PCB流程-内层

(GuangZhou)[e-mail](GuangZhou)LimitedInnerBoardCuttingResistsLamination/RollerCoating/ChemicalCleanBakingInnerMiddleInspectionPEPunchingExposureDES/InnerOxide/Laying-UpPressing(GuangZhou)Limited¾ƒMIƒ48X36,48X4048X42(GuangZhou)Limited¾„:„1505hrs(GuangZhou)Limited¾/ƒ1)2)(GuangZhou)Limited¾ƒ1515(GuangZhou)Limited¾DES„/„Developing(ƒEtching(ƒStripping((GuangZhou)Limited¾„AOI„AOI(GuangZhou)LimitedAOI(GuangZhou)LimitedAOI(GuangZhou)Limited¾/ƒ¾/(GuangZhou)Limited(GuangZhou)Limited(GuangZhou)Limited//InnerOxide/InnerEtchingMainDefectsProcess(GuangZhou)Limited/-(Open)(GuangZhou)Limited/-(Short)short(GuangZhou)Limited/-(GuangZhou)Limited/AOI/DES9033-PC2008/HCLNaOHDES/(GuangZhou)Limited1milAccuracyPEPunching1/3OZ~3OZBaseCopperFoilInnerEtching7mil10milClearance4L)Clearance(6L)1.5milLayertoLayerRegistration3/3milMinLineWidth/Spacing/InnerImageTransferDataItemProcess(GuangZhou)[e-mail]13985548(GuangZhou)Limited-(GuangZhou)Limited(GuangZhou)Limited(GuangZhou)Limited(GuangZhou)Limited(GuangZhou)Limited(GuangZhou)LimitedCore)(GuangZhou)Limited(GuangZhou)Limited(GuangZhou)Limited(Core)(GuangZhou)LimitedDESDES(GuangZhou)LimitedDES(Core)(GuangZhou)LimitedDESCore)(GuangZhou)LimitedDESCore)(GuangZhou)LimitedDESCore)