PCB工程管制及送样评估介绍(NXPowerLite)

FoxconnTechnologyGroupSMTTechnologyDevelopmentCommitteeSMTTechnologyCenterSMT技術中心1.工程部功能介紹2.產品工程作業管制流程3.作業內容及管制要項4.異常案例說明5.樣品評估作業內容提要工程部•Gerber•Drawing•Memo•Mail•過濾產品•料號編碼•底片•程式•規範•其它•生產•檢查客戶業務現場工程部功能介紹CAM底片房程式PCB製造新技術導入Gerber製前工程工程部功能介紹PCBQuickTurnServiceI/LImageTransferI/LEtchLayUpLaminateRawMaterialDrillingPlatingO/LEtchingSolderMaskSurfaceFinishE/TO/LImageTransfer工程部功能介紹產品工程作業管制流程客戶GerberFile解壓縮&劃原稿規範製作&DFMCAM光繪機顯影產品工程師檢查品管工程師檢查AOI生產線NC鑽孔NC成型試鑽底片IssueMaterialRollerCoatingExposureDevelopingEtchingStrippingInner-layerAOIOxideTreatmentLaminationDrillingDesmearDeburrPTHOuter-layerImageTransferPatternPlatePureTinPlateEtchingOuter-layerAOISolderMaskLegendPrint(Optional)HASL(Optional)G/FPlate(Optional)ImmersionGold(Optional)ViaCapping(Optional)ProfilingOSP(Entek)(Optional)O/STestingFinalVisualInspectionPackagingShippingProductionFlowChart產品工程作業管制流程業務產品CAM安排產品工程師試資料FailPass料號審核CAM資料處理AA底片AOI制工作底片APass文件管制資料發行下生產線底片檢修新資料初步確認資料完整輸出劃原稿解原稿產品規格書登錄YESNOFail料號制作安排產品工程師品保CHECKIPQCPassSECUREPass下生產線Fail程序PassCHECK品保IPQCRoute板試鑽板FailA暗房GerberFile外型尺寸ApertureCADFileNetList鑽孔資料機構圖V-VUT斜邊壓合:其它通知?????????客戶資料確認要項作業內容及管制要項劃原稿管制流程Gerberfile解壓縮Aperturelist原稿工作底片+AutoInputAperturelist比對PositionDcodeShapeWidth(X)Height(Y)110rectangle100100211round5050:::::規範製作審核審核CAM/暗房底片/程式發行產品工程師組級主管課級主管課級主管時間規範流程3-1.PerC9144-80001aperturelist,position20isdefinedasbelow:20circleflash0.0000.0760falsefalse27trueSowhenourCAMinputingdatathisD-codewillbetreatedasshapeRoundandsize76milwithoutshowinganyalarm.productengineershavetocheckandcomparethedifferencebetweencustomer'soriginalaperturelistandours.ForthiscaseourengineerdidfindtheremarkonthebottomofaperturelistThermalaperture20padstackisTH078-057-20-4.3-3.OurProducengineermistookaperture20asD-Code20.AndsocheckallthelayersusingD20.ButfindD20isnotusedforpowerandGround,sothisremarkweneglected.3.RootCauseProductEng.NetworkingSystemPCCAMW/SCAMW/SStar1000DiskRaidFoxconnNetWorkingW/SNCRouteNCDrillPlottorFlyingProbeTesterW/SAOI(outerlayer)AOI(Film)VendorQualificationFlow(1)Start1.NewPCB,2.NewSupplier3.RevChangeNewPCBAcceptedTechnologyNewFacility,NewSupplierorNewTechnologyRevisionChangeAcceptedTechnologyQualifiedSupplierFirstArticleReviewPilotAssemblyandTestIncomingInspectionSampleBuildQualificationLotImpedanceTestingPCBQualificationFlow2213VendorQualificationFlow(2)VendorSurveyFirstArticleReviewSampleBuildStartEnvironmentReliabilityTestElectricalReliabilityTestReturntoPrimaryFlowMechanicalReliabilityTest內層線路錯誤AllpowerandgroundconnectionsfortheconnectorsaremissingonthePCB.WhenFoxconnPCBDivtranslateHPoriginalGerberdata,thethermalpadsonpowerandgroundlayerweretreatedasanti-pad.Andsomissedtheconnectiononthis2layersforthisboard.1.ProblemDescription2.ProblemAnalysisIncorrectcorrect異常案例說明AllpowerandgroundconnectionsfortheconnectorsaremissingonthePCB.WhenFoxconnPCBDivtranslateHPoriginalGerberdata,thethermalpadsonpowerandgroundlayerweretreatedasanti-pad.Andsomissedtheconnectiononthis2layersforthisboard.1.ProblemDescription2.ProblemAnalysisIncorrectcorrect異常案例說明SonyEMCSKisarazuTEC樣品評估作業1.評価基板FR-4（unti-CAF仕様)/Halogen-Free各5pcsTotal10pcs2.試験実施日２００２年３月１６日～２００２年３月２６日3.試験条件８５℃/８５％RH５０V２４０H4.規格高温湿中1E6Ω以下、不良判定5.結果☆（）内是試験結束後﹐常温下放置1H的過程中電阻値在1×１０８Ω以下的SAMPLE数。而且﹐從試験槽取出後、經過短時間放置﹐PA-PA100,TH-TH0.7P各1pcs是導通狀態﹐其它的樣品電阻均回復到原來狀態。UNIMICRONFR-4PA-PA150/1501.00E+041.00E+051.00E+061.00E+071.00E+081.00E+091.00E+101.00E+111.00E+12050100150200250time(hour)resistance(Ω)UNIMICRONFR-4PA-PA100/1001.00E+041.00E+051.00E+061.00E+071.00E+081.00E+091.00E+101.00E+111.00E+12050100150200250time(hour)resistance(Ω)A-1SonyEMCSKisarazuTECA-8UNIMICRONFR-4TH-PA1.00E+041.00E+051.00E+061.00E+071.00E+081.00E+091.00E+101.00E+111.00E+12050100150200250time(hour)resistance(Ω)A-6樣品評估作業UNIMICRONFR-4TH-TH0.8P1.00E+041.00E+051.00E+061.00E+071.00E+081.00E+091.00E+101.00E+111.00E+12050100150200250UNIMICRONFR-4TH-TH0.7P1.00E+041.00E+051.00E+061.00E+071.00E+081.00E+091.00E+101.00E+111.00E+12050100150200250time(hour)resistance(Ω)SonyEMCSKisarazuTECB-7C-6UNIMICRONHFTH-TH0.8P1.00E+041.00E+051.00E+061.00E+071.00E+081.00E+091.00E+101.00E+111.00E+12050100150200250time(hour)resistance(Ω)UNIMICRONHFTH-TH0.7P1.00E+041.00E+051.00E+061.00E+071.00E+081.00E+091.00E+101.00E+111.00E+12050100150200250time(hour)resistance(Ω)E-3F-8樣品評估作業SonyEMCSKisarazuTECFig.1shortPoint観察結果☆A-8PA-PA100/100解析結果L1L2L3L4L5L6研磨欠陥研磨樣品評估作業SonyEMCSKisarazuTECFig.2shortPoint断面観察結果☆A-8PA-PA100/100解析結果Fig.3shortPoint断面観察結果樣品評估作業SonyEMCSKisarazuTEC☆A-8PA-PA100/100解析結果EDS分析領域検出元素:C,O,Cu,Br,(Au)Fig.4ShortPointEDS定性分析結果樣品評估作業SonyEMCSKisarazuTEC☆A-8PA-PA100/100解析結果Fig.5ShortPointEDSImage分析結果SEIImageBrImageCuImage難燃剤Br凝縮樣品評估作業SonyEMCSKisarazuTECFig.6shortPoint観察結果☆C-6TH-TH0.7解析結果Fig.7shortPoint断面観察結果Fig.8shortPoint断面観察結果Over研磨樣品評估作業SonyEMCSKisarazuTEC☆A-6TH-PA解析結果Fig.9pattern部表面観察結果Fig.10pattern周辺内層剥離如前所述﹐電阻值已恢復到原來狀態。樣品評估作業SonyEMCSKisarazuTEC6.注釋☆100-100﹕無清潔度問韙存在﹐考慮是否與難燃劑含量有關?☆TH0.7﹕仍在對其它的SAMPLE進行試驗分析中。現有狀況﹕樹脂少﹐玻璃布(glasscross)與銅(cu)配線直接接觸﹐CAF易產生。☆PA-TH﹕沒有確認到異常﹐周邊的PATTERN中有內層剝離。1.需要改善基材質量2.改善其它DRILLING工站樣品評估作業結束