军用电子元器件的新发展

郦晓翔(南京电子技术研究所,江苏省南京市210039):电子元器件在未来商业和军事运用中都将起到十分重要的作用文中介绍了对未来武器装备发展影响较大的几项军用电子元器件科技发展情况,提出新概念理论是未来设计发展方向,介绍了集成电路以及碳化硅高温超导光纤等新材料在军事上的发展前景:军用电子元器件;集成电路;新材料:TN04收稿日期:2009-07-170引言,,,:(1~2),1,50%;(3~5),/1,90%;,1,50%,2,2,,()MEMS()ASIC()AI()IC(),1制信息权争夺,导致新一轮材料和元器件开发高潮,,,,,,,,SiCGaN10,SiGaAs,SiCGaN,GaAsSiCGaN,3;Sceptre;SiC-FET0.5GHz~10GHzSi,AlGaN/GaN-HFET2.5GHz~30GHzGaAs,SAR,2新概念设计实践受到广泛关注,,;,MEMS535820098InformatizationResearchVo.l35No.8Aug.2009,,,,,:,;,MEMSMEMS,MEMSMEMS,,RFMEMSMEMS,Lar-sonNguyen,MEMS,MEMS3大功率真空微波管仍是发展重点,SiC,EW()(),,,:a)TWT()(),,()b)()TWT,TWT,c)TWT,(),TWT,,TWTd)TWT,MPM()MPMMMIC(())TWT(EPC):MMIC,TWT4IC仍是未来国防科技发展的核心IC,10IC1)IC,IC(50W)(109,1012),,(),MCM()2)ASICASIC(DRAMROMEEPROM())I/O106~107,,ASIC()HDL(),,,,,,3)AIIC()620098AIIC,,,2017,1,ANN()IC4)ICIC,,,,ICIC5),IC,100MHz~1GHz/s;12bit~20bit6)IC,COTS(CommercialOf-fThe-Shelf),,,,,/,:5106rad(Si);4007)FPIC()FPIC,FPGA():;(ASIC);20128)IC,ASIC,,IC2012ASIC9)IC,ICIC,2~3,8~10,(MIL-SPEC)10)ICIC,IC,ICMEMS,;,5SiC(新材料碳化硅)和绝缘体上硅新工艺倍受关注/,,SiC,:6001000V1000A/cm2,:,(Si)SIMOX;,6高温超导器件在军事上应用,:()(),:,7358:HTS()(20MW~40MW)HTSFCL()HTS(SQUID)HTS(2K~4K);SMES()HTS2003,,//7光纤传感器在信息化战争中的重要作用受到特别关注,,,C4I,(),,;,,,,LAN();,,8结束语21,,,,,(),,:,,,;,,,,[1],,.[R].:,2004.[2].[J].,2004,6(10):1-6.郦晓翔(1975-),男,工程师,主要研究方向为机电一体化科技管理LatestDevelopmentofMilitaryElectronicComponentsLIXiaoxiang(NanjingResearchInstituteofElectronicsTechnology,Nanjing210039,China)Abstract:Electroniccomponentsplayavitalroleinfuturebusinessandmilitaryapplications.Inthispa-per,developmentsofseveralmilitaryelectroniccomponentsthathavesignificantinfluenceuponfutureweaponsystemsarediscussed.Itisproposedthatnew-concepttheorywillbeatrendoffuturecomponentdesign,andmajorprojectsonICandmilitaryprospectsofnewmaterials,suchasSiC,HTSandfibre,aredescribedinde-tai.lKeywords:militaryelectroniccomponen;tIC;newmaterial820098