PCB印制电路板流程培训教材3(PDF 18)

VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)200267VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)YesYesYesImmersionSilver+/-5%+/-5%+5%/-10%ZoToleranceohmsYesYesYesImmersionNi/AuYesYesYesImmersionTinYesYesYesOSPYesYesYesLaserDrill0.006”0.008”0.008”MinDrillDia0.003”/0.003”0.003”/0.003”0.003”/0.003”Line/SpaceInt0.003”/0.003”0.003”/0.003”0.004”/0.004”Line/SpaceExt0.002”0.002”0.0025”MinDielectric0.400”0.400”0.250”MaxThickness34”x50”24”x40”24”x30”MaxPanelsize483626Layercount200520032002PCBVIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)•••••VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)ABGABCSPChipScalePackageCBuildupProcessHighDensityInterconnect)DFlipChipSubstrateVIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)LowLossMaterial)•Getek•Nelco•Roger•Tg••VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)LowLossMaterial)VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)0.0050.0100.0150.0200.025GoreSpeedboardDk@1MHz4.03.02.05.0BTPolyimideN4000-13Teflon/GlassHighTgEpoxyEpoxyThermountImprovedSpeedSignalIntegrityRegionStd.EpoxyN6000N4000-13SIN6000SIGetekN4000-6SIN4000-7SISI=SignalIntergrityLowDkGlassN4000-6N4000-7N4000-2Roger4350VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)HDI-HDI•0.15mm(6mil)(AnnularRingorPadorLand)0.25mm(10mil)Microvia•PCBConnection)130/2Channel50mil117/2HDIPCB/3mil/3milHDIVIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)HDIHDI••(14HighLayerCount)•(Packagingsubstrate)(WineBoard)(FlipChip)InterposerModuleBoardHDIVIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)-EmbededResistorsn-1-VIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)••SMTVIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)•LoopParasiticEffects•HighPinCountSubstrateFC-PGACPUASICHighLayerCountVIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)-BuriedCapacitanceVcc/GND2-4milVIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)•Decoupling•EMI•SwitchingTransientImpedanceMatchingVIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)•0.01-0.1μF•BulkCapacitance1-47μFVIASYSTEMSASIAPACIFICVIASYSTEMS–Kalex(GZ)[e-mail]