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─2013-JAN─InstructionofHDI+VFProcess─2013-JAN─HDI1+4b+1VF-StructureProfileAu/NiL1L1L2L2L3L3L4L4L5L5L6L6─2013-JAN─SHEETWorkingPanel1.CuttingofBoard(L3/L4)─2013-JAN─COREEtchingResistL3L3L4L42.ResistCoating/DryFilmLamination(L3/L4)─2013-JAN─L3L3L4L43.Exposure+Developing(L3/L4)─2013-JAN─L3L3L4L44.Etching(L3/L4)─2013-JAN─L3L3L4L45.ResistStripping(L3/L4)─2013-JAN─6.OpticalInspection(L3/L4)─2013-JAN─L3L3L4L47.BrownOxide(L3/L4)─2013-JAN─L2L2L3L3L4L4L5L5Prepreg8.Lamination(L2-L5)─2013-JAN─9.X-RayPunching(L2-L5)─2013-JAN─L2L2L3L3L4L4L5L510.MechanicalDrilling(L2-L5)─2013-JAN─11.CopperPlatting(L2-L5)L2L2L3L3L4L4L5L5─2013-JAN─L2L2L3L3L4L4L5L5Expoxy12.EpoxyPlugging(L2-L5)─2013-JAN─L2L2L3L3L4L4L5L513.EpoxyBrushing(L2/L5)─2013-JAN─L2L2L3L3L4L4L5L514.DryFilmLamination(L2/L5)─2013-JAN─L2L2L3L3L4L4L5L515.Exposure+Developing(L2/L5)─2013-JAN─L2L2L3L3L4L4L5L516.Etching(L2/L5)─2013-JAN─L2L2L3L3L4L4L5L517.ResistStripping(L2/L5)─2013-JAN─18.OpticalInspection(L2/L5)─2013-JAN─L2L2L3L3L4L4L5L519.BrownOxide(L2/L5)─2013-JAN─L1L1L2L2L3L3L4L4L5L5L6L6Laserprepreg20.Lamination(L1-L6)─2013-JAN─21.X-RayPunching(L1-L6)─2013-JAN─L1L1L2L2L3L3L4L4L5L5L6L622.FilmLamination(Conformal-MaskOpening)─2013-JAN─23.Exposure+Developing(Conformal-MaskOpening)L1L1L2L2L3L3L4L4L5L5L6L6─2013-JAN─24.Etching(Conformal-MaskOpening)L1L1L2L2L3L3L4L4L5L5L6L6─2013-JAN─25.ResistStripping(ConformalMaskOpening)L1L1L2L2L3L3L4L4L5L5L6L6─2013-JAN─26.LaserAblationL1L1L2L2L3L3L4L4L5L5L6L6─2013-JAN─26.CopperFillingofLaserHoleL1L1L2L2L3L3L4L4L5L5L6L6─2013-JAN─27.MechanicalDrilling(L1-L6)L1L1L2L2L3L3L4L4L5L5L6L6─2013-JAN─28.FullPlatting(OuterLayer)L1L1L2L2L3L3L4L4L5L5L6L6─2013-JAN─29.DryFilmLamination(OuterLayer)L1L1L2L2L3L3L4L4L5L5L6L6─2013-JAN─30.Exposure+Developing(OuterLayer)L1L1L2L2L3L3L4L4L5L5L6L6─2013-JAN─L1L1L2L2L3L3L4L4L5L5L6L6Tin31.PatternPlatting+TinPlatting(OuterLayer)─2013-JAN─32.Dry-FilmResistStripping(OuterLayer)L1L1L2L2L3L3L4L4L5L5L6L6─2013-JAN─33.Etching(OuterLayer)L1L1L2L2L3L3L4L4L5L5L6L6─2013-JAN─L1L1L2L2L3L3L4L4L5L5L6L634.TinStripping(OuterLayer)─2013-JAN─35.OpticalInspection(OuterLayer)─2013-JAN─36.SolderMask(OuterLayer)L1L1L2L2L3L3L4L4L5L5L6L6─2013-JAN─Au/Ni37.ImmersionGold(OuterLayer)L1L1L2L2L3L3L4L4L5L5L6L6─2013-JAN─38.LegendPrinting(OuterLayer)─2013-JAN─39.Routing─2013-JAN─40.ElectricalTesting─2013-JAN─41.FinalInspection─2013-JAN─~ThankyouThankyou~THEEND
本文标题:高密度互板HDIPCB_VF填孔
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