印制电路板设计要求-SMD元器件封装库尺寸要求

2001-12-11发布2002-01-01实施深圳市中兴通讯股份有限公司发布印制电路板设计规范——SMD元器件封装库尺寸要求Q/ZX04.100.5-2001-2001Q/ZX深圳市中兴通讯股份有限公司企业标准(技术标准)Q/ZX04.100.5-2001目次1范围.............................................................................12引用标准.........................................................................13术语.............................................................................14使用说明.........................................................................25焊盘图形.........................................................................25.1SMD：表面贴装方焊盘图形尺寸..............................................25.2SMDC：表面贴装圆焊盘图形尺寸.............................................35.3SMDF表面贴装手指焊盘图形尺寸............................................45.4THC通孔圆焊盘图形尺寸...................................................55.5THS通孔方焊盘图形尺寸...................................................65.6THR通孔矩形焊盘图形尺寸.................................................76SMD元器件及焊盘图形尺寸.........................................................86.1SMD分立元件.............................................................86.1.1SMD电阻.............................................................86.1.1.1SMD电阻元件尺寸.....................................................86.1.2SMD电容............................................................106.1.3SMD电感............................................................126.1.4SMD钽电容..........................................................146.1.5MELF（金属电极无引线端面元件）......................................166.1.6SMD排阻............................................................186.1.7SOT23..............................................................206.1.8SOT89..............................................................226.1.9SOD123.............................................................246.1.10SOT143.........................................................266.1.11SOT223.........................................................286.1.12TO252/TO268...................................................306.1.13SMD220元件（对应物料代码为15100085等）........................326.1.14SMA元件(对应物料代码为15100016a)...............................346.1.15SOT-323元件(对应物料代码为15100001)............................366.1.16SOT-363元件(对应物料代码为15100001)............................386.2两侧翼形引脚元件........................................................406.2.1SOIC[SmallOutlineIntegratedCircuits:小外形集成电路]..............406.2.2SSOIC[SmallOutlineIntegratedCircuits:小外形集成电路].............426.2.3SOP[SmallOutlinePackageIntegratedCircuits:小外形封装集成电路]...446.2.4TSOP[ThinSmallOutlinePackage:薄小外形封装].......................466.2.5CFP[CeramicFlatPacks:陶瓷扁平封装]................................486.3两侧“J”形引脚元件[SOJ]................................................506.3.1SOJ元件尺寸........................................................506.3.2SOJ的焊盘尺寸......................................................516.4四边有翼形引脚的元件....................................................546.4.1PQFP(PlasticQuadFlatPack)........................................546.4.2SQFP(ShrinkQuadFlatPack),方形....................................566.4.3SQFP矩形...........................................................646.4.4CQFP[CeramicQuadFlatPack]........................................686.5四边有“J”形引脚的元件.................................................706.5.1方形PLCC[Plasticleadedchipcarriers].............................706.5.2PLCC，矩形..........................................................726.5.3LCC[Leadlessceramicchipcarriers]................................746.6改进型双列引脚元件......................................................766.6.1DIP[ModifiedDual-In-Linecomponents]...............................766.7BGA.....................................................................786.7.1PBGA[PlasticBallGridArray],方形..................................786.7.21.27mmR-PBGA.......................................................92前言本标准规定了印制电路板设计过程中，元器件封装库焊盘图形及SMD焊盘图形尺寸要求。本标准由深圳市中兴通讯股份有限公司康讯工艺部提出，技术中心技术部归口。本标准起草部门：康讯工艺部。本标准起草人：贾变芬，贾忠中，杨清亮，袁红波。本标准于2001年12月首次发布。Q/ZX04.100.5-2001深圳市中兴通讯股份有限公司2001－12－11批准2002－01－01实施11范围本标准规定了印制电路板（以下简称PCB）设计所使用的元器件封装库中的焊盘图形及SMD焊盘图形尺寸要求。本标准适用于深圳市中兴通讯股份有限公司。2引用标准下面引用的标准，以网上发布的最新标准为有效版本。IPC-SM-782SurfaceMountDesignandLandPatternStandard。Q/ZX04.100.2-2001印制电路板设计规范——工艺性要求。Q/ZX04.100.4-2001印制电路板设计规范——元器件封装库基本要求。3术语SMD:SurfaceMountDevices/表面贴装元件。RA：ResistorArrays/排阻。MELF：Metalelectrodefacecomponents/金属电极无引线端面元件.SOT：Smalloutlinetransistor/小外形晶体管。SOD：Smalloutlinediode/小外形二极管。SOIC：SmalloutlineIntegratedCircuits/小外形集成电路.SSOIC:ShrinkSmallOutlineIntegratedCircuits/缩小外形集成电路.SOP:SmallOutlinePackageIntegratedCircuits/小外形封装集成电路.SSOP:ShrinkSmallOutlinePackage/缩小外形封装集成电路.TSOP:ThinSmallOutlinePackage/薄小外形封装.TSSOP:ThinShrinkSmallOutlinePackage/收缩薄小外形封装.CFP:CeramicFlatPacks/陶瓷扁平封装.SOJ:SmalloutlineIntegratedCircuitswithJLeads/“J”形引脚小外形集成电路.PQFP：PlasticQuadFlatPack/塑料方形扁平封装。SQFP：ShrinkQuadFlatPack/缩小方形扁平封装。CQFP：CeramicQuadFlatPack/陶瓷方形扁平封装。PLCC：Plasticleadedchipcarriers/塑料封装有引线芯片载体。LCC：Leadlessceramicchipcarriers/无引线陶瓷芯片载体。DIP：Dual-In-Linecomponents/双列引脚元件。PBGA：PlasticBa