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HpcTrading(Shanghai)Co.,LtdIntroductionIntroductionofofgaisergaiserCapillaryCapillaryBysean_oyHpcTrading(Shanghai)Co.,LtdGaiserToolCompanyABriefHistory•Foundedasalead-framestampinghousein1963,Gaiserhasitsbeginningrootsintheelectronicsindustry•Manufacturedthefirstcapillaryeverforre-salein1967forthespaceprogramforSperryandTexasInstruments•Shortlythereafter,Gaiserinventstheceramiccapillary•ContinuousgrowthandcustomersatisfactionmakesGaiserToolCompanyanindustryleaderforover40yearsHpcTrading(Shanghai)Co.,LtdGaiserToolCompanyProductLines•CapillariesforBallBonding•FinePitchandUltra-FinePitchCapillaries•WedgeBondingTools,Aluminum&GoldWire,FinePitch•DieCollets&VacuumPick-upTools•PGE’s(ParallelGapElectrodes),SolderRe-flowTools•BondingtoolsfortheDiskDriveIndustry•SpecialtyHighPrecisionJobShopHpcTrading(Shanghai)Co.,LtdCONTENTS1.TheballbondingprocessIntroduction2.GeneralDimensionsandmaterialIntroduction3.Howtoselectsuitablecapillary?4.Gaisercapillarynamedrule5.CapillaryrelateddefectmodesHpcTrading(Shanghai)Co.,LtdTheballbondingprocessIntroductionHpcTrading(Shanghai)Co.,LtdTheballbondingprocessIntroductionHpcTrading(Shanghai)Co.,LtdGeneralDimensionsIntroductionHpcTrading(Shanghai)Co.,LtdMajorDimensions•Holesize•Tipdiameter•ChamferdiameterandIC•ICtype•Faceangle&outsideradiusHpcTrading(Shanghai)Co.,LtdHolesize1.HolewireDia.RecommendedHole2.03.0~2.41.52.2~1.81.31.8~1.51.21.7~1.41.11.6~1.31.01.5~1.20.91.1~1.20.80.95~1.00.70.9~0.85H=Wirediameter+0.3~0.5(60umpith)HHpcTrading(Shanghai)Co.,LtdHolesizeWireClearanceEffectonlifespanWireClearanceEffectonlifespanHpcTrading(Shanghai)Co.,LtdTipdiameterGeneralrule:Tip(inmilunit)=pitch(inumunit)/20MinbondpitchTipdiameterL/HConeangleHpcTrading(Shanghai)Co.,LtdChamferdiameterandIC1.ChamferDiameter(H+2*IC)(CD+0.4mils)=BallSize(BPO-0.3mils)CD=Hole+2*ICIC=0.15mils(recommended)BallSizeICHHpcTrading(Shanghai)Co.,LtdICInsideChamferMin.=0.15mil(recommend)*InsufficientICwillcauseweaktailbondandcannotleaveenoughtaillengthforFABTailbondClampopen;BondheadriseSticktoleaveTaillengthHpcTrading(Shanghai)Co.,LtdICangleInsideChamferAngleBiggerICA*Smallerinsidevolume*Biggerballsize*Biggernormalforcetoincrease1stbondabilitySmallerICA*Biggerinsidevolume*SmallerballsizeNormalICAis90degreeHpcTrading(Shanghai)Co.,LtdICangle•Wirediameter=1.0mil•Chamferdiameter=2.5mil•F.A.B=2.7mil•Squashheight=0.7mil120‘55%90100%70146%HpcTrading(Shanghai)Co.,LtdICtypeFourICTypeanditsadvantageanddisadvantageSingleICDoubleICIRICBlendingEdgeICTypeBallShape&ShearFrictionSingleICBestWorstDoubleICBetterGeneralRadiusICWorstBestBlendingICGeneralBetterHpcTrading(Shanghai)Co.,LtdFaceangle&outsideradiusFaceAngle1.smallerFAprovidesgreaterdownwardforcetoincrease2ndbondbondability2.smallerFAprovidesthinnerX-sectionareaandmaycauseheelcrack3.smallerFAissuitablewhileencounterleadfloatingandepoxybleedingproblems4.normalis8~11degreeNormalforce=F*cos(FA)FFFA90-FAHpcTrading(Shanghai)Co.,LtdOuterradiusOuterRadius*smallerOR,longerstitchlength*biggerOR,shorterstitchlengthWDORORStitchlengthFAHpcTrading(Shanghai)Co.,LtdMaterialselectStandardceramicgrainsize2umZrtoughenedceramic,CZ1grainsize0.7um:Al2O3Material:CZ1-ZirconiaToughenedAluminaFeature:FilltinyZirconiaparticalsintothevoidsoftheceramicmolecularmatrix:ZirconiaHpcTrading(Shanghai)Co.,LtdMaterialselectCZ1StandardCeramicCZ3CZ8Avg.GrainSize:1.3um0.5um0.35um0.4umDensity:3.96g/cm³4.29g/cm³4.38g/cm³4.27g/cm³BendingStrength:572MPa1013MPa1120MPa1046MPaUltrasonicEfficiency:81.2%85.2%88.8%84.4%VickersHardness:2144HV1716HV2658HV2000HVHpcTrading(Shanghai)Co.,LtdMaterialselectCoefficientOfFriction00.511.522.512345678910Sample#DragForce(Grams)StdCeramicNewCeramic0.150KmWearTestonAbrasiveSurfaceCZ3ToughenedCeramic(CZ1)•NewCZ3formulationprovidessmoothsurfacelessfrictiononwire•CZ3providessurfacetoughnesstoresistwear•Wearresistancetranslatestolongtoollife•CZ3withhighermechanicalstrength•CZ3improvesacousticalefficiencyforbetterultrasonicparametercontrolHpcTrading(Shanghai)Co.,LtdHowtoselectsuitablecapillary?1TL;toollength:Dependonbondertypeand437milsismostpopular.2SD;shankdiameter:Allare62.4mils.3MTA;maintaperangleorconeangle:willaffectloopingandenergytransmission.4BNH;bottleneckheight:willaffectloopingandenergytransmission.5BNA;bottleneckangle:willaffectloopingandenergytransmission.6BNR;bottleneckradius:willaffectlooping;GTC’sdefaultis5milsandM/S’sis10mils.BiggerBNRwillhavelargerroomforlooping.7.T;tipdiameter:willaffectloopingandneedtobematedwithpadpitch.Generalrule:Tip(inmilunit)=pitch(inumunit)/208.H;holediameter:Tomatewithwirediameter.Generalrule:wiredia.+0.2mils=Holesize=wiredia.+0.3~0.5mils.9CDorBsize;chamferdiameter:willaffectthesizeofballdeformation.Generalrule:ballsize=CD+(0.4~0.5)milsballsize=opening–0.3mils10.IC;insidechamfer:CD=H+2*IC;importantfactorinshorttailandballshear.Generalrule:IC=0.15milsisrecommended11.FA;faceangle:willaffectstitchshape;Generalrule:11Dforsubstratetypeand11Dor8Dforleadframetype.12.OR;outsideradius:willaffectstitchshape;needtobematedwithFA;largerFAneedsmallerOR.HpcTrading(
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