PCB制造工艺综述

......................................................................................2PCB......................................................................................41.50............................................................................42PCB............................................................................................................53(SMT)......................................................................................74PCB................................................................................................85PCB................................................................................................86.................................................................................................97.PCB......................................................................................................9DFM....................................................................................121DFM.............................................................................................................122...............................................................................................................13:testcouponTDR(TimeDomainReflectometer)PCBtestcoupon()(groundlead)TDR(probe)(probetip)testcoupon2.Edge-Conncetion(GoldFinger)(Connector)140Knoop30uin(Substrate)COBchiponboardwirebond100Knoop3.,:HardGold;softGoldIC4.SMTAdditiveProcess()PCB()Angleofattack()Anisotropicadhesive()ZApplicationspecificintegratedcircuit(ASIC)Artwork()PCB3:14:1Automatedtestequipment(ATE)Blindvia()PCBBuriedvia()PCB()Bondingagent()()Circuittester()PCBCladding()PCBCTE---Coefficientofthethermalexpansion()(ppm)Coldcleaning()Componentdensity()PCBConductiveepoxy()Copperfoil()PCBCoppermirrortest()Defect()Delamination()Desoldering()()DFM()Environmentaltest()Functionaltest()Fiducial()Fine-pitchtechnology(FPT)0.025(0.635mm)Fixture()PCBLeadconfiguration()Machinevision()Meantimebetweenfailure(MTBF)Photo-plotter()PCB()Pick-and-place(-)PCBPlacementequipment()PCBSMDX/YReflowsoldering()/Schematic()Solderbump()Soldermask(),II,IIIassembly()PCB(I)SMD(II)SMD()(III)Ultra-fine-pitch()0.010(0.25mm)Void()Yield()5KeyingSlot6.MountingHoleInsertionHole,LeadHole7.Laminate:CCLCopperperCladedLaminates8.Prepreg9.SilkScreen10.ScreenPrinting11.Screenability12.SolderBump13.SubstractiveProcess14.Surface-MountDevice(SMD)SMD15.SurfaceMountTechnologySMT16.ThinCore17.ThroughHoleMounting18.TwistPCB1.50PCB5061PWB1936~~PPPWBPWBPPPWB3PWB1960~GEPWBGEPWBGE1965GEGEPP4PWB1970~MLBPWB468102040500.5mm0.350.20.1mmPWBPWBTMTSMTPWB20SMTPWB5MLB1980~1982~199110PWB319823615199110940MLB1986146819892784MLB1980PCB62MLBMLB6211990~MLB1991PWB1994MLB1998MLBICBGACSP50PWB1947ICISIVLSIMCMBGACSPIC21212PCBPCB(PrintedCircuitBoard)PCBPCB:B/PCB(MultiChipModule)MCMMCMMCMMCMMCM-DMulitChipModuleDepositedThinFilm500Mhz10-251050PCB3(SMT)1)SMT1/10SMT40%~60%60%~80%%~50%2)(SMT)(IC)IC(IC)3)SMT/SurfaceMountTechnologySMTSMTSMTSMTSMTCIMSSMTSMTSMTFMSSMT4PCB2.445PCBMILSTD2750.001(HASL,hotairsolderleveling)(OEM,originalequipmentmanufacturer)OEMHASL(PWB,printedwiringboard)()OSP20~30%HASLENIGOSPHASLPWBHASLOSPorganometallic)()(ENIG)OSPOSPPWB1OSP,3OSP/(intrusivereflow)(selectivesolderfountain)(compliantpin)(through-hole)(paste-in-hole)PWBHASL(compliantpin)HASL4OEMOSPOSPPWBPWBHASL(keycontact)(componentshielding)(edgeconnector)PWB(wirebonding)PWB(HDI,high-densityinterconnect)ENIG(fieldfailure))/OSP()(goldOSPPWBOSPOSP()OSPENIGOSP(areaarraypackage)OSPENIG5,6300,0000.02010oz100%#1#2#3OSPBTH10370KG20.5001.250.500OSP10370KKY0.5000.5000.500BTH10370KGM0.0250.0250.02510370KHW0.0250.0250.025BTH10370K9Z0.0250.0250.02510370K8Y0.0250.0250.025/0.0250.0250.025(whisker)(30~50millionths)(ICT,in-circuittest)ICTOSPPWBOSP(chip-scale)(flipchip)/(TAB,tapeautomatedbonding)(wirebondable)ICTOSPHASLHASLDFMDFM(DesignForManufacture)DFMDFM1DFMDFMDFMDFMDFMDFMDFMDFMDFMDFMDFMDFM()DFMDFMDFM()DFMDFM2DFMDFMDFM:DFMPCBDFM/()DFM::DFM(dpm,defectspermillion)DFMPCBDFMPCB()PCBXDFM%DFMDFM10%DFMPCB*StandardsPCBXbeforeDFMPCBXafterDFMProcessdpmS/URunVariableS/URunQuantityS/URunQuantityStencilPrint(T)2050.5(PCB)50.5150.51ChipPlace100100.012(SMT)100.0484100.31226ICPlace200150.025(SMT)000000Reflow255-Internal50.3150.31StencilPrint(B)2050.5(PCB)000000ChipPlace100100.012(SMT)000000ICPlace200150.025(SMT)000000Reflow255-Internal000000Clean1050.3(PCB)000000DIP5000150.1(Comp)000000Sequence1500200.02(Comp)200.2613000VCD1500150.03(Comp)150.3913000Radial5000300.04(Comp)000000Stake6000100.14(Comp)000000Mask2500100.05(Point)100.153000AdhesiveDispense505-I