pcb字典

PCB字典流程图PCBMfg.FLOWCHARTUPDATED:1999,09,01多层板内层流程(INNERLAYERPRODUCT)多次埋孔MultipleBuriedViaJOHNNYHSU顾客(CUSTOMER)工程制前(FRONT-ENDDEP.)裁板(LAMINATESHEAR)内层干膜(INNERLAYERIMAGE)预叠板及叠板(LAY-UP)通孔电镀(P.T.H.)液态防焊(LIQUIDS/M)外观检查(VISUALINSPECTION)成型(FINALSHAPING)业务(SALESDEPARTMENT)生产管理(P&MCONTROL)蚀铜(I/LETCHING)钻孔(PTHDRILLING)压合(LAMINATION)外层干膜(OUTERLAYERIMAGE)二次铜及锡铅电镀(PATTERNPLATING)蚀铜(O/LETCHING)检查(INSPECTION)喷锡(HOTAIRLEVELING)电测(ELECTRICALTEST)出货前检查(O.Q.C.)包装出货(PACKING&SHIPPING)曝光(EXPOSURE)压膜(LAMINATION)前处理(PRELIMINARYTREATMENT)显影(DEVELOPIG)蚀铜(ETCHING)去膜(STRIPPING)黑化处理(BLACKOXIDE)烘烤(BAKING)预叠板及叠板(LAY-UP)压合(LAMINATION)后处理(POSTTREATMENT)曝光(EXPOSURE)压膜(LAMINATION)二次铜电镀(PATTERNPLATING)锡铅电镀(T/LPLATING)去膜(STRIPPING)蚀铜(ETCHING)剥锡铅(T/LSTRIPPING)涂布印刷(S/MCOATING)预干燥(PRE-CURE)曝光(EXPOSURE)显影(DEVELOPING)后烘烤(POSTCURE)MLB全板电镀(PANELPLATING)铜面防氧化处理O.S.P(EntekCu106A)外层制作(OUTER-LAYER)TENTINGPROCESS镀金手指(G/FPLATING)镀化学镍金(E-lessNi/Au)ForO.S.P.选择性镀镍镀金(SELECTIVEGOLD)印文字(SCREENLEGEND)网版制作(STENCIL)图面(DRAWING)工作底片(WORKINGA/W)制作规范(RUNCARD)程序带(PROGRAM)钻孔,成型机(D.N.C.)底片(MASTERA/W)磁盘,磁带(DISK,M/T)蓝图(DRAWING)资料传送(MODEM,FTP)AOI检查(AOIINSPECTION)除胶渣(DESMER)通孔电镀(E-LESSCU)DOUBLESIDE前处理(PRELIMINARYTREATMENT)全面镀镍金(S/GPLATING)雷射钻孔(LASERABLATION)BlindedVia埋孔钻孔(I.V.H.DRILLING)埋孔钻孔(I.V.H.DRILLING)埋孔电镀(I.V.H.PLATING)埋孔电镀(I.V.H.PLATING)埋孔(Buriedvia)P1/136*ProcessModule说明:A.下料(CutLamination)a-1裁板(SheetsCutting)a-2原物料发料(Panel)(ShearmaterialtoSize)B.钻孔(Drilling)b-1内钻(InnerLayerDrilling)b-2一次孔(OuterLayerDrilling)b-3二次孔(2ndDrilling)b-4雷射钻孔(LaserDrilling)(LaserAblation)b-5盲(埋)孔钻孔(Blind&BuriedHoleDrilling)C.干膜制程(PhotoProcess(D/F))c-1前处理(Pretreatment)c-2压膜(DryFilmLamination)c-3曝光(Exposure)c-4显影(Developing)c-5蚀铜(Etching)c-6去膜(Stripping)c-7初检(Touch-up)c-8化学前处理,化学研磨(ChemicalMilling)c-9选择性浸金压膜(SelectiveGoldDryFilmLamination)c-10显影(Developing)c-11去膜(Stripping)D.压合Laminationd-1黑化(BlackOxideTreatment)d-2微蚀(Microetching)Developing,Etching&Stripping(DES)d-3铆钉组合(eyelet)d-4叠板(Layup)d-5压合(Lamination)d-6后处理(PostTreatment)d-7黑氧化(BlackOxideRemoval)d-8铣靶(spotface)d-9去溢胶(resinflushremoval)E.减铜(CopperReduction)e-1薄化铜(CopperReduction)F.电镀(HorizontalElectrolyticPlating)f-1水平电镀(HorizontalElectro-Plating)(PanelPlating)f-2锡铅电镀(Tin-LeadPlating)(PatternPlating)f-3低于1mil(Lessthan1milThickness)f-4高于1mil(Morethan1milThickness)f-5砂带研磨(BeltSanding)f-6剥锡铅(Tin-LeadStripping)f-7微切片(Microsection)G.塞孔(PlugHole)g-1印刷(InkPrint)g-2预烤(Precure)g-3表面刷磨(Scrub)g-4后烘烤(Postcure)H.防焊(绿漆):(SolderMask)h-1C面印刷(PrintingTopSide)h-2S面印刷(PrintingBottomSide)h-3静电喷涂(SprayCoating)h-4前处理(Pretreatment)h-5预烤(Precure)h-6曝光(Exposure)h-7显影(Develop)h-8后烘烤(Postcure)h-9UV烘烤(UVCure)h-10文字印刷(PrintingofLegend)h-11喷砂(Pumice)(WetBlasting)h-12印可剥离防焊(PeelableSolderMask)I.镀金Goldplatingi-1金手指镀镍金(GoldFinger)i-2电镀软金(SoftNi/AuPlating)i-3浸镍金(ImmersionNi/Au)(ElectrolessNi/Au)J.喷锡(HotAirSolderLeveling)j-1水平喷锡(HorizontalHotAirSolderLeveling)j-2垂直喷锡(VerticalHotAirSolderLeveling)j-3超级焊锡(SuperSolder)j-4.印焊锡突点(SolderBump)K.成型(Profile)(Form)k-1捞型(N/CRouting)(Milling)k-2模具冲(Punch)k-3板面清洗烘烤(Cleaning&Backing)k-4V型槽(V-Cut)(V-Scoring)k-5金手指斜边(BevelingofG/F)L.短断路测试(ElectricalTesting)(Continuity&InsulationTesting)l-1AOI光学检查(AOIInspection)l-2VRS目检(Verified&Repaired)l-3泛用型治具测试(UniversalTester)l-4专用治具测试(DedicatedTester)l-5飞针测试(FlyingProbe)M.终检(FinalVisualInspection)m-1压板翘(WarpageRemove)m-2X-OUT印刷(X-OutMarking)m-3包装及出货(Packing&shipping)m-4目检(VisualInspection)m-5清洗及烘烤(FinalClean&Baking)m-6护铜剂(ENTEKCu-106A)(OSP)m-7离子残余量测试(IonicContaminationTest)(CleanlinessTest)m-8冷热冲击试验(ThermalcyclingTesting)m-9焊锡性试验(SolderabilityTesting)N.雷射钻孔(LaserAblation)N-1雷射钻Tooling孔(LaserablationToolingHole)N-2雷射曝光对位孔(LaserAblationRegistrationHole)N-3雷射Mask制作(LaserMask)N-4雷射钻孔(LaserAblation)N-5AOI检查及VRS(AOIInspection&Verified&Repaired)N-6BlaserAOI(afterDesmearandMicroetching)N-7除胶渣(Desmear)N-8微蚀(Microetching)A/W(artwork)底片Ablation烧溶(laser),切除abrade粗化abrasionresistance耐磨性absorption吸收ACC(accept)允收acceleratedcorrosiontest加速腐蚀acceleratedtest加速试验acceleration速化反应accelerator加速剂acceptable允收activator活化液activeworkinprocess实际在制品adhesion附着力adhesivemethod黏着法airinclusion气泡airknife风刀amorphouschange不定形的改变amount总量amylnitrite硝基戊烷analyzer分析仪anneal回火annularring环状垫圈;孔环anodeslime(sludge)阳极泥anodizing阳极处理AOI(automaticopticalinspection)自动:光学检测applicabledocuments引用之文件AQLsampling允收水准抽样aqueousphotoresist液态光阻aspectratio纵横比(厚宽比)Asreceived到货时backlighting背光back-up垫板bankedworkinprocess预留在制品basematerial基材baselineperformance基准绩效batch批betabackscattering贝他射线照射法beveling切斜边;斜边biaxialdeformation二方向之变形black-oxide黑化blankcontroller空白对照组blankpanel空板blanking挖空blip弹开blister气泡;起泡blistering气泡blowhole吹孔board-thicknesserror板厚错误bondingplies黏结层bow;bowing板弯breakout从平环内破出bridging搭桥;桥接BTO(BuildToOrder)接单生产burning烧焦burr毛边(毛头)camcorder一体型摄录放机carbide碳化物carlsonpin定位梢carrier载运剂catalyzing催化catholicsputtering阴极溅射法caulplate隔板;钢板calibrationsystemrequirements校验系统之各种要求centerbeammethod中心光束法centralprojection集中式投射线certification认证chamfer倒角(金手指)chamfering切斜边;倒角characteristicimpedance特性阻抗chargetransferoverpotential电量传递过电压chase网框checkboard棋盘chelator蟹和剂chemicalbond化学键che