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1深圳根颗电子培训教材2一.系統文件類二.部門組織類三.生產工站類四.零件認識類五.品質管理類3•ISO(InternationalStandardOrganization)國際標準化組織•ES(EngineeringStandard)工程標準•IWS(InternationalWorkmanStandard)工藝標準•GS(GeneralSpecification)一般規格•SIP(StandardInspectionProcedure)標准檢驗規范•SOP(StandardOperationProcedure)製造作業規範一.系統文件類4•IS(InspectionSpecification)成品檢驗規範•POP(packingoperationprocedure)包裝操作規范•BOM(BillOfMaterial)物料清單•PS(PackageSpecification)包裝規範•SPEC(Specification)規格•DWG(Drawing)圖面•SWR(SpecialWorkRequest)特殊工作需求•APP(Approve)核準,認可,承認•CHK(Check)確認一.系統文件類5•ECO(EngineeringChangeOrder)工程改動要求•PCN(ProcessChangeNotice)工序改動通知•PMP(ProductManagementPlan)生產管制計劃•CAR(CorrectionActionReport)改善報告•TPM(TotalProductionMaintenance)全面生產保養•MRP(MaterialRequirementPlanning)物料需計劃•OS(OperationSystem)作業系統•SSQA(standardizedsupplierqualityaudit)合格供應商品質評估一.系統文件類6•AVL(acceptablevendorlist)允許的供應商清單•PDCS(processdefectcontactsheet)制程異常聯絡單•E(D)CN(Engineering(Design)changenotice)工程(設計)變更通知•KPI(Keyperformanceindex)主要績效指標一.系統文件類7•DC(DocumentCenter)資料中心•DCC(documentcontrolcenter)文件管理中心•DesignCenter設計中心•PCC(Productcontrolcenter)生產管制中心•PMC(Production&MaterialControl)生產和物料控制•PPC(ProductionPlanControl)生產計劃控制二.部門組織類8•SCM(supplychainmanagement)供應鏈•MCMaterialControl物料控制•QCC(QualityControlCircle)品質圈•QIT(QualityImprovementTeam)品質改善小組•MFG(manufacturing)制造單位•ManufacturingDept=MD制造部二.部門組織類9•PD(ProductDepartment)生產部•LogisticalDept物流部•PurchasingDept采購部•CostManagementDept經管•MaterialControlDept物管•PersonnelDept人事部•EngineeringStandardDept工標部•QualityAssuranceDept品保部•R&D(Research&Design)設計開發部二.部門組織類10•DeliveryControlCenter交管•PlanningDept企劃部•Administration/GeneralAffairsDept總務部•PM(projectmanagement)專案管控•LAB(Laboratory)實驗室•QE(QualityEngineering)品質工程(部)•QA(QualityAssurance)品質保證(處)二.部門組織類11•QC(QualityControl)品質管制(課)•IE(IndustrialEngineering)工業工程•ME(manufactureengineering)制造工程•PE(PRODUCTSENGINEERING)產品工程•TE(TESTENGINEERING)測試工程•EE(ELECTRONICSENGINEERING)電子工程二.部門組織類12•Computer電腦•ConsumerElectronics消費性電子產品•Communication通訊類電子產品•OEM(OriginalEquipmentManufacture)原設備製造•PCPersonalComputer個人電腦•5WIHWhen,Where,Who,What,Why,Howto三.生產工站類13•6MMan,Machine,Material,Method,Measurement,Message•4MTH(Man,Material,Money,Method,Time,How)人力,物力,財務,技術,時間(資源)•CP(capabilityindex)能力指數•CPK(capabilityprocessindex)製程能力參數•FMEA(failuremodeleffectivenessanalysis)失效模式分析三.生產工站類14•SMT(surfacemounttechnology)表面貼片技朮•PTH(PlateThroughhole)镀层穿孔(手插件)•PCBA(PrintingcircuitboardAssembly)組裝印刷電路板•PO(PurchasingOrder)采購訂單•MO(ManufactureOrder)生產單三.生產工站類15•PC#(productcode)產品編碼•MM#(materialmasternumber)主件料號•AA#(alteredassemblynumber)成品料號•PBA#(printedboardassemblynumber)半成品料號•PPID(ProductpartIdentification)產品料號識別碼•L/N(LotNumber)批號•P/N(PartNumber)料號•N/A(NotApplicable)不適用三.生產工站類16•S/N(serialnumber)序列號•CHK(check)檢查•SEPC(specification)規格•ID:(Identify)鉴别号码•Barcode條碼•barcodescanner條碼掃描器•WDR(WeeklyDeliveryRequirement)周出貨要求•PPM(PercentPerMillion)百萬分之一三.生產工站類17•PCs(Pieces)個(根,塊等)•PRS(Pairs)雙(對等)•CTN(Carton)卡通箱•PAL(Pallet/skid)棧板•D/C(DateCode)生產日期碼•ID/C(IdentificationCode)(供應商)識別碼•QTY(Quantity)數量•I/O(input/output)輸入/輸出•Flux助焊劑•Cleaningsolvent清潔劑•Cleaningpaper擦拭紙•Handsolder烙鐵三.生產工站類18•SolderPaste錫膏Feeder供料器•Stencil鋼網Nozzle吸嘴•PAD焊垫Squeegee刮刀•PinterMachine錫膏印刷機器•BufferLoader收板機•Material物料•MountingMachine貼片機器•REFLOWMachine回流焊爐•Profile回焊溫度曲線圖三.生產工站類19•AOI(automaticopticalinspection)自動光學檢測•W/S(wavesolder)波峰焊•ICT(incircuittest)線路測試•IFT(integratefunctiontest)功能測試•FCT(FunctioncheckTest)功能測試•SMD(SurfaceMountingDevice)貼裝設備•BGAReworkStationBGA維修站三.生產工站類20•MSD(moisturesensitivedevice)濕度敏感元件•SMC(SurfaceMountComponent)表面貼裝元件•SMD(SurfaceMountDevice)表面帖裝元器件•Leads元件腳•Terminations端頭腳件•PassiveComponent無源器件•ActiveComponent有源器件四.零件認識類21•BIOS:(BasicInputOutputSystem)基本输入输出系统•CMOS:(ComplementaryMetal-Oxide-SemiconductorTransistor)互补型金属氧化物半导体•Core鐵芯•CPU:(CentralProcessingUnit)中央处理器•DMA:(DirectMemoryAccess)直接記憶體存取•IC:(IntegratedCircuit)集成電路四.零件認識類22•SPS(Switchingpowersupply)電源箱•AGP(AcceleratedGraphicPort)加速图形端口•FDD(FloppyDiskDrive)軟式磁碟机•HDD(HardDiskDrive)硬盘驱动器•NorthBridge北橋•SouthBridge南橋四.零件認識類23•IDE:(IntegratedDriveElectronics)集成电路设备,智能磁盘设备•LAN:(LocalAreaNetwork)网络,局域网,本地网•MOSFET:(Metal-OxideSemiconductorFieldEffectTransistor)金属氧化物半导体场效应晶体管•PCI:(PeripheralComponentExtendedInterface)周边元件扩展接口•SCSI:(SmallComputerSystemInterface)小计算机系统的界面四.零件認識類24•USB:(UniversalSerialBus)通用串行總線•SDRAM:(SynchronousDynamicRandomAccessMemory)同步动态随机存取存储器•KEYBOARD鍵盤CABLELINE排線•HEADER頭/排針JACK插頭•CABLE電纜/排線TUNER調頻器四.零件認識類25–Pin=I/O(Input/Output)輸入/輸出四.零件認識類26PCBPrintedCircuitBoard印刷電路板四.零件認識類27Networkresistor排阻Resistor電阻四.零件認識類28Capacitor電容Networkcapacitor排容四.零件認識類29TANTALUMCAPACITOR鉭質電容器INDUCTOR電感四.零件認識類30Fuse保險絲Light-emittingdiode發光二極體四.零件認識類31電晶體transistor四.零件認識類32•Crystal(石英晶體)•Diode(二極管)•Switch(開關)•MELF(金屬電极表面連接元件)四.零件認識類33QuadflatpackageQFP四方扁平封裝SmalloutlinePackageSop小輪廓封裝四.零件認識類34PLCCPlasticLeadedchipcarrier塑膠晶片載體BGABallgridarray球形陳列封裝四.零件認識類35•QC(qualitycontrol)品質管理人員•FQC(finalqualitycontrol)終點品質管制人員•IPQC(inprocessqualitycontrol)制程中的品質管制人員•OQC(outputqualitycontrol)最終出貨品質管制人員•IQC(incomingqualitycontrol)進料品質管制人員•TQC(totalqualityco
本文标题:工厂中SMT制程段生产中常用英文(整理版)
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