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260第4章SEED-DECxxxxFLASH烧写4.1SEED-DEC643Boot程序简介1.SEED-DEC643Boot程序功能简介:该Boot程序主要实现实验箱脱机实验的演示。它由以下几部分程序构成1)同步串口通讯程序2)实验演示程序2.SEED-DEC643Boot程序流程图NY数据处理数据处理NYNDSP初始化串口初始化发送握手信号接收串口数据判断串口状态通讯错误命令控制帧数据帧命令处理通讯错误处理Y2614.2FLASH烧写方法首先将03.ExamplesofProgram\0.5BOOT程序目录下的DTK643_boot文件夹拷贝到D盘根目录下。1.接仿真器,上电,仿真器接口与SEED-DEC643板上的J1相连。2.打开ccs,运行FlashBurn/FlashBurn.exe。3.在弹出FlashBurn的对话框中,选择Fils/open命令打开DTK643_boot文件夹下的DTK643_BOOT.cdd文件。4.当显示连接成功后,运行ProgramFlash,直至烧写完毕。262附录ASEED_DEC643硬件资源介绍A.1SEED-DEC643内存分配介绍TMS320C643的整个存储空间分配如下表所示:MemoryBlockDescriptionBlockSize(Bytes)HEXAddressRangeInternalRAM(L2)256K00000000~0003FFFFReserved768K00040000~000FFFFFReserved23M00100000~017FFFFFExternalMemoryInterfaceA(EMIFA)Registers256K01800000~0183FFFFL2Registers256K01840000~0187FFFFHPIRegisters256K01880000~018BFFFFMcBSP0Registers256K018C0000~018FFFFFReserved256K01900000~0193FFFFTimer0Registers256K01940000~0197FFFFTimer1Registers256K01980000~019BFFFFInterruptSelectorRegisters256K019C0000~019FFFFFEDMARAMandEDMARegisters256K01A00000~01A3FFFFReserved512K01A40000~01ABFFFFTimer2Registers256K01AC0000~01AFFFFFGP0Registers256K-4K01B00000~01B3EFFFDeviceConfigurationRegisters4K01B3F000~01B3FFFFI2C0DataandControlRegisters16K01B40000~01B43FFFReserved32K01B44000~01B4BFFFMcASP0ControlRegisters16K01B4C000~01B4FFFFReserved192K01B50000~01B7FFFFReserved256K01B80000~01BBFFFFEmulation256K01BC0000~01BFFFFFReserved256K01C00000~01C3FFFFReserved16K01C40000~01C43FFFVP1Control16K01C44000~01C47FFFVP2Control16K01C48000~01C4BFFFVICControl16K01C4C000~01C4FFFF263Reserved192K01C50000~01C7FFFFEMACControl4K01C80000~01C80FFFEMACWrapper8K01C81000~01C82FFFEWRAPRegisters2K01C83000~01C837FFMDIOControlRegisters2K01C83800~01C83FFFReserved3.5M01C84000~01FFFFFFQDMARegisters5202000000~02000033Reserved928M–5202000034~2FFFFFFFMcBSP0Data64M30000000~33FFFFFFReserved64M34000000~37FFFFFFReserved64M38000000~3BFFFFFFMcASP0Data1M3C000000–3C0FFFFFReserved64M-1M3C100000–3FFFFFFFReserved832M40000000–73FFFFFFReserved32M74000000–75FFFFFFReserved32M76000000–77FFFFFFVP1ChannelAData32M78000000–79FFFFFFVP1ChannelBData32M7A000000–7BFFFFFFVP2ChannelAData32M7C000000–7DFFFFFFVP2ChannelBData32M7E000000–7FFFFFFFEMIFACE0256M80000000–8FFFFFFFEMIFACE1256M90000000–9FFFFFFFEMIFACE2256MA0000000–AFFFFFFFEMIFACE3256MB0000000–BFFFFFFFReserved1GC0000000–FFFFFFFFMemoryBlockDescriptionBlockSize(Bytes)HEXAddressRangeInternalRAM(L2)256K00000000~0003FFFFReserved768K00040000~000FFFFFReserved23M00100000~017FFFFFExternalMemoryInterfaceA(EMIFA)Registers256K01800000~0183FFFFL2Registers256K01840000~0187FFFFHPIRegisters256K01880000~018BFFFFMcBSP0Registers256K018C0000~018FFFFFReserved256K01900000~0193FFFFTimer0Registers256K01940000~0197FFFFTimer1Registers256K01980000~019BFFFFInterruptSelectorRegisters256K019C0000~019FFFFFEDMARAMandEDMARegisters256K01A00000~01A3FFFFReserved512K01A40000~01ABFFFFTimer2Registers256K01AC0000~01AFFFFFGP0Registers256K-4K01B00000~01B3EFFFDeviceConfigurationRegisters4K01B3F000~01B3FFFF264I2C0DataandControlRegisters16K01B40000~01B43FFFReserved32K01B44000~01B4BFFFMcASP0ControlRegisters16K01B4C000~01B4FFFFReserved192K01B50000~01B7FFFFReserved256K01B80000~01BBFFFFEmulation256K01BC0000~01BFFFFFReserved256K01C00000~01C3FFFFReserved16K01C40000~01C43FFFVP1Control16K01C44000~01C47FFFVP2Control16K01C48000~01C4BFFFVICControl16K01C4C000~01C4FFFFReserved192K01C50000~01C7FFFFEMACControl4K01C80000~01C80FFFEMACWrapper8K01C81000~01C82FFFEWRAPRegisters2K01C83000~01C837FFMDIOControlRegisters2K01C83800~01C83FFFReserved3.5M01C84000~01FFFFFFQDMARegisters5202000000~02000033Reserved928M–5202000034~2FFFFFFFMcBSP0Data64M30000000~33FFFFFFReserved64M34000000~37FFFFFFReserved64M38000000~3BFFFFFFMcASP0Data1M3C000000–3C0FFFFFReserved64M-1M3C100000–3FFFFFFFReserved832M40000000–73FFFFFFReserved32M74000000–75FFFFFFReserved32M76000000–77FFFFFFVP1ChannelAData32M78000000–79FFFFFFVP1ChannelBData32M7A000000–7BFFFFFFVP2ChannelAData32M7C000000–7DFFFFFFVP2ChannelBData32M7E000000–7FFFFFFFEMIFACE0256M80000000–8FFFFFFFEMIFACE1256M90000000–9FFFFFFFEMIFACE2256MA0000000–AFFFFFFFEMIFACE3256MB0000000–BFFFFFFFReserved1GC0000000–FFFFFFFFDM643能直接与8/16/32/64-位存储器无缝接口,内部以字节进行编址(逻辑地址),外部存储器地址(物理地址),由EMIF根据所接口的存储器的宽度,自动对逻辑地址进行移位产生。SEED-DEC643在空间扩展了4M×64-位的SDRAM存储器,用于存储程序与数据。原理框图如下图所示:265SDRAM的工作时钟由’DM643的ECLKOUT1提供,与EMIF的工作时钟同频,可由生产时是否焊装配置电阻R110和R111(具体配置见2.2节)来选择时钟源为ECLKIN、或CPU时钟/4、或CPU时钟/6,昀高时钟频率为133MHz。在缺省配置时,配置电阻焊装成选择ECLKIN为其时钟源,即133MHz。SDRAM在子空间的具体定位为:0x80000000~0x81FFFFFF。在对SDRAM进行读/写访问前,需通过EMIF的控制寄存器CE0CTL将空间配置为32-位SDRAM存储器接口,及通过SDCTL、SDTIM、SDEXT等寄存器设置SDRAM的读/写时序和参数。有关SDRAM的读/写时序参看《MT48LC4M32BPGDataSheet》,SDRAM的具体参数设置参见相关的例子程序。A.1.1外扩Flash存储器SEED-DEC643在空间扩展了4M×8-位Flash存储器,用于保存固件、FPGA配置信息和其它的参数。4M×8-位Flash被映射到空间的低512K,并采用分页技术来完成对整个4M×8-位Flash的寻址,即将整个4M×8-位的Flash分成8个512K×8-位的页,页地址PA[21:19]由页地址寄存器DECPAGE产生(页地址寄存器位于CPLD中)。在对Flash进行读/写访问前,需要通过EMIF的控制寄存器CE1CTL将空间配置为16-位异步存储器接口,及读/写时序(建立时间、系统时间、保持时间等)。有关Flash存储器的详细说明参见《Am29LV033CDataSheet》,Flash的参数设置参见相关的例子程序。注意:由于在出厂时已经将FPGA配置信息及FPGA_loader信息已经烧写到Flash存储器的第0页,所以应确保在操作Flash存储器时不要写第0页!A.1.2FPGA状态/控制寄存器SEED-D
本文标题:93SEED-DTK643_v1.0实验手册_09年版_SEED-DEC_FLASH烧写
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