PCB术语总整理

ＰＣＢ朮语总整理AbieticAcid松脂酸.AbrasionResistance耐磨性.Abrasives磨料,刷材.ABS树脂.Absorption吸收(入).AcImpedance交流阻抗.AcceleratedTest(Aging)加速老化(试验).Acceleration速化反应.Accelerator加速剂,速化剂.Acceptability,Acceptance允收性,允收.AccessHole露出孔,穿露孔.Accuracy准确度.AcidNumber(AcidValue)酸值.AcousticMicroscope(AM)感音成像显微镜.Acrylic压克力(聚丙烯酸树脂).ActinicLight(orIntensity,orRadiation)有效光.Activation活化.Activator活化剂.ActiveCarbon活性炭.ActiveParts(Devices)主动零件.Acutance解像锐利度.AdditionAgent添加剂.AdditiveProcess加成法.Adhesion附着力.AdhesionPromotor附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.AirInclusion气泡夹杂.AirKnife风刀.Algorithm算法.AliphaticSolvent脂肪族溶剂.AluminiumNitride(AlN)氮化铝.AmbientTamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.AnalogCircuit/AnalogSignal模拟电路/模拟讯号.AnchoringSpurs着力爪.AngleofContack接触角.AngleofAttack攻角.Anion阴离子.Anisotropic异向性,单向的.Anneal韧化(退火).AnnularRing孔环.Anode阳极.AnodeSludge阳极泥.Anodizing阳极化.ANSI美国标准协会.Anti-FoamingAgent消泡剂.Anti-pitAgent抗凹剂.AOI自动光学检验.Apertures开口,钢版开口.AQL品质允收水准.AQL(AcceptableQualityLevel)允收品质水准.AramidFiber聚醯胺纤维.ArcResistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.AspectRatio纵横比.Assembly组装装配.A-stageA阶段.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Axial-lead轴心引脚.Azeotrope共沸混合液.*****B*****BackLight(BackLighting)背光法.BackTaper反锥斜角.Backpanels,Backplanes支撑板.Back-up垫板.BalancedTransmissionLines平衡式传输线.BallGridArray球脚数组(封装).Bandability弯曲性.BankingAgent护岸剂.BareChipAssembly裸体芯片组装.Barrel孔壁,滚镀.BaseMaterial基材.BasicGrid基本方格.Batch批.Baume波美度(凡液体比重比水重则Be=145-(145÷Sp.Gr)凡液体比重比水轻则Be=140÷(Sp.Gr-130)*Sp.Gr为比重即同体绩物质对纯水1g/cm的比值).Beamlead光芒式的平行密集引脚.Bed-of-NailTesting针床测试.BellowsConact弹片式接触.BetaRayBackscatter贝他射线反弹散射.Bevelling切斜边.Bias斜张纲布,斜纤法.Bi-LevelStencil]双阶式钢板.Binder粘结剂.Bits头(DrillBits).BlackOxide黑氧化层.Blanking冲空断开.Bleack漂洗.Bleeding溢流.BlindViaHole肓通孔.Blister局部性分层或起泡.BlockDiagram电路系统块图.Blockout封纲.Blotting干印.BlottingPaper吸水纸.BlowHole吹孔.BluePlaque蓝纹(锡面钝化层).BlurEdge(Circle)模糊边带(圈).BombSight弹标.BondStrength结合强度.Bondability结合性.BondingLayer结合层接着层.BondingSheet(Layer)接合片.BondingWire结合线.Bow,Bowing板弯.Braid编线.Brazing硬焊(用含银的铜锌合金焊条).在425℃~870℃下进行熔接的方式).BreakPoint显像点.Break-awayPanel可断开板.BreakdownVoltage崩溃电压.Break-out破出.Bridging搭桥.BrightDip光泽浸渍处理.Brightener光泽剂.BrownOxide棕氧化.BrushPlating刷镀.B-stageB阶段.BuildUpProcess增层法制程.Build-up堆积.Bulge鼓起.Bump突块.BumpingProcess凸块制程.Buoyancy浮力.BuriedViaHole埋导孔.Burn-in高温加速老化试验.Burning烧焦.Burr毛头.BusBar汇电杆.ButterCoat外表树脂层.*****C*****C4ChipJointC4芯片焊接.Cable电缆.CAD计算机辅助设计.CalenderedFabric轧平式纲布.CapLamination帽式压合法.Capacitance电容.CapacitiveCoupling电容耦合.CapillaryAction毛细作用.Carbide碳化物.CarbonArcLamp碳弧灯.CarbonTreatment,Active活化炭处理.Card卡板.CardCages/CardRacks电路板构装箱.CarlsonPin卡氏定位稍.Carrier载体.Cartridge滤心.Castallation堡型绩体电路器.CatalyzedBoard,CatalyzedSubstrate催化板材.Catalyzing催化.Cathode阴极.Cation阴向离子,阳离子.CaulPlate隔板.Cavitation空泡化半真空.Center-to-CenterSpacing中心间距.Ceramics陶瓷.Cermet陶金粉.Certificate证明书.CFC氟氢碳化物.Chamfer倒角.CharacteristicImpedance特性阻抗.Chase纲框.CheckList检查清单.Chelate螯合.ChemicalMilling化学研磨.ChemicalResistance抗化性.Chemisorption化学吸附.Chip芯片(粒).ChipInterconnection芯片互连.ChiponBoard芯片粘着板.ChipOnGlass晶玻接装(COG).Chisel钻针的尖部.ChlorinatedSolvent含氯溶剂,氯化溶剂.CircumferentialSeparation环状断孔.Clad/Cladding披覆.CleanRoom无尘室.Cleanliness清洁度.Clearance余地,余环.ClinchedLeadTerminal紧箝式引脚.Clinched-wireThroughConnection通孔弯线连接法.ClipTerminal绕线端接.Coat,Coating皮膜表层.CoaxialCable同轴缆线.CoefficientofThermalExpansion热膨胀系数.Co-Firing共绕.ColdFlow冷流.ColdSolderJoint冷焊点.CollimatedLight平行光.Colloid胶体.ColumnarStructure柱状组织.CombPattern梳型电路.ComplexIon错离子.ComponentHole零件孔.ComponentOrientation零件方向.ComponentSide组件面.Composites,(CEM-1,CEM-3)复合板材.CondensationSoldering凝热焊接,液化放热焊接.Conditioning整孔.Conductance导电.ConductiveSalt导电盐.Conductivity导电度.ConductorSpacing导体间距.ConformalCoating贴护层.Conformity吻合性,服贴性.Connector连接器.ContactAngle接触角.ContactArea接触区.ContactResistance接触电阻.Continuity连通性.ContractService协力厂,分包厂.ControlledDepthDrilling定深钻孔.ConversionCoating转化皮膜.Coplanarity共面性.Copolymer共聚物.CopperFoil铜皮.CopperMirrorTest铜镜试验.CopperPaste铜膏.Copper-Invar-Copper(CIC)综合夹心板.CoreMaterial内层板材,核材.CornerCrack通孔断角.CornerMark板角标记.Counterboring方型扩孔.Countersinking锥型扩孔.CouplingAgent偶合剂.Coupon,TestCoupon板边试样.Coverlay/Covercoat表护层.Crack裂痕.Crazing白斑.Crease皱折.Creep潜变.CrossectionArea截面积.CrosshatchTesting十字割痕试验.Crosshatching十字交叉区.Crosslinking,Crosslinkage交联,架桥.Crossover越交,搭交.Crosstalk噪声,串讯.CrystallineMeltingPoint晶体熔点.C-StageC阶段.Cure硬化,熟化.CurrentDensity电流密度.Current-CarryingCapability载流能力.CurtainCoating濂涂法.*****D*****DaisyChainedDesign菊瓣设计.DatumReference基准参考.DaughterBoard子板.Debris碎屑,残材.Deburring去毛头.DeclinationAngle斜射角.Definition边缘逼真度.Degradation劣化.Degrasing脱脂.DeionizedWater去离子水.Delamination分离.DendriticGrowth枝状生长.Denier丹尼尔(是编织纺织所用各种纱类直径单位,定义9000米纱束所具有的重量(以克米计)).Densitomer透光度计.Dent凹陷.Deposition皮膜处理.Desiccator干燥器.Desmearing去胶渣.Desoldering解焊.Developer显像液,显像机.Developing显像.Deviation偏差.Device电子组件.Dewetting缩锡.D-glassD玻璃.DiazeFilm偶氮棕片.Dichromate重铬酸盐.Dicing芯片分割.Dicyandiamide(Dicy)双氰胺.Die冲模.DieAttach晶粒安装.DieBonding晶粒接着.DieStamping冲压.Dielectric介质.DielectricBreakdownVoltage介质崩溃电压.DielectricConstant介质常数.DielectricStrength介质强度.DifferentialScanningCalorimetry(DSC)微差扫瞄热卡分析法.DiffusionLayer扩散层.Di