电火花加工钛合金微小孔的工艺研究

上海交通大学硕士学位论文电火花加工钛合金微小孔的工艺研究姓名：郭洪勤申请学位级别：硕士专业：机械工程指导教师：裴景玉;李五一20051201I12RmaxRa34IIRESEARCHONEDMOFTITANIUMMICROHOLEABSTRACTThisworkisunitedresearchofindustryanduniversity.ThestudyfocusesonEDMofmicrohole,especiallyontitanium,whichiswidelyusedinspaceindustry.TheprocessmodelforEDMoftitaniummicroholeisbuiltandrevisedbytestdata.ThemodelcanpredicttheEDMperformanceaccuratelycomparedtothetestdata.ThetheoreticalandexperimentalanalysishavebeendoneforEDMoftitaniummicroholeasfollowing:1)Baseoncurrentresearch,thephysicalpropertyoftitaniumisanalyzedforinfluenceonEDMprocess.Especiallytwoofthemostimportantfactor,innerroughnessanddischargegap,areanalyzed.2)AccordingtoprocesstheoryofEDM,therootcauseofmicroup-downoninnersurfaceisanalyzed.Themodelandequationforinnerroughnessisbuiltbaseonsuchtheory.Afterrevisingbytestdata,themodelcanpredicttheroughnessofRmaxandRaaccuratelyinnormalrangeofprocessparameters.3)Thestudyofdischargegapisbaseonexperienceequation,whichiswidelyusedincurrentEDMresearch.Theequationisupdatedbaseonrequirementofproduction.AfterbunchofEDMprocessexperimentanddataanalysis,thevoltageofpulse,whichcannotbeadjustedinEDMprocess,isdeletedfromthemodel.Justtwoinputparameters,pulsecurrentandpulsewidthareincludedinthemodelinput.Comparetotestdata,themodelcanpredictthedischargegapaccuratelyandexpediently.4)ForEDMofspecialhole,theprocessofmini-micro-hole(diameterlessthan0.2mm)andtwice-EDMprocessisanalyzedbytheoryandexperiment.Additionally,theotherfactors,suchasstressremainingoninnersurfaceisanalyzedforinfluenceofmanufactureresult.KEYWORDSEDM,Microhole,titaniummaterial2006151[1]60[2]ElectricalDischargeMachiningEDM2040[3]19432[4-7]Ra0.06µmEDM0.1µm0.5µm0.5µmRa0.01µmEDM0.005mm0.015mm0.5µm1µm360[8]1985WireElectrodeDischargeGrindingWEDG[9]Fig.1-1wireelectrodedischargegrinding1-1904[10][11-13][14][15-17][18][19][20]1-226x30x90mm0.10.5mm0.7µm1mm0.1mmFig.1-2Principleofdrivetheelectrodebyusinginchwormmechanism13231-38X9X28mm0.02µm512341-420X60X72mm1.2µm1mmFig.1-4StructureofaminiaturizedEDMdevicewithellipticalmovementmechanism1423562.5µm5µm[21]1-5a19970.5mm0.2mm0.2mm[22]1-5b1996[23,24]1.2mm0.2mm0.1mm1999150µm2.5µm[25]1998UNLOptimation81120µm[26]1-5c[27][26]1-5dFig.1-5productsdrilledbymicro-EDM20907[28]1-6Fig.1-6multi-sensordatafusionsystem[29-30]10501-70.15mm8(a)Fig.1-7InfluenceofultrasonicvibrationtotheEDMprocess1-891-9Fig.1-9Structureofapairofholes10:10.21.02mm233.24[31]123456112608(electronbeammachining)photochemicalmachiningelectrochemicalmicromachininglasermachining[32]1110.002m10234[33]1212345614Fig.2-1Structureofapairofholes12345672-1136,[34]151231[30]12320.05mm160.030.08mm3452-12-1[8536]))/((KgJ⋅))/((KcmW⋅r)/(cmgrca=s——17116803535231232-2Fig.2-2SurfaceconfigurationaftermanyimpulsionsRmaxR)cos1(*maxq-=RR2-118[37]33.022)(-=srMdCTKR2-2C——))/((KgJ⋅r——)/(3cmgs——S/mTM——KKd——[34]3.04.0RmaxkmtIKR=2-3D——µmIm——Atk——µsKR——KR2.3[34]3-12-22-1)cos1(*)(33.022maxqsr-=-MdCTKR2-4qq020(1-cosq)%6%1000cos1)20cos1()0cos1(=•°-°--°-(1-cosq)K02-433.0220max)(-=srMdCTKKR2-52-32-5*0KKR=33.022)(-srMCTK33.022)(-srMCT2-1KK19[]733.02521072.2)1062.015356959.7--×××××=K[]733.02521028.2))101.1(16803.54455.4--×××××=K3-1KRKKR1KR21R2K⋅=KKKRKR12.3K2.7210-7K2.2810-7KR293.13.21072.21028.2772=×⋅=--xxKRKR2=1.932-33.04.0max93.1kmtIR*=2-62-6KR1q1.93[34]mmciuSWKuKS++=4.0(2-7)S——(µm)ui——VKu——5X10-2KuKc——2.5X102Wm——J20Sm——3µmWmkmimtIuW**=2-82-82-7mkmiciuStIuKuKS++=4.0)(2-9tkImuiSm3µmKuKc2-3Fig.2-3Sidewearofelectrodeabch1h2h3hh21qq[34]camcmacaKKtfWKtfWKqq===********jjq2-11qaqcKaKcWmfjtLq[34]acLLLΔ=q2-12LqcLΔaLLqqacLSS•=qq2-13SaScqqKaKcq220.005mm2-4Fig.2-4erroramplificationA°==024.0)12005.0tan(acA2-5Fig.2-5drillpositionAhHtan*)(*2+=Δ2-10HhAHtan**21=Δ23Ahtan**22=Δ10.15mm510.75mmmm0006.0024.0tan*75.0*21≈°=Δ0.5mm1015mmmm004.0024.0tan*5*21≈°=Δ1.0mm10110mmmm009.0024.0tan*10*21≈°=Δ20.5mmmm0004.0024.0tan*5.0*22≈°=Δ1.0mmmm0008.0024.0tan*0.1*22≈°=Δ2.0mmmm0016.0024.0tan*0.2*23≈°=Δh0.4mmh1.0mmh24251Heun3-1Fig.3-1Machine26aXYZUVW0.002mm10b130A140sm140smcd.23-20.151.0mm0.05mm180.002mmRa0.432Fig.3-2Electrode33-327Fig.3-3Clampingofelectrode3-4Fig.3-4high-precisionholder0.002mm3-5abc28Fig.3-5structureofguide100mm0.01mm12mm0.0010.003mm436Fig.3-6Workpiece3729Fig.3-7Workpiece1Ra1.6Ra3.2Ra6.30.01µm0.002mm1.5mm0.15mm/s3839Fig.3-8surfaceofholebysection30Fig.3-9Roughnessapparatus30(Ra1.6Ra3.2Ra6.3)310Fig.3-10Lightmicroscope3120.15mm1.05mm0.002mm3-11Fig.3-11Measuringpin3.04.0max*kmRtIKR=3-1RK1.93RK3131320.30mm0.45mm0.85mm9A15s;15s;3mm;3-13-1RK473.1015993.13.04.0max≈××=Rs2.113215.11635.11857.10'max≈++=Rm07.1'maxmax≈RR06.293.1*06.1==RK3.04.0max*06.2kmtIR=3-23.04.0*26.0kmatIR=3-35Rmax20RaRmax/833320.7mm3.2.130Ra1.6Ra3.2Ra6.31331mm430I640s33Ra1.6Ra3.2Ra6.33-2IsRa1.61.6Ra1.63.2Ra3.2Ra6.3342323.26.3529A4A840s8s7x5353-33-2(s)I(A)353-31234A7101317s30221412Ras1.451.631.511.631.561.571.591.693-3Ra0.1m3233-43-43-53-53-43-53643636Ra5sIARa1.6Ra3.237Rmax3-2Rmax3-123-13Ra3-2Ra3-3ARmaxFig.3-12RaImdiagramFig.3-13Ratkdiagram38mkmiciuStIuKuKS++=4.0)(3-4Sm0.003ImtkiuImtkiuKuKciuiu60VImtk10.45mmKuKc20s15s616A1mm0.44