LTCC工艺技术的重点发展与应用

LTCC(214233042)LTCC,LTCCLTCC,LTCCMCMLTCCLTCC()MCM1LTCC()HIC,,,,,,LTCC,,LTCC,,,LTCC,LTCCMCM-C,MCM-C,MCM-C,LTCC2LTCC2.1LTCCLTCC10%0.2%0.3%,,MCM-CMCM-C/D,55LTCCLTCC,525.4mm0.707(0.2%0.3%)=0.18mm0.27mm,LTCC/0.1mm50mLTCC10m,,,LTCC,LTCC(XY),,MCM-CMCM-C/DLTCC,LTCC,LTCC,,26220086JICHENGDIANLUTONGXUNVol.26No.2Jun.2008LTCC,:(1)(SCS,Self-ConstraintSinte2ring)LTCC,LTCC(UCS,UnconstraintSinte2ring),,LTCC(0.03%0.04%),Heraeus()HeraLock2000,(0.16%0.24%)0.03%,SCS,,MCM;(2)(PAS,PressureAssistantSintering)LTCCLTCC(DuPont951PT)LTCC,XY,LTCC,,ATVTechGmbHPHP-603-LTCC,25/PASMCM,LTCC0.01%0.008%,LTCC,;(3)(PLAS,Pressure-lessAssistantSintering)LTCC,DuPont,LTCCUCS,LTCCLTCC,,LTCCPLASLTCC0.1%0.05%,,,;(4)ESLTranferTape(),,LTCC,LTCCUCS,LTCC,LTCCESLTranferTape,96%Al2O3LTCC,430LTCC,LTCC,MCMMCM,,,LaminaCeramicsSarnoffLTCC-M(),(Kovar,Fe-Ni-Co)(CuMoCu),LTCC0.1%,40W/(mK)170W/(mK),LTCC2W/(mK)3W/(mK),MCM2.2MCM,LTCCMCMMCM,LTCC,LTCC,2262;,LTCC,,:(1)HIC,40015m(),3mil(75m),/75m;(2)CADCAMLTCC,,50m75m50m;(3)(SPE,ScreenPrintedEtching)HeraeusKQDu2PontFodel,SPE,LTCC30m50m25m3m5mKQLTCC,;FodelLTCC,LTCC,12.3LTCC,LTCC,3D-MCM,,MCMLTCCLTCC,LTCC,,LTCC1LTCC,:,;,;(,),LTCC,3262,LTCC,LTCC508010MPa150MPa,CLPL(,ColdLowPressureLamination),,LTCC,,,CLPL,3D2.4LTCCLTCC,,LTCCLTCC,,LTCC,,LTCCLTCCLTCC,LTCC2aLTCC,2bLTCC,,LTCC,,,,LTCC,,,,LTCC()LTCC,,4262,,3LTCC3.1LTCCLTCC:a)Q;b),;c),PCB;d),;e)(CTE),();f),;g),,,,;h),,,LTCCLTCCHTCCPCBFR4PTFE(,polytetrafluoroethylene)HTCC1500,,LTCC;FR4LTCC;PTFE,;LTCC,,LTCCLTCC,(GSMCDMA)WLAN()GPS()PDA(),80%,WLANLTCC,LTCCLCBALUN(-)VCO()VCO,LTCC,(),LTCCVCO,,VCO1/51/20VCO,GSMDCS()CDMAPDC()GPS,LTCCLCLTCC,MHz5.8GHzTDKNECAVXEpcosLTCC,;,LTCCLTCC,Midcom,LTCC;,LTCC,LTCC5262,T/R(/),LTCC,T/R3.2MCMMCM,MCM,MCM,MCMMCM,MCM,MCM;,MCM,(),;,MCM,I/O,,MCM,,PGA()BGA()IC,,,,MCMMCM(PGABGABGA),MCM,MCMI/OPGABGABGA(),,MCMLTCCMCM:a)LTCC(AuAg),;b)LTCC,,;c)LTCC,LTCC,LTCC;d)LTCCLTCCMCM(),CTE(),,LTCC,HTCC(),HTCCMCMMCMMCM,DIP()CLCC()QFP(),PGABGA;MCM,,;,MCM;,MCM,,,,,MCMPGABGA:(1)LTCCHTCC,PGA6262BGA,MCMBGAMCM,MCMI/OBGALTCCHTCCPGABGA;(2),,HTCCLTCC();(3)MCM,,MCM3D-MCM()1MCMPGABGA1MCMLTCCHTCCPGABGAPGABGA(mm)25.425.4101.6101.625.425.4101.6101.625.425.450.850.825.425.450.850.8(mm)20209494202094942020444420204444/62%85.6%62%85.6%62%75%62%75%(mm)412412412412(mm)//(/cm2)2.542.54//15.5,1.271.27//311.51.5//44.4,1.01.0//1002.542.54//15.52.542.54//15.5,1.51.5//44.410064002561000010040010010241500g5000g1500g5000g5000g10000g5000g10000g3.3LTCC,(,MEMS)1m,,50m,,,,LTCC,LTCC,LTCC,12(,3;,4),,LTCC,,LTCC(),(10100),;,LTCC,LTCC:a),;b),;c),;726234d)LTCC,5,5LTCC,2,200m,2LTCC100m,,500LTCC,(),()5LTCCLTCC,,,,LTCC,,,686LTCC7LTCC:LTCC,LTCC,82628LTCC:,,(LabonChip)4LTCC,IC,MCM,MCM,LTCC,,,,100mmSiCSemiconductorFPDWorld200710,,,100mmSiC,0.03/cm2,,23mm2,8090%;10mm2,3040%,,,75mm15/cm2,100mm30/cm2100mm5/cm2SiC9262