国内厚膜电子浆料的发展与应用

(国营4310厂　西安　710065):,20(:RSSTOLCRVESD),::TN4521,(DuPont)1802,,,,2000,100,200,80060,ESLEnglehardCermalleyFer-roEMCAHeraeusIBM20,,,80,,NECTDK,,:Birox17Birox17GBirox1800HS80Cerei-Gired9500Birox1900Rtty-orn7900D00X0A110XR-SXR-UR-600060,11,70,431043,,,,80,,4310:1998-06-22:1998-10-1443101969(1978)()Ag-PdAg-PtAg,197812,()80,()Ag-Pd1989()Ag-Pd19891990,4310,(SMM),()4310::R1300R2100R3100R4100R4800R5100;:Ag(C1001C1002C1003C1004C1005C1006)Ag-Pd(C1201C1203C1204C1205C1206C1207C1220)Ag-Pt(C1301)Au(C8002);:I4337I4338I4350I4311I4321I4322I4323I4385,,:R4500R2400R2800,,,,,,,1995,,,,2519992,,2,,,RS;;STOL(shottime/termoverload);ESD(electro-staticdischarge);CRV(contactresistancevariation);RF(rotationallife)2.1R1300R1300(4310)R-GX,,RS:61M,10%:10010-6-1::C1204(Ag/Pd64/10)C120(Ag/Pd71/3)C1220(Ag/Pd50/25)C8002(Au):I4337()I4350();I4385()2.2R2100R2100R-SX,RS:0.110M,10%:10010-6-1(41M)STOL(R/R):1%(2.5V,5s)ESD(R/R):1%;4%(110k)::C1206(AgPd5%)C1207(AgPd1%)C1002(Ag):C1003(Ag):1GI4311();2GI4321()I4322()MGI4323()2.3R3100R3100,RS:101M,10%:10010-6-1CRV(R/R):1%RF(R/R):2%(200)(R/R):1%:C1301(AgPt2%)C1206(AgPd5%)2.4R4100R4100()RS:10k10M,15%:+15010-6-1,-25010-6-1:400V/mm(R/R):0.3%(1h);1%(100h)::C1201(Ag/Pd70/20)C1204(Ag/Pd64/10)C1205(AgPd71/3):I4337()2.5R4800R4800/()R4100RS:100k5M,15%:15010-6-1:500V/mm(R/R):0.5%::C1201(Ag/Pd70/20)C1204(Ag/Pd64/10)C1205(Ag/Pd71/3):I4337()2.6R4500R4500RS:510M,10%:10010-6-1;15010-6-1(5);20010-6-1(10M)::C3500(Ag/Pd80/20)C2010(Ag/Pd90/10)C2015(Ag/Pd85/15)2.7CR2400CR2400RS:101M,10%:10010-6-1;20010-6-1(101M)STOL(R/R):0.5%(2.5V,2s)::CRI7005(Ag/Pd95/5)CRI7008(Ag/Pd92/8):CRI7000(Ag):GM87002.8RP2800RP2800RS:101M26ELECTRONICCOMPONENTS&MATERIALSVol.18No.1:10010-6-1;15010-6-1(1M);20010-6-1(10)CRV(R/R):5%RF(R/R):10%:C6000(AgPt2%)2.9BIROX17BIROX17HIC,RS:101M,10%:5010-6-1(10010k);10010-6-1(10,100k1M)(R/R):0.5%(R/R):2.0%-1:AgPd61206134:9537();9507()2.10BIROX1900BIROX1900HIC,RS:101M,10%:10010-6-1(R/R):1%:AgPt61256134:9537();5704()2.11BIROX6000BIROX6000HIC(Cu)RS:101M,10%:10010-6-1;25010-6-1(1M)(R/R):1%::Cu6001AgPd6120:5032()2.12BIROX17GBIROX17GHICRS:101M,10%:5010-6-1(1001k);10010-6-1(10,10k1M)(R/R):0.5%(R/R):2.0%-1::Au5715()Au4119()Au9910()PtPdAu4596():Au5715()Au5715()Au9910(,)PtPdAu4596()::9537();9507():5704()2.13BIROX6800BIROX6800RS:101M,10%:10010-6-1(R/R):0.5%(R/R):2.0%-1::AgPd6120,Ag6160:C15420,C25430::9537():G15410,G25436,MG48662.14BIROX1800BIROX1800,,RS:1.51M,10%:5010-6-1(100);10010-6-1(10)CRV(R/R):0.6%RF(R/R):0.6%(R/R):1%:AgPt9770,Ag61602.15BIROX4700BIROX4700RS:1.51M,30%:10010-6-1(100);25010-6-1(10)CRV(R/R):0.6%RF(R/R):1%(R/R):2%:AgPt9770,Ag61602.16BIROX9500BIROX9500RS:10k5M,30%:25010-6-1(100k);40010-6-1(1M):::AgPd612061252.17110X2719992110XRS:100k1G,10%:10010-6-1;20010-6-1(100M);30010-6-1(1G):::AgPd7177T2.1800X0A00X0A,RS:0.0610M,20%:10010-6-1(1);40010-6-1(0.06)ESD(R/R,5kV):0.1%;1%(1k);3%(10k);0.2%(100k):::::C15426(AgPd0.5%)5424(AgPd2%)5422(Ag-Pd5%)C25402S(Ag)5430F()J3704()5450()C354265426A5429(Ag):G15415()G25436D(),MG4866J8813()J8818()J8825()5480()MG4866();J8826()J8814()2.19R-U(L)R-U(R-UL)(SMM)R-GXR-SX,HICRS:0.110M,5%:10010-6-1(4)15010-6-1(1)35010-6-1(0.1)STOL(R/R):1%ESD(R/R):1%:::::C1C-4100(AgPd0.5%)C-4101(AgPd1%)S-8100(Ag)C2C-4420(AgPd0.5%)C-4520(AgPd0.5%)S-8200(Ag)HIC:C-4900(Pd3-10%)C-4193(Pd0.5%)::G1I-9760A();G2I-9820()I-9822();MGI-9836()I-9838()HIC:I-9438()2.20R-6000R-6000RS:1.510M,10%:10010-6-1STOL(R/R):0.1%(1k)0.5%(4k,(1M)1%(10M)ESD(R/R):5.0%:::C1H-4566(Ag);C2H-4567(Ag):G1G-5238();G2G-5250();MGS-61171(),ESLEMCA,ESLHICEMCA,,(Ag),3,:(1)HIC(2),HICAu(3)(4)(5),(6)(7)(8),(9)(31)28ELECTRONICCOMPONENTS&MATERIALSVol.18No.1,SA-8000(SocialAccountibili-ty-8000)12,,,,,,,,,,,,,,,1321,,,,,,,,,,,,,,,,21(:)(28)(10)(11)4,,:(1),(2)(3)(4)(5)HIC,(6)(7),(8),,51,,..:,19892,,..:,19913,,..,1994;13(4):713　国营4320厂副总工程师,宏星西安电子浆料厂厂长。1989年毕业于电子科技大学电子材料与元件专业。近十年来,一直从事电子浆料的引进、科研、生产和销售工作。曾获陕西省科技进步奖,发表有关论文若干篇。(:)3119992ersuppliesforitscompactnessandhighefficiency.Theirtechnology,materialsandmarketareoneofthefocuses.(norefs.)Keywordsswitchpowersupplies,powerferrite,marketDevelopmentandapplicationofelectronicthick-filmpasteinChina.LiZhuXiaoAiwu(StateNo.4310Factory,Xi'an710065).ELECTRONICCOMPONENTS&MATERIALS(China),Vol.18,No.1,p.25-28,31(Jan.1999).InChinese.Themajorelectronicthick-filmpastemanufacturersarepresented.20pastecompositionspopularinChinaarelisted,includingtheirspecifica-tions(STOL,CRV,ESD,stability,etc.),usageandthepastecom-positionstomatchthem.Theweakpointsofthethick-filmpasteindus-tryinChinaareshown,andthesuggestionstoimprovearegiven.(3refs.)Keywordselectronicthick-filmpaste,TCR,resistancechangerate,stability.The21stcentury'selectroniccomponents.ZhangShiying(DongguanSouthElectronicCo.,Ltd.Dongguan511700)ELECTRONICCOMPONENTS&MATERIALS(China),Vol.18,No.1,p.29-31(Jan.1999).InChinese.Thetrendof21stcentury'selectroniccomponentsispresented.Tapedchipcomponents,specialandlargescaleproduction,finetechnologyandgreenproductswillbemorepopular.Thecomponentsproductionwilldevelopinaccordancewiththelawofknowledgeeconomy.(norefs.)Keywordselectroniccomp