流程图 PCB MfgFLOW CHART

PLATOELECTRONICSINC.DESIGNFORMANUFACTUREPRODUCIBILITYANDLOWERCOSTCONTENTS1.PCBMFG.FLOWCHARTP22.PANELUTILIZATIONELEMENTSP3~P43.AVAILABLEPANELSIZESP54.ARRAYDEPANELIZATIONP6~P75.MATERIALCOSTAFFECTSBOARDCOSTP86.BOARDTHICKNESSP9~P197.LAMINATECONSTRUCTIONSP20~P268.TRANSMISSIONLINETYPESP27~P299.LAYERDENSITYP3010.SINGLEPLYLAMINATE/PREPREGCONSTRUCTIONP31~P3211.HOLESIZEANDDESITYP33~P3412.PADSIZEVS.HOLESIZEP3514.NOMENCLATUREP3615.GOLDPLATINGP3716.T.C.P.(TAPECARRIERPACKAGE)P3817.BALLGRIDARRAY(BGA)P3918.ENTEK106AP4018.BLINDANDBURIEDVIAOPTIONSP41~P4313.SOLDERMASK19.BLINDANDBURIEDVIAOPTIONSP4418.BLINDANDBURIEDVIAOPTIONS20.MINIMUMDESIGNRULEFORBuild-UpsP45~P4621.PRODUCTIONCAPABILITIESP47流程圖PCBMfg.FLOWCHARTUPDATED:2001,07,06顧客CUSTOMER工程製前FRONT-ENDDEP.裁板LAMINATESHEAR內層影像INNERLAYERIMAGE預疊板及疊板LAY-UP通孔電鍍P.T.H.液態防焊LIQUIDS/M外觀檢查VISUALINSPECTION成型FINALSHAPING業務SALESDEPARTMENT生產管理P&MCONTROL蝕銅I/LETCHING鑽孔DRILLING壓合LAMINATION外層乾膜OUTERLAYERIMAGE二次銅及錫鉛電鍍PATTERNPLATINGO/LETCHING蝕銅檢查INSPECTION噴錫HOTAIRLEVELING電測ELECTRICALTEST出貨前檢查OQC包裝出貨PACKING&SHIPPING曝光壓膜/塗佈前處理EXPOSURELAMINATION/ROLERCOATINGPRELIMINARYTREATMENT顯影蝕銅去膜STRIPPINGETCHINGDEVELOPIG黑棕化處理BLACKOXIDELAY-UP烘烤BAKING預疊板及疊板壓合後處理POSTTREATMENTLAMINATION曝光壓膜前處理EXPOSURELAMINATIONPRELIMINARYTREATMENT二次銅電鍍錫鉛電鍍PATTERNPLATINGT/LPLATING去膜STRIPPING蝕銅ETCHING剝錫鉛T/LSTRIPPING絲網印刷PRINTING前處理PRELIMINARYTREATMENT預乾燥PRE-CUREDEVELOPING曝光EXPOSURE顯影POSTCURE後烘烤多層板內層流程INNERLAYERPRODUCTMLB全板電鍍PANELPLATING銅面防氧化處理OSP(Entek)外層製作OUTER-LAYERTENTINGPROCESSHOTAIRLEVELINGGOLDPLATING鍍鎳鍍金鍍化學鎳金E-lessNi/Au選擇性鍍鎳鍍金SELECTIVEGOLD印文字SCREENLEGENDWORKINGA/WDRAWINGPROGRAMRUNCARD網版製作STENCIL圖面工作底片製作規範程式帶鑽孔,成型機D.N.C.MASTERA/WDISK,M/T底片磁片,磁帶藍圖DRAWING資料傳送MODEM,FTPAOI檢查AOIINSPECTIONDESMER前處理除膠渣E-LESSCU通孔電鍍PRELIMINARYTREATMENTDOUBLESIDEELECTRONICLTDDesignforManufactureP3PARTSIZEASITAFFECTSBOARDCOSTPANELUTILIZATIONELEMENTS1.PANELBORDERS4LAYERac(min.118”normal.200)ba≧0.450b≧0.600FinishedsizeWORKSIZE(Border)DesignforManufactureP46LAYERORABOVE*SPACINGBETWEENPARTSNORMALSTEP(C)=.200butcanbereduced.118ifneeded.ac(min.118”normal.200)ba≧0.600b≧0.700FinishedsizeWORKSIZEDesignforManufactureP5AVAILABLEPANELSIZESSTANDARDDISTRIBUTIONPANELSIZEASFOLLOWS1.21.0“*24.0”10.16.0*20.02.20.0“*24.0”11.16.0*18.03.20.0“*22.0”12.15.0*20.04.19.0“*22.0”13.14.0*24.05.18.0“*24.0”14.14.0*19.26.18.0“*20.0”15.14.0*16.07.17.0“*22.0”16.13.3*24.08.16.0“*24.0”17.13.3*20.09.16.0“*21.0”18.DesignforManufactureP6ARRAYDEPANELIZATIONOPTIONSA)ROUTEDSLOTSWITHBREAKAWAYTABS1.Typicalslotsizesare.125,.093,.078,.059”(3.75mm,2.38mm,2.0mm,1.5mm)2.UseDiagramAforastraight,cleanedgeafterbreakawayCENTERHOLESDRILLEDAT.022OUTSIDEHOLESDRILLEDAT.042SLOTWIDTH.0930.2000.05000.15000.07500.02500.093DesignforManufactureP7ARRAYDEPANELIZATIONOPTIONSB)PARTSARESCORED1.Partsarespacedback-to-back.Thisallowsforbetterparttopanelutilization..020TYP.012.06230°.021TYP.021.06245°.021TYP.024.06260°DesignforManufactureP8MATERIALCOSTAFFECTSBOARDCOSTMATERIALCOSTISASIGNIFICANTCOSTOFTHEPWB.(APPROXIMATELY30-40%)PLATOUTILIZESTHEFOLLOWINGLAY-UPSWHICHARECOSTEFFECTIVEANDDIMENSIONALLYSTABLE.(BASEDON.062THICKNESSAND1OZCOPPER.)4LAYERFOIL.5OZ.0.00950.0095FOIL.5OZ.0.0391/1Tol.+/-.002+/-.003+/-.002L1L2L3L4DesignforManufactureP96LAYERFOIL.5OZ.0.00950.0095FOIL.5OZ.0.0151/1Tol.+/-.0015+/-.002+/-.002L1L2L3L40.0151/10.005L5L6+/-.002+/-.0015FOIL.5OZ.0.0065FOIL.5OZ.0.010Tol.+/-.0015+/-.0015+/-.0015L1L2L3L40.0050.0100.005L5L6+/-.0015+/-.00150.00650.010L7L8+/-.0015+/-.00158LAYERDesignforManufactureP1010LAYERFOIL.5OZ.0.0065FOIL.5OZ.0.0061/1Tol.+/-.0015+/-.0015+/-.0015L1L2L3L40.0050.0061/10.005L5L6+/-.0015+/-.00150.0050.0061/1L7L8+/-.0015+/-.00150.00650.0061/1L9L10+/-.0015+/-.0015THECALLOUTOFSPECIFICDIELECTRICQUIREMENTSORTHEUSEOF2OZ.COPPERCANINCREASETHECOSTOFTHEPARTUPTO20%.DesignforManufactureP11BOARDTHICKNESSHowthincanwego?4Layer1.FinishedThickness=.0196+/-0.003Standardmaterialwith1OZ.copper2.FinishedThickness=.0182+/-0.003”.5oz.copperand2plyprepreg0.004”1/1,FR-4COPPERFOIL1OZCOPPERFOIL1OZPREPREG2116HRPREPREG2116HR0.004“1/1,FR-4COPPERFOIL0.5OZPREPREG1080COPPERFOIL0.5OZPREPREG1080PREPREG1080PREPREG1080DesignforManufactureP123.AbsoluteThinnest=.0118+/-.003Using1plyprepreg1.FinishedThickness=.0314+/-0.003”Standardmaterialwith1OZ.copper6LayerBOARDTHICKNESSHowthincanwego?4Layer0.004“0.5/0.5,FR-4COPPERFOIL0.5OZCOPPERFOIL0.5OZPREPREG1080PREPREG10800.004“1/1,FR-4COPPERFOIL1OZPREPREG1080COPPERFOIL1OZPREPREG1080PREPREG1080PREPREG10800.004“1/1,FR-4PREPREG1080PREPREG1080DesignforManufactureP132.FinishedThickness=.0225+/-0.003”.5oz.copperand1plyprepreg3.AbsoluteThinnest=.0197+/-.003”LimitedPanelSizeUsing1plyprepregCostImpactBOARDTHICKNESSHowthincanwego?6Layer0.004“0.5/0.5,FR-4COPPERFOIL0.5OZPREPREG1080COPPERFOIL0.5OZPREPREG10800.004“0.5/0.5,FR-4PREPREG10800.004“1/1,FR-4COPPERFOIL0.5OZPREPREG1080COPPERFOIL0.5OZPREPREG10800.004“1/1,FR-4PREPREG1080DesignforManufactureP14BOARDTHICKNESSHowthincanwego?8Layer1.FinishedThickness=.0432+/-0.003”Standardmaterialwith1OZ.copper0.004“1/1,FR-4COPPERFOIL1OZPREPREG1080COPPERFOIL1OZPREPREG1080PREPREG1080PREPREG10800.004“