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(Multi-layerBoardManufacturingProcess@viasystems.com(Multi-layerBoardManufacturingProcess¾PCB¾.(Multi-layerBoardManufacturingProcess¾¾¾¾(Multi-layerBoardManufacturingProcess++EntekEntek++++HASLHASL(Multi-layerBoardManufacturingProcess(Multi-layerBoardManufacturingProcess)PCB)(Multi-layerBoardManufacturingProcess))))(Multi-layerBoardManufacturingProcess(Multi-layerBoardManufacturingProcess¾(:1000#:1/1.5)¾NPSHSO(Multi-layerBoardManufacturingProcess¾¾MP-49(:5070g/l)¾30%NH4HF2¾:(Multi-layerBoardManufacturingProcess¾-Ni(NH2SO3)2.4H2O¾180g/l(Multi-layerBoardManufacturingProcess)(H3BO3)3555g/l)(NiCl2.6H2O)1015g/l(Multi-layerBoardManufacturingProcess)ACR-3010BR¾¾2535ml/l¾1015%(Multi-layerBoardManufacturingProcess(CN)2))(Multi-layerBoardManufacturingProcess)Shipley-RonovelCM)DegussaAuruna7100)-(),99.26%(Multi-layerBoardManufacturingProcess¾¾(/)¾¾(/)¾1030%(Multi-layerBoardManufacturingProcess)(Multi-layerBoardManufacturingProcess¾¾(/-)¾PCB¾()PCB(Multi-layerBoardManufacturingProcess¾570µ¾50400µ¾1.23.2mm¾(max)7.0¾50kft2/(Multi-layerBoardManufacturingProcess(Multi-layerBoardManufacturingProcess(Multi-layerBoardManufacturingProcess(Multi-layerBoardManufacturingProcess(Multi-layerBoardManufacturingProcess),),))(Multi-layerBoardManufacturingProcess(Multi-layerBoardManufacturingProcess)S2)1025%)///)(Multi-layerBoardManufacturingProcess)NPS(100g/l))H2SO4(2%)(Multi-layerBoardManufacturingProcess)Auro-dip(110ml/l130ml/l))2550%H2SO4(Multi-layerBoardManufacturingProcess¾H2SO4¾(Multi-layerBoardManufacturingProcess)()Pd(50ppm)/H2SO4(50ml/l)(Multi-layerBoardManufacturingProcess(AurotechCNN)¾(NiSO4)¾(NaH2PO2)(Multi-layerBoardManufacturingProcess)/)PartANiSO4:2550%/5%/0.11%)Part(Multi-layerBoardManufacturingProcess(AurotechSF)¾¾¾2.5%(Multi-layerBoardManufacturingProcess)-KAu(CN)2)(Multi-layerBoardManufacturingProcess¾¾1.05µ¾50300µ¾2430¾20mil3.2mm¾200kft2/(Multi-layerBoardManufacturingProcess(Skip)(Multi-layerBoardManufacturingProcess(Multi-layerBoardManufacturingProcess(Multi-layerBoardManufacturingProcess(Multi-layerBoardManufacturingProcess¾316¾b.¾PPNPP¾(Multi-layerBoardManufacturingProcess://www.maihui.netkillmai@163.netOICQ13985548
本文标题:PCB流程-沉镀金pdf41
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