardness硬度HeatDissipation散热Hertz（Hz）赫芝HEPA/HighEfficiencyParticulateAirFilter高效空气尘粒过滤机HipotTest高压电测HighPotentialTestHit擎HoldingTime停区时间HoleBlock孔塞HoleBreakout孔位破出，简称BreakoutHolecounter数孔机HoleDensity孔数密度HolePullStrength孔壁强度HoleVoid破洞HotAirLevelling喷锡HASL/HALTHE(HighTemperatureElongation)高温延伸性II.C.Socket积体。

9、电路插座ImageTransfer影像转移IMC:Inter-metalliccompound介面合金共化物ImmersionPlating浸镀In-housingTraining,Spring2005Page6Of15Impedance阻抗In-CircuitTesting组装板电测，ICTIndexingHole基准孔Infrared(IR)红外线Ink油墨InnerLayer内层Input/Output输入、输出Insert/Insertion插接、插装InsulationResistance绝缘电阻IntegratedCircuit(IC)积体电路器Interconnection互连IntermatallicCompound(IMC)介面合金共化物InternalStress内应力IonCleanliness离子清洁度IonicContamination离子污染IPC:TheInstituteforInterconnectingandPackagingElectronicCircuits美国印刷电路板协会ISO:InternationalOrganizationforStand。

10、ardization国际标准组织Isolation隔离性JJPCA/JapanPrintCircuitAssociation日本印刷电路工业会Just-In-Time(JIT)适时供应KKeyboard键盘KraftPaper牛皮纸LLaminate(s)基板、积层板Laminator压膜机Land孔环焊垫、独立点LandlessHole无环通孔LaserDirectImaging/LDI雷射直接成像LaserPhotoplotter雷射曝光机、绘图机LayOut布线、布局(configuration,generalarrangement)LayUp叠合LeadFrame脚架Lead引脚、接脚Legend文字标记Levelling整平LightIntensity光强度LMW:LicenseManufacturingWarehouse保税厂LotSize批量LRR(LotRejectRate)In-housingTraining,Spring2005Page7Of15MMajorDefect严重缺点、主要缺点Marking标记Mask阻剂MassLamination大型压板MCM/Mult。