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ServiceTypeDesignTypeSchematicTypenewdesignECOmixedcircuitryLowlevelanalogcircuitboardRFboardHighspeeddigitalboardNoneHanddrawnOrcadCapturePadsSchematicprotelSchematicComponentfootprintComponentquantitySpecialpartsorcircuitryLibraryoffilecontainingallfootprintswillbeprovidedAllfootprintsarecommonandnoneedtobecreatedSomefootprintsneedtobecreated10%~50%NONEBGAFinepitchBGA(1MM)100+PINQFPHighdensityconnectorSwitchingPowerSupplyHighCurrentDevicesBuiredResistorBuriedCapacitorChiponBoardWireBondSpecialroutingonPCBTotalspecialcomponentscount?(HowmanyBGA's,etc...)Totalnodecountinnetlist?(PintoPinconnections)TestpointsforICT(InCircuitTest)onallnodesofthePCB?TypeofsubstrateNoneHighVoltageTraceSpacingsHighCurrentRoutingTransmissionLinesforRFLengthMatchedBusRoutingDifferentialPairRoutingDDR3DDR2PCIPCI-e100%coverage50~90%coveragenoneFR-4CEM1RogersseriesPCBoverallthicknessNumberoflayersOverallboarddimensions:Isaproductionpaneldrawingrequired?DoesthePCBhavetobedesignedinaspecificsoftwarepackage?PADSPowerPCBCadenceAllegroProtel
本文标题:PCB 设计报价要素
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