高性能环氧树脂基体的发展

:1999-12-21焦剑蓝立文狄西岩(,710072)综述了高性能环氧树脂的制备方法和性能介绍了几种高性能的环氧树脂固化体系,新型的耐湿热性的环氧树脂,氰酸酯改性环氧树脂,液晶环氧树脂,双马来酰亚胺改性环氧树脂等环氧树脂性能制备改性1,,,,,,,,,[1],2[2],,22,(DDS),/DDS,,,(1)[3]DDS,,,,,DDSTGDDM(4,4-)1(DDS)H2NSO2NH2(BDAS)H2NOSO2ONH2A(BDAP)H2NOCCH3CH3ONH2(BDAO)H2NOOONH26FA(BDAF)H2NOCCF3CF3ONH2332000/21TGDDM固化剂吸湿量/%干态Tg/!湿态Tg/!∀Tg/!DDM3.322015169BDAS2.321115853BDAO1.720216339BDAP1.520416440BDAF1.320017030(2)SHELLEponHPT10611062[4,5],DDS,DDS10!,250~241!,16%~14%,:1061H2NCCH3CH3CCH3CH3NH21062H2NCH3CH3CCH3CH3CCH3CH3CH3CH3NH2(3),3M[3],:R1NHR2R2R4NHR3R3,,,DGEBADGEBF()100%95!,14%~22%[6]3,,[2,7]A,,,Shell(DGEIB,A),;,(DGEBF,B)(DGEBFDiMc,C)(DGEBFDiCl,D),,DGEBA,22树脂/环氧当量123DGEBA/175505050DGEBF/24550DGEBFDiMe/25750DGEBFDiCl/27050DDS44.643.845.8模量/GPa(25!)3.13.32.9Tg/!205187205204!,177!,3,(DGEPP,E),,,,(F),ShellA(G),,DDS,224!,[8](H),,,34212ZHANJIE2000/2DDS300!(I)ShellE103ls,,,DS235!TGDDM,,N,,,(TGBAP,J)(TGMBAP,K),,N,,33树脂TGDDMTGBAPTGBAPTGMBAP芴型环氧组份100100100100100固化剂HPT106153.8固化剂HPT106253.2DDS49.441.524.3Tg,!246249241239290吸湿率*/%5.73.62.11.42.8弯曲强度干态湿态强度/MPa138140140130124模量/GPa3.93.93.43.43.3强度**/MPa75.890979089.6模量**/GPa2.53.02.93.23.0*48h,**93!24,,,,,,LIN[9],,,,[10],,4,[11],,,,,,,,,,AEpon828,127!183!,42.87kV#mm-148.74kV#mm-1,0.03720.0319(1MHz),,[12]352000/24液晶基元化合物结构备注酯类OCH2XCOOXCH2OOCH2XCOOOCOXCH2OX为O,O(CH2)O,CH2O联苯类OCH2XRnRnXCH2On=2,3,4,6-甲基苯乙烯类OCH2XCCH3CHXCH2O亚甲胺类OCH2XNCHCHNXCH2OOCH2XCHNYNCHXCH2OOCH2XCCH3NNCCH3XCH2OY为:OCH2SO2560,80,,,,,,,,[13]:[13~15],,,,,,,1(BMI)1-∃-AG-80/DDS-%-5228-&-/-∀-BMI/DMA1,/5,,A36212ZHANJIE2000/2(DGEBA),,65环氧类型环氧质量分数/%最高固化温度/!热变形温度/!弯曲力学性能干态湿态强度/MPa模量/GPa断裂延伸率/%DGEBA56.82002961671473.446.2DGETBA71.62001921721253.583.6MY72047.7235237188733.032.16性能DGEBA/BADCyMY720/BADCyBADCyBMITGMDA/DDS介电常数(1MHz)3.13.32.93.54.1介电损耗角正切(1MHz)0.0130.0170.0050.0150.003,[16,17]A,,:NCOCCH3CH3OCH2CHOCH2,,6(BMI)(L),,,,BMI[18]:(1)BMI,BMI;(2)BMI,,Kerimid601,,,,150!Narmco805245CBMI,,,135~150!,,G1C160J#m-2,228!,775245C性能测试值拉伸强度/MPa57拉伸模量/GPa3.58断裂伸长率/%2.0弯曲强度/MPa122弯曲变形量/%3.7热变形温度/!204G1C/J#m-2160372000/27,,,,,,,,1,27(4):342,19993,1996(3):2638212ZHANJIE2000/24ShellChemicalCo,EponHPTcuringagent1061-M,Productdata,19885ShellChemicalCo,EponHPTcuringagent1062-M,Productdata,19886SchultzWJ,etal,PolymPreprAmChemSoc,1988(1):1367,,1996,(2):18JP051324629QinghuangLin,AlbertF.Lee.JournalofPolymerScience,PartB:PolymerPhysics.1997,35:236310,,1998(3):5911GarfagnaC,AmendolaE.CompositeStructures.1994,27:3712SuWFA..JournalofPolymerScience,PartA:PolymerChemistry.1993,31:3251131997,(8):314/1996,(6):2915JounaryPolymerScience,PartA:PolymerChemical.1997,35(15):3101161996,(3):117M.D.Poliks.JounaryPolymerScience,PartA:PolymerChemical.1994,32:220318,1997,DevelopmentsonadvancedepoxyresinsJiaoJianLanLiwenDiXiyan(ChemicalEngineeringDepartmentofNorthwestPolytechnicalUniversity,Xi∋an710072)AbstractAreviewwasgivenonpreparationandpropertiesofadvancedepoxyresins.Somenewtypeofcuringsystemsonadvancedepoxyresinwereintroduced,suchasepoxyresinscuredwithnewheatresistancecuringagent,epoxyresinswithexcellentheatandmoistureresistance,epoxyresinsmodifiedwithcyanateresin,liquidcrystallineepoxyresinandepoxyresinmodifiedwithbismaleimide.KeywordsEpoxyresinPropertyPreparationModify##合作启事1992,,,,,,::0752-28023652802025:0752-2803743:392000/2