smt检验规范

Doc.No.:TMQA-0E-004Rev.:0EfectiveDate:2001/8/5Pge1of30FormNo.:ACM0-01-001-01(010807)1-SMTWORKMANSHIPSTANDARDSSMT製品標準1.0、目的(Purpose):1.1作為裝配檢驗人員作業依據,保障產品合於本廠的品質規格。1.2作為新進人員訓練參考資料。2.0、適用範圍(Scope):2.1本規範適用於ACMSMT的裝配及目視檢驗,規格中僅列出SMT的部份,未列出的部份,請參考文件PCBAWorkmanshipStandards。3.0、職責(Responsibility):3.1QA檢驗員依SMTWorkmanshipStandards執行驗貨標準。4.0、作業流程(FlowChart):N/A5.0、作業內容(ActivitiesDescription):5.1點膠(StakingAdhesive)5.2晶片型元件(ChipComponent)5.3圓柱型元件(CylindricalComponent)5.4LeadlessChipCarrierswithCastellatedTerminations)5.5臥式L型及海鷗腳(FlatRibbon〝L〞andGullWingLeads)5.6圓型腳或扁平腳(RoundorFlattenedLeads)Doc.No.:TMQA-0E-004Rev.:0EfectiveDate:2001/8/5Pge2of30FormNo.:ACM0-01-001-01(010807)25.7〝J〞型腳(〝J〞Lead)5.8〝I〞型腳(〝I〞Lead)5.9墓碑現象5.10CrackandChip-out5.11點膠(StakingAdhesive)5.11.1最佳狀況:a.無任何可見的膠殘留物在焊墊及元件端上。b.點膠必須置於兩焊墊之間。5.11.2若有位於焊點與元件端間之膠,則必須小於元件端最小焊點寬度的50%(適用於無腳的SMD元件)不可因PCB與元件端殘留膠,而造成填錫不良5.12缺點歸類List6.0核決權限(Authority):本文經QA主管或指定主管核准生效,且由QA主管其核准才可修改內文。7.0、備註(Remark):7.1檢驗條件:7.1.1正常室內照明(500Lux-1000Lux)7.1.2正常視力(若對判定有爭議時,可用2.5x-40x的放大鏡判定)8.0參考文件(ReferenceDocumentation)8.1ACMWorkmanshipStandard8.2MIL-STD2000ADoc.No.:TMQA-0E-004Rev.:0EfectiveDate:2001/8/5Pge3of30FormNo.:ACM0-01-001-01(010807)38.3ANSI/J-STD-001B8.499年電路板採購及規範手冊8.5ANS/IPC-A-610B(associationconnectingelectronicsindustries)八、晶元型元件(ChipComponent):8-1.元件側偏移量(A)必須小於50%的元件端點寬度(W)及50%的焊盤寬度(P)SideOverhang(A)最佳(Target)：A≦0允收(Acceptable)：A≦50%WorA≦50%P拒收(NonconformingDefect)：A50%WorA50%P8-2.元件端不允許有偏移(B)EndOverhang(B)允收(Acceptable)：B≦0Doc.No.:TMQA-0E-004Rev.:0EfectiveDate:2001/8/5Pge4of30FormNo.:ACM0-01-001-01(010807)4拒收(NonconformingDefect)：B08-3.元件端焊點寬度(C)EndJointWidth(C)最佳(Target)：C＝W或P允收(Acceptable)：C≧50%W或C≧50%P拒收(NonconformingDefect)：C＜50%W8-4.最大填錫高度(E)MaximumFilletHeight(E)最大填錫高度可超過元件高度(含金屬端)，但不可覆蓋到元件本體(非金屬部份)MaximumFiletHeightmayoverhangtheLand，butshellnotextendontoDoc.No.:TMQA-0E-004Rev.:0EfectiveDate:2001/8/5Pge5of30FormNo.:ACM0-01-001-01(010807)5thecomponentBody8-5.最小填錫高度(F)必須大於最小錫厚(G)加上25%的元件端高度(H)MinimumFilletHeight(F)isMinimumThickness(G)Plus25%(H)orGPlus0.5mm允收(Acceptable)：F≧G+25%H拒收(NonconformingDefect)：FG+25%H8-6.元件端與焊墊須重疊(J)EndOverlap(J)允收(Acceptable)：J0拒收(NonconformingDefect)：J≦0Doc.No.:TMQA-0E-004Rev.:0EfectiveDate:2001/8/5Pge6of30FormNo.:ACM0-01-001-01(010807)6九、圓柱型元件CylinderEndCapTermination9-1.元件的側移量(A)不可超過焊墊寬度(P)的25%SideOverhand(A)最佳(TargetCondition)：無側移A≦0允收(Acceptable)：A≦25%P拒收(NonconformingDefect)：A25%P9-2.元件端不允許有偏移(B)EndOverhang(B)isnotPermitted允收(Acceptable)：B≦0拒收(NonconformingDefect)：B0JDoc.No.:TMQA-0E-004Rev.:0EfectiveDate:2001/8/5Pge7of30FormNo.:ACM0-01-001-01(010807)79-3.焊點寬度(C)必須大於元件寬度(W)的50%或大於Pad寬度(P)的50%EndJointWidth(C)最佳(TargetCondition)：C≧W或C≧P允收(Acceptable)：C≧５０%W或C≧50%P拒收(NonconformingDefect)：C50%W且C50%P9-4.最大填錫高度(E)不可蓋到元件本體(非金屬部份)MaximumFilletHeight(E)ShallNotExtendontotheComponentBody9-5.元件端與焊墊須重墊(J)Doc.No.:TMQA-0E-004Rev.:0EfectiveDate:2001/8/5Pge8of30FormNo.:ACM0-01-001-01(010807)8EndOverlap(J)允收(Acceptable)：J0拒收(NonconformingDefect)：J≦0十、城堡型端子元件LeadlessChipCarrierswithCastellatedTerminations10-1城堡型端子對焊墊的偏移量(A)不可超過端子寬度(W)50%最佳(TargetCondition)：A≦0允收(Acceptable)：A≦５０%W拒收(NonconformingDefect)：A50%W10-2元件不允許有端偏移(B)Doc.No.:TMQA-0E-004Rev.:0EfectiveDate:2001/8/5Pge9of30FormNo.:ACM0-01-001-01(010807)9允收(Acceptable)：B≦0拒收(NonconformingDefect)：B010-3端焊點寬度(C)不可小於城堡型端子寬度(W)的50%最佳(TargetCondition)：C＝W允收(Acceptable)：C≧５０%W拒收(NonconformingDefect)：C＜50%W10-4焊點長度(D)必須大於50%填錫高度(F)允收(Acceptable)：D≧50%F拒收(NonconformingDefect)：D﹤50%FDoc.No.:TMQA-0E-004Rev.:0EfectiveDate:2001/8/5Pge10of30FormNo.:ACM0-01-001-01(010807)1010-5填錫高度(F)須大於錫厚(G)加上25%的城堡型端子高度允收(Acceptable)：F≧G+25%H拒收(NonconformingDefect)：F﹤G+25%H十一、平坦式L型腳及海鷗腳FlatRibbon“L”andGullWingLeads11-1.元件腳與焊墊的側偏移量(A)SideOverhang(A)最佳(TargetCondition)：A≦0允收(Acceptable)：A≦50%W且A≦0.5mm拒收(NonconformingDefect)：A50%W或A0.5mmDoc.No.:TMQA-0E-004Rev.:0EfectiveDate:2001/8/5Pge11of30FormNo.:ACM0-01-001-01(010807)1111-2.元件腳突出偏移(B)不可超過焊墊ToeOverhang(B)ShellNotVioletMinimumConductorSpacing允收(Acceptable)：B≦0拒收(NonconformingDefect)：B011-3.元件腳端的焊點寬度(C)不可小於元件腳寬度(W)的50%MinimumEndJointWidth(C)最佳(TargetCondition)：C≧W允收(Acceptable)：C≧50%WDoc.No.:TMQA-0E-004Rev.:0EfectiveDate:2001/8/5Pge12of30FormNo.:ACM0-01-001-01(010807)12拒收(NonconformingDefect)：C50%W11-4.焊點長度(D)不可小於元件腳寬度(W)MinimumSideJointLength允收(Acceptable)：D≧W拒收(NonconformingDefect)：DW11-5.最大填錫高度：MaximumFilletHeighta.高外形元件(QFPs-quadflatpackage、SOLs-smalloutlinelarge?)填錫不可接觸本體HighProfileDevices，TheSolderMustNotTouchthePackageBodyb.低外形元件(SOICs-smalloutlineintegratedcircuit、Doc.No.:TMQA-0E-004Rev.:0EfectiveDate:2001/8/5Pge13of30FormNo.:ACM0-01-001-01(010807)13SOTs-smalloutlinetransistors)填錫可接觸本體，但不可過量LowProfileDevices，TheSolderManyExtendUndertheBody11-6.填錫高度(F)不可低於元件腳端錫厚(G)加元件腳厚度(T)的50%MinimumFilletHeight(F)允收(Acceptable)：F≧G+50%T拒收(NonconformingDefect)：FG+50%T12、圓型腳或扁平腳12-1元件腳側移(A)不可大於元件腳寬度(W)的50%或焊墊寬度(P)的50%最佳(TargetCondition)：A≦0允收(Acceptable)：A≦50%W且A≦50%P拒收(NonconformingDefect)：A﹥50%W或A﹥50%PDoc.No.:TMQA-0E-004Rev.:0EfectiveDate:2001/8/5Pge14of30FormNo.:ACM0-01-0