焊锡膏基础知识和SMT应用工艺

FredKeTechnicalserviceAssistantManagerEunowElectronicMaterials(Suzhou)Co.,Ltd(0086)-512-66076290Ext:[e-mail]MTImplementationProcess焊锡膏基础知识和焊锡膏基础知识和焊锡膏基础知识和焊锡膏基础知识和SMT应用工艺应用工艺应用工艺应用工艺SolderPasteandSMTImplementationProcess焊锡膏基础知识和SMT应用工艺BasicofSolderPaste/焊锡膏基础知识1.FundamentalsofSoldering/锡焊原理2.SolderPasteConstituents/焊锡膏成分3.QCtestofSolderPasteAttributes/焊锡膏特性的测试方法SMTImplementationProcess/SMT应用工艺4.Talkaboutprintingprocess/浅谈印刷工艺5.ReflowOperations/炉温曲线的设定6.SMTTroubleshooting/SMT常见问题的处理Section1:FundamentalsofSoldering第一章节:锡焊原理1.Solder/焊料2.Flux/助焊剂3.Heat/热能Solder/焊料•Solderisanalloyof2ormoremetals/通常焊料是由两种或两种以上的金属合金组成的•Solderingisaprocessthatjoinstwometallicsurfaces/锡焊实际是两种金属的表面形成有效连接的过程•Temperaturestypicallybelow600°F(316°C)/温度通常低于华氏600度（摄氏316度）TypicalMetalsUsedinSolderAlloys通常焊料合金使用的金属•Tin(Sn)/锡•Silver(Ag)/银•Bismuth(Bi)/铋•Antimony(Sb)/锑•Lead(Pb)/铅•Copper(Cu)/铜•Indium(In)/铟•Zinc(Zn)/锌AlloyComposition/合金成分•Manydifferentelementscanbecombinedinanendlessnumberofcombinations./大多数不同的元素可以组成无限数量的化合物•Eachcombinationwillhaveitsownphysicalproperties./每种化合物都有其自己的物理特性•CommonPhysicalPropertiesusedtodistinguishsoldersare:/通常用于区分焊料的物理特有:–MeltingPoint/熔点–TensileStrength/拉伸强度–Elongation/延伸率–Electricalresistivity/电阻系数SOLDERALLOYMELTINGRANGESALLOYMELTINGRANGETIN-LEAD°F°CSn63Pb37361183Sn60Pb40361-374183-190Sn55Pb45361-397183-203Sn50Pb50361-420183-214Sn45Pb55361-440183-225Sn40Pb60361-460183-238Sn35Pb65361-477183-247Sn30Pb70361-496183-258Sn25Pb75361-514183-268Sn20Pb80361-536183-280Sn10Pb90514-576268-302Sn05Pb95574-597301-314LEAD-FREESn96.5Ag3.5430221Sn96Ag04430-444221-229Sn95Ag05430-473221-245100%Sn450232Sn95Sb05450-464232-240OTHERALLOYSSn62Pb36Ag02354-372179-189Sn60Pb36Ag04354-475179-246Sn10Pb88Ag02514-570268-299Sn05Pb93.5Ag1.5565-574296-301Sn05Pb92.5Ag2.5536280Sn43Pb43Bi14291-325144-163Flux/助焊剂•Fluxisusedtopreparemetallicsurfacestobesoldered/助焊剂通常是用于使金属表面形成有效的焊接•Fluxprovidesaheatstablemediumwhichfacilitatessolderingoperations/助焊剂提供了稳定的高温媒介便于焊接的进行•Threemainfunctions:/三个主要功能–Removesoxides/去除氧化物–Protectsthesurfacefromre-oxidation/防止焊料表面再次被氧化–Reducesthesurfacetensionofsolder/减小焊料表面张力BasicTypesofFluxes/助焊剂基本类型•Rosin/松香型•Resin/树脂型•OrganicAcid/有机酸型•InorganicAcid/无机酸型BasicTypesofFluxes/助焊剂基本类型FluxTypeSymbolFluxMaterialsofCompositionSymbolFluxActivityLevels(%Halide)FluxTypeALow(0%)L0BLow(0.5%)L1CModerate(0%)M0DModerate(0.5-2.0%)M1EHigh(0%)H0FRosinROHigh(2.0%)H1GLow(0%)L0HLow(0.5%)L1IModerate(0%)M0JModerate(0.5-2.0%)M1KHigh(0%)H0LResinREHigh(2.0%)H1MLow(0%)L0NLow(0.5%)L1PModerate(0%)M0QModerate(0.5-2.0%)M1RHigh(0%)H0SOrganicORHigh(2.0%)H1TLow(0%)L0ULow(0.5%)L1VModerate(0%)M0WModerate(0.5-2.0%)M1XHigh(0%)H0YInorganicINHigh(2.0%)H1Heat/热能•Heatisrequiredformanyreasons/需要热能有很多理由–Fluxesrequireheattobecomechemicallyactive/助焊剂需要热能来激发它的化学活性–Partstobesolderedrequireheatinorderforsoldertoweteffectively/零件焊接依赖于热能使焊料润湿–Solderalloyrequiresheattochangefromasolidphaseintoaliquidphase/焊料合金需要热能使之由固态到液态的转变HeatingMethods/加热方式Convection(HotAir)/对流（热风）Conduction(SolderingIron)/传导（锡浴）Radiation(IR)/辐射（红外线）Section2:SolderPasteConstituents第二章节：焊锡膏的成分•Powder/锡锡锡锡粉粉粉粉•FLUX/助助助助焊剂焊剂焊剂焊剂PowderClassification/锡粉分类ClassificationMeshSizeDiameter(microns)Type2-200/+32545-75Type3-325/+50025-45Type4-400/+50020-38Type515-30Type65-15Powderisclassifiedusingaseriesofscreens.Thetopscreenwillscreenoffthelargeoff-sizematerial.Thematerialthatflowsthroughitwillthenflowoverasmallerbottomscreen.Thebottomscreenwillallowthein-sizematerialtoflowoveritandscreenoutthefines./锡粉的分类使用了一系列的纱网。上面纱网阻挡了大于上纱网尺寸的锡粉。其余部分的锡粉穿过上面纱网,流动到下面的纱网。下面纱网将过滤掉更细的锡粉,大于下面纱网尺寸的锡粉的留在下面纱网之上。1inch1inch325holes325holes+325-325Type3(-325+500Mesh):PowderClassification/锡锡锡锡粉分粉分粉分粉分类类类类PowderDistributionGuideline/锡锡锡锡粉分配粉分配粉分配粉分配参参参参考考考考PitchApplicationUse≥50milType2≥16-20milFinePitchType3≤16-20milUltraFinePitchType410milMicroelectronicsandSpecialtyType5WaferBumpingType6PowderClassification/锡锡锡锡粉分粉分粉分粉分类类类类QCAttributes/质质质质量控制特性量控制特性量控制特性量控制特性ParticleShape/颗颗颗颗粒形粒形粒形粒形状状状状Spherical/球型球型球型球型Elliptical/椭圆型椭圆型椭圆型椭圆型TearDrop/眼泪型眼泪型眼泪型眼泪型DogBone/狗骨头型狗骨头型狗骨头型狗骨头型ConglomeratesFines/细粉聚合物型细粉聚合物型细粉聚合物型细粉聚合物型Ideal/理想的理想的理想的理想的Causecloggingandinconsistentviscosity./此类不规则此类不规则此类不规则此类不规则的锡粉是影响粘度和粘的锡粉是影响粘度和粘的锡粉是影响粘度和粘的锡粉是影响粘度和粘度不稳定的原因度不稳定的原因度不稳定的原因度不稳定的原因Causetinysolderballs/此此此此类锡类锡类锡类锡粉粉粉粉会会会会引起引起引起引起细细细细小的小的小的小的锡锡锡锡球球球球SolderPaste-FluxTypes焊锡膏-助焊剂类型•Rosin/松香型松香型松香型松香型–R(Non-ActivatedRosin)/R型型型型（（（（低活性松香低活性松香低活性松香低活性松香））））–RMA(MildlyActivatedRosin)/RMA型型型型（（（（中活性松香中活性松香中活性松香中活性松香））））–RA(ActivatedRosin)/RA型型型型（（（（高活性松香高活性松香高活性松香高活性松香））））•Resin/树脂型树脂型树脂型树脂型•OrganicAcid/有机酸型有机酸型有机酸型有机酸型•InorganicAcid/无机酸型无机酸型无机酸型无机酸型•其它其它其它其它–Watersoluble/水洗型水洗型水洗型水洗型–No-Clean/免洗型免洗型免洗型免洗型SolderPasteManufacture焊锡膏搅拌机Section3:QCtestofSolderPasteAttributes第三章节：焊锡膏特性的品质管控测试方法•Viscosity/粘度测试–Brookfield/–Malcom/•SolderballTest/锡球测试•SlumpTest/坍塌测试—IPCtestmethod/美国电子工业联接协会测试方法—JIStestmethod/日本工业协会测试方法Viscosity/粘度粘度粘度粘度测试测试测试测试BrookfieldMalcolmBrookfieldMalcolmSchematicDiagramofBrookfieldViscometerBrookfield粘度测试仪示意图2cmSchema